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    • 41. 发明专利
    • Lamp
    • JP2013152954A
    • 2013-08-08
    • JP2013090529
    • 2013-04-23
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • BETSUDA SOHIKOSUWA TAKUMIKONO HITOSHISAITO AKIKOBESSHO MAKOTOSHIBAHARA YUSUKETAMAI HIROKI
    • F21S2/00F21V29/02F21Y101/02H01L33/64
    • F21V29/67F21K9/232F21V29/83F21Y2115/10
    • PROBLEM TO BE SOLVED: To provide a lamp 11 that can improve radiation efficiency and suppressing temperature rise of an LED 22.SOLUTION: A radiator 13 includes a radiator through-hole 35 which penetrates from one end side to the other end side in a central position of a substrate fitting face 34, and in a substrate body 21, the other end side is arranged on the substrate fitting face 34 of the radiator 13 so that a substrate through-hole 23 penetrating from one end side to the other end side and the radiator through-hole 35 may be communicated at a central position. A fan 15 is provided rotatably in a space demarcated by the radiator 13 and a case 16, and an air flow is formed for flowing air outside of a lamp in a passage including at least the substrate through-hole 23 and the radiator through-hole 35 and thereby heat generated by the LED 22 and conducted to the radiator 13 through the substrate body 21 is radiated.
    • 要解决的问题:提供能够提高发光效率并抑制LED22的升温的灯11.解决方案散热器13包括散热器通孔35,该散热器通孔35从中心的一端侧到另一端侧 基板嵌合面34的位置,并且在基板主体21中,另一端侧配置在散热器13的基板嵌合面34上,使得从一端侧向另一端侧贯通的基板通孔23以及 散热器通孔35可以在中心位置连通。 风扇15可旋转地设置在由散热器13和壳体16划分的空间中,并且形成有用于在至少包括基板通孔23和散热器通孔的通道中使灯外的空气流动的空气流 从而由LED22产生的热量通过基板主体21传导到散热器13。
    • 44. 发明专利
    • Light emitting device and lighting apparatus having the same
    • 发光装置和具有该发光装置的照明装置
    • JP2012009780A
    • 2012-01-12
    • JP2010146732
    • 2010-06-28
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • KOYAIZU TSUYOSHITAKEI HARUKISAITO AKIKOKAWASHIMA KIYOKO
    • H01L33/00F21S8/08F21Y101/02H01L33/64
    • H01L2224/45H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/45169H01L2224/48137H01L2924/01015H01L2924/01047H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a light emitting device capable of suppressing breakage of a ceramic module substrate, while securing a heat radiation from the substrate to a module supporting member and ensuring predetermined electrical insulation.SOLUTION: A wiring pattern 26 and a plurality of semiconductor light emitting elements electrically connected to the pattern are provided on a ceramic module substrate 22 to form a light emitting module 21 for a light emitting device. The light emitting module 21 received in a recess part 12 of a supporting member 11 is held so as to be pressed to a bottom surface 12a of the recess part by a holding member 70 fixed on the supporting member 11. The wiring pattern 26 being proximate to a peripheral surface 22c of a substrate is provided at a predetermined creeping distance E from the peripheral surface. Sizes of the module substrate and the recess part are determined so that a predetermined insulating distance F between a contact part and the wiring pattern 26 can be ensured in a state where the light emitting module is moved to the maximum so that the wiring pattern 26 closes to the contact part that the module substrate comes into contact with the holding member.
    • 要解决的问题:提供一种能够抑制陶瓷模块基板的破坏的发光装置,同时确保从基板到模块支撑构件的热辐射并确保预定的电绝缘。 解决方案:在陶瓷模块基板22上设置布线图案26和电连接到图案的多个半导体发光元件,以形成用于发光器件的发光模块21。 容纳在支撑构件11的凹部12中的发光模块21通过固定在支撑构件11上的保持构件70被保持以被压到凹部的底面12a。布线图案26接近 相对于基板的周面22c以与外周面成规定的蠕变距离E设置。 确定模块基板和凹部的尺寸,使得能够在发光模块移动到最大的状态下确保接触部和布线图案26之间的预定绝缘距离F,使得布线图案26闭合 到模块基板与保持部件接触的接触部。 版权所有(C)2012,JPO&INPIT
    • 45. 发明专利
    • Light-emitting module, and lighting fixture equipped with this
    • 发光模块,以及与此配套的灯具
    • JP2012009396A
    • 2012-01-12
    • JP2010146730
    • 2010-06-28
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • KOYAIZU TAKESHITAKEI HARUKISAITO AKIKOKAWASHIMA KIYOKO
    • F21S8/08F21S2/00F21Y101/02H01L33/62
    • H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/45169H01L2224/48137H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide a light-emitting module capable of downsizing installation space of a semiconductor light-emitting element group and reducing the number of wiring patterns, as well as emitting light with a low applied voltage.SOLUTION: A second wiring pattern 26 is installed surrounding a first wiring pattern 25 on a module substrate 22 of a light-emitting module 21. The second wiring pattern 26 has a first wire connection part 26b and a second wire connection part 26d which form a first element installation space and a second element installation space at both sides of the wire connection part 25b. Light-emitting element rows 45R are electrically connected by bonding wires 47-49 to the first and the second wire connection parts and are installed in the first element installation space. Furthermore, the light-emitting element rows 45L are electrically connected by bonding wires 50-52 to the first and the second wire connection parts and installed in the second element installation space.
    • 要解决的问题:提供一种能够减小半导体发光元件组的安装空间并减少布线图案数量以及以低施加电压发光的发光模块。 解决方案:第二布线图案26安装在发光模块21的模块基板22上的第一布线图案25周围。第二布线图案26具有第一布线连接部26b和第二布线连接部26d 这在导线连接部分25b的两侧形成第一元件安装空间和第二元件安装空间。 发光元件列45R通过接合线47-49与第一和第二线连接部分电连接,并安装在第一元件安装空间中。 此外,发光元件列45L通过接合线50-52与第一和第二线连接部分电连接并安装在第二元件安装空间中。 版权所有(C)2012,JPO&INPIT
    • 46. 发明专利
    • Light-emitting module
    • 发光模块
    • JP2010205777A
    • 2010-09-16
    • JP2009046741
    • 2009-02-27
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • OTANI KIYOSHISAITO AKIKOIZUMI MASAHIROSANPEI TOMOHIROHAYASHIDA YUMIKOMURATA ATSUYA
    • H01L33/48
    • H01L2224/48137
    • PROBLEM TO BE SOLVED: To provide a light-emitting module in which LEDs are arranged with high density under a condition that a space in a direction of extending an LED array is restricted, which facilitates wire bonding, and prevents a bonding wire from being broken irrespective of expansion and contraction of a sealing member.
      SOLUTION: The respective LEDs 32 are arrayed in directions orthogonal to a direction in which the element electrodes 33, 34 get lined up, are arranged so that the element electrodes 33, 34 of the same polarity are adjacent in the extending direction of the array, and are fixed on the substrate. Bonding wires 37 are obliquely arranged between the adjacent LEDs 32, and the element electrodes 33, 34 of different polarities of the LEDs 32 are connected to each other. The LEDs 32 positioned on both ends of the LED array 31 and wiring conductors 14, 15 are connected with an end part bonding wire 41. The LED array 31 is sealed with the translucent sealing member.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:为了提供在LED阵列的延伸方向上的空间被限制的条件下以高密度布置LED的发光模块,这有助于引线接合,并且防止接合线 不管密封构件的膨胀和收缩如何都不会破裂。 解决方案:各个LED32沿着与元件电极33,34排列的方向正交的方向排列,以使相同极性的元件电极33,34在相同极性的延伸方向上相邻 阵列,并固定在基板上。 接合线37倾斜地布置在相邻的LED32之间,并且LED32的不同极性的元件电极33,34彼此连接。 位于LED阵列31的两端的LED32和布线导体14,15与端部接合线41连接。LED阵列31由半透明的密封部件密封。 版权所有(C)2010,JPO&INPIT
    • 48. 发明专利
    • Led module and led lighting equipment
    • LED模组和LED照明设备
    • JP2009044055A
    • 2009-02-26
    • JP2007209462
    • 2007-08-10
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • OTAKE HIROKAZUSHIMIZU KEIICHIMATSUNO SUSUMUSHIBANO NOBUOSAITO AKIKONISHIMURA KIYOSHIHIRAOKA TOSHIYUKIMARUYAMA TATSUO
    • F21S2/00F21S8/04F21Y101/02H01L33/00
    • PROBLEM TO BE SOLVED: To provide an LED module and an LED lighting equipment in which the connection between the LED modules is simple and can be performed easily.
      SOLUTION: The LED module comprises: a substrate 2; a light emitting diode 3; a pair of input terminals 4a and 4b which are provided in the substrate 2 and to which both end sides of the light emitting diode 3 are electrically connected, respectively; a pair of delivery terminals 5a and 5b which are provided in the substrate 2 and are electrically connected to a pair of the input terminals 4a and 4b, respectively; and first and second connection terminals 6a and 6b. The LED module is equipped with a delivery wiring terminal 6 which is provided in the substrate 2 so that, when the input terminal 4a in the side of a positive electrode and the first connection terminal 6a are connected to external DC power supply, the input terminal 4b in the side of a negative electrode and the second connection terminal 6b can be electrically connected to the input terminal 4a in the side of the positive electrode of a pair of the input terminals 4a and 4b and the first connection terminal 6a provided in another substrate 2.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供LED模块和LED照明设备,其中LED模块之间的连接是简单的并且可以容易地执行。 解决方案:LED模块包括:基板2; 发光二极管3; 一对输入端子4a和4b分别设置在基板2中并且发光二极管3的两端分别电连接到该输入端子4a和4b; 一对输送端子5a和5b,它们设置在基板2中并分别电连接到一对输入端子4a和4b; 以及第一和第二连接端子6a和6b。 LED模块配备有设置在基板2中的输送接线端子6,使得当正极侧的输入端子4a和第一连接端子6a与外部直流电源连接时,输入端子 4b,并且第二连接端子6b可以电连接到一对输入端子4a和4b的正极侧的输入端子4a和设置在另一个基板中的第一连接端子6a 2.版权所有(C)2009,JPO&INPIT
    • 49. 发明专利
    • Bulb type led lamp and illuminating device
    • BULB型LED灯和照明装置
    • JP2009037995A
    • 2009-02-19
    • JP2007223635
    • 2007-08-30
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • MORIKAWA KAZUTOTANAKA TOSHIYAOSAWA SHIGERUNISHIMURA KIYOSHIIZUMI MASAHIROSAITO AKIKO
    • F21S2/00F21V23/00F21V29/00F21Y101/02F21Y103/025H01L33/62H01L33/64
    • F21V3/0409F21K9/23F21S8/026F21V3/00F21Y2105/10F21Y2115/10H01L2224/48091H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide a bulb type LED lamp capable of effectively restraining temperature rise of an LED substrate and an illuminating device using the LED lamp.
      SOLUTION: The bulb type LED lamp 1 includes a metal holder 2 having a peripheral side face part 3 exposed outside and a light source mounting part 4 integrally formed inside the peripheral side face part 3, a base 7 fitted on a side opposite to the light source mounting part 4 of the holder, an LED substrate 12 having a metal substrate, an LED chip 11 fitted through an insulation adhesive layer on one side of the metal substrate, and a wiring pattern formed through an insulation layer on one side of the substrate, and a bonding wire connecting between the LED chip and the wiring pattern, and attached so as the other face side to have thermal conductivity with the light source mounting part 4, a translucent cover 9 mounted on one face side of the holder 2 covering the LED substrate 12, and a lighting circuit 20 having a circuit component 21b of the LED substrate 12 and fitted to the holder 2.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种能够有效地抑制LED基板的温度升高和使用该LED灯的照明装置的灯泡型LED灯。

      解决方案:灯泡型LED灯1包括具有暴露在外侧的周边侧面部3的金属保持件2和在周边侧面部3内一体形成的光源安装部4,安装在相反侧的一侧的基座7 到保持器的光源安装部分4,具有金属基板的LED基板12,通过金属基板的一侧上的绝缘粘合剂层配合的LED芯片11以及通过一侧的绝缘层形成的布线图案 以及连接在LED芯片和布线图案之间的接合线,并且作为另一个面侧安装以与光源安装部分4具有导热性;半透明盖9,安装在保持器的一个正面侧上 覆盖LED基板12的发光电路20和具有LED基板12的电路部件21b并配合到保持架2的点亮电路20.(C)2009,JPO&INPIT

    • 50. 发明专利
    • Lighting system, and luminaire
    • 照明系统和灯具
    • JP2009032650A
    • 2009-02-12
    • JP2007301804
    • 2007-11-21
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • NISHIMURA KIYOSHIMATSUNO SUSUMUOTAKE HIROKAZUMARUYAMA TATSUOSHIMIZU KEIICHIHIRAOKA TOSHIYUKISHIBANO NOBUOSAITO AKIKO
    • F21V29/00F21S8/04F21V19/00F21V23/00F21Y101/02H01L33/48
    • PROBLEM TO BE SOLVED: To provide a lighting system capable of improving electrical reliability of a power feed part by preventing heat generated from a light-emitting part from being thermally conducted and thermally transmitted to the power feed part; and a luminaire. SOLUTION: The lighting system is provided with: a board 2c having an electric insulation layer 2a and a circuit pattern layer 2b formed on one surface of the electric insulation layer 2a; a light-emitting part 2 having light-emitting diodes 2e electrically connected to the circuit pattern layer 2b of the board 2c, and a heat radiation layer 2i formed on the other surface of the electric insulation layer 2a, and formed with a heat conduction member having thermal conductivity higher than that of the electric insulation layer; the power feed part 4 having a power feed wire 5 fixed and directly connected thereto by a solder 6, and electrically connected to the circuit pattern layer 2b; and a board extension part 3 arranged between the light-emitting part 2 and the power feed part 4, being an example of a thermal separation means. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种能够通过防止从发光部产生的热量被传导并热传递到供电部来提高供电部的电可靠性的照明系统。 和灯具。 解决方案:照明系统设置有:具有形成在电绝缘层2a的一个表面上的电绝缘层2a和电路图案层2b的板2c; 具有电连接到电路板2c的电路图案层2b的发光二极管2e的发光部分2和形成在电绝缘层2a的另一个表面上的散热层2i,并且形成有导热部件 其导热率高于电绝缘层的导热率; 供电部4具有通过焊料6固定并直接连接的供电线5,并且电连接到电路图案层2b; 以及设置在发光部2和供​​电部4之间的板延伸部3,作为热分离机构的一例。 版权所有(C)2009,JPO&INPIT