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41. 发明授权

US08034660B2 PoP precursor with interposer for top package bond pad pitch compensation 有权
标题翻译： PoP前置体，具有内插器，用于顶部封装焊盘间距补偿
公开(公告)号：US08034660B2
公开(公告)日：2011-10-11
申请号：US12509012
申请日：2009-07-24
申请人： Yoshimi Takahashi
发明人： Yoshimi Takahashi
IPC分类号： H01L25/11
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/49827 , H01L24/13 , H01L24/48 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/06541 , H01L2225/06568 , H01L2225/1023 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer substrate has bottom metal land pads and top metal land pads, interposer vias, and an open receptacle region formed through the interposer substrate. The substrate top surface is positioned relative to the interposer so that the molded IC die is within the open receptacle region to align the bottom metal land pads and substrate contact pads. An underfill layer is between the substrate top surface and the bottom side of the interposer substrate. A step height from the mold cap height minus a height of the top metal land pads is generally from 0 to 0.2 mm.
摘要翻译：适于形成封装（PoP）封装（PoP）器件的电子组件包括：封装基板，其上具有模制的IC管芯，其限定模具盖高度，以及模制的IC管芯的侧面的衬底接触焊盘。包括插入器衬底的插入器具有底部金属焊盘和顶部金属焊盘，插入件过孔以及通过插入器基板形成的开放插座区域。衬底顶表面相对于插入件定位，使得模制的IC管芯位于开放的容置区域内，以对准底部金属焊盘和衬底接触焊盘。底部填充层位于衬底顶表面和内插衬底的底侧之间。从模盖高度减去顶部金属焊盘的高度的台阶高度通常为0至0.2mm。

42. 发明授权

US07520052B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07520052B2
公开(公告)日：2009-04-21
申请号：US11426622
申请日：2006-06-27
申请人： Yoshimi Takahashi , Masazumi Amagai
发明人： Yoshimi Takahashi , Masazumi Amagai
IPC分类号： H05K3/30
CPC分类号： H01L21/67126 , H01L21/561 , H01L21/566 , H01L23/3107 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49146 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.
摘要翻译：本发明的目的是提供一种制造半导体器件的方法，该半导体器件允许单独模制承载在衬底表面上的多个半导体芯片。它包括以下工艺步骤：在衬底100的表面上布置多个半导体元件102的工艺步骤; 其中衬底102的内侧固定在下模130上的工艺步骤; 其中液体树脂114从喷嘴112供应到每个半导体元件上以覆盖每个半导体芯片102的至少一部分的工艺步骤; 将具有形成在一个表面上的多个空腔144的上模压在下模上的处理步骤，并且液态树脂114通过多个空腔144在规定温度下成型; 以及上模140的空腔144与基板分离的工序，单独形成多个成形树脂部。

43. 发明申请

US20070080866A1 Antenna 失效
标题翻译：天线
公开(公告)号：US20070080866A1
公开(公告)日：2007-04-12
申请号：US11511621
申请日：2006-08-29
申请人： Masatoshi Hayakawa , Kiyotada Yokogi , Yoshimi Takahashi , Kenji Asakura , Shuichi Goto
发明人： Masatoshi Hayakawa , Kiyotada Yokogi , Yoshimi Takahashi , Kenji Asakura , Shuichi Goto
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0421 , H01Q3/44 , H01Q9/0442 , H01Q9/42
摘要： An antenna for receiving electromagnetic waves in a desired frequency band, includes a radiating conductor and a ground conductor, a feeder part, a wavelength-shortening section, and a magnetic field applying section. The radiating conductor and a ground conductor resonate at a resonance point frequency. The feeder part is configured to feed the radiating conductor with electricity. The wavelength-shortening section in which a magnetic body having both a dielectric property and a magnetic property is disposed close to the radiating conductor shifts the resonance point frequency into a band lower than the desired frequency band by a wavelength-shortening effect obtained based on the dielectric property and the magnetic property. The magnetic field applying section is configured to apply a magnetic field to the magnetic body so as to reduce a magnetic loss due to the magnetic body.
摘要翻译：用于接收期望频带的电磁波的天线包括辐射导体和接地导体，馈线部分，波长缩短部分和磁场施加部分。辐射导体和接地导体以谐振点频率谐振。馈电部分配置为向辐射导体供电。具有介电特性和磁特性两者的磁体配置在靠近辐射导体的波长缩短部分将谐振点频率移动到低于期望频带的频带内，该波段缩短部分基于介电性能和磁性能。磁场施加部构造为向磁体施加磁场，以减少由磁体引起的磁损耗。

44. 发明申请

US20060292753A1 Semiconductor Device and Method of Manufacturing a Semiconductor Device 有权
标题翻译：半导体装置及制造半导体装置的方法
公开(公告)号：US20060292753A1
公开(公告)日：2006-12-28
申请号：US11426622
申请日：2006-06-27
申请人： Yoshimi Takahashi , Masazumi Amagai
发明人： Yoshimi Takahashi , Masazumi Amagai
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L21/67126 , H01L21/561 , H01L21/566 , H01L23/3107 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49146 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.
摘要翻译：本发明的目的是提供一种制造半导体器件的方法，该半导体器件允许单独模制承载在衬底表面上的多个半导体芯片。它包括以下工艺步骤：在衬底100的表面上布置多个半导体元件102的工艺步骤; 其中衬底102的内侧固定在下模130上的工艺步骤; 其中液体树脂114从喷嘴112供应到每个半导体元件上以覆盖每个半导体芯片102的至少一部分的工艺步骤; 将具有形成在一个表面上的多个空腔144的上模压在下模上的处理步骤，并且液态树脂114通过多个空腔144在规定温度下成型; 以及上模140的空腔144与基板分离的工序，单独形成多个成形树脂部。

45. 发明授权

US07147447B1 Plastic semiconductor package having improved control of dimensions 有权
标题翻译：具有改进的尺寸控制的塑料半导体封装
公开(公告)号：US07147447B1
公开(公告)日：2006-12-12
申请号：US11190703
申请日：2005-07-27
申请人： Yoshimi Takahashi
发明人： Yoshimi Takahashi
IPC分类号： H01L21/56 , B29C45/14
CPC分类号： H01L21/566 , B29C43/18 , B29C43/36 , B29C2043/3626 , H01L21/565 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.
摘要翻译：一种具有半导体芯片（801）的装置，其组装在平面基板（802）上，并且封装化合物（810）围绕所述组装的芯片和所述基板的靠近所述芯片的部分; 化合物具有平坦的顶部区域（811）。封装化合物具有从基板到顶部区域到达的多个侧面区域（812）这些侧面区域形成具有顶部区域的边缘线，其中顶部区域平面与每个侧面区域的相应平面相交。封装化合物沿着边缘线凹进（813），使得材料沿着线被塌陷; 该特征使得凹部防止来自侧面平面的任何化合物到达顶部区域平面，由此保持顶部区域的平坦度。

46. 发明申请

US20060189803A1 Cyanine dye 失效
公开(公告)号：US20060189803A1
公开(公告)日：2006-08-24
申请号：US10565592
申请日：2004-07-21
申请人： Akira Shinpo , Yoshimi Takahashi , Kentaro Yano , Yasushi Aizawa
发明人： Akira Shinpo , Yoshimi Takahashi , Kentaro Yano , Yasushi Aizawa
IPC分类号： C07F1/08
CPC分类号： C09B69/06 , C09B23/00 , C09B23/0016 , C09B23/0066 , C09B23/086
摘要： An objective of this invention is to extend the range of choosing organic dye compounds as light-absorbing agent in a variety of fields of, for example, information storage, information display, solar energy generation, electric machinery apparatus, electric communicating apparatus, optical apparatus, cloth, building/bedding/decorating product, sanitary and health goods, and agricultural material by providing an organic dye compound which is superior in light-absorbing property, light resistance, and solubility in the near-infrared region: The objective is attainable by providing a cyanine dye that bears within the same molecule a plurality of cyanine dye skeletons bound to a divalent group(s) and an organometallic complex as counter ion, as well as substantially absorbing a light with a wavelength longer than 700 nm.

47. 发明申请

US20050196908A1 System and method for forming mold caps over integrated circuit devices 有权
标题翻译：用于在集成电路器件上形成模具帽的系统和方法
公开(公告)号：US20050196908A1
公开(公告)日：2005-09-08
申请号：US10791037
申请日：2004-03-02
申请人： Yoshimi Takahashi
发明人： Yoshimi Takahashi
IPC分类号： H01L21/44
CPC分类号： H01L21/561 , H01L21/565 , H01L24/97 , H01L2224/45144 , H01L2224/48227 , H01L2224/97 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A compression molding method for forming a mold cap over an integrated circuit structure is provided. A film is positioned adjacent a first die structure such that a mold block coupled to the film is located in a die cavity in the first die structure. The mold block comprises mold compound and at least substantially holding its own shape. An integrated circuit structure including one or more integrated circuit devices coupled to a substrate is positioned adjacent a second die structure. At least one of the first die structure and the second die structure is moved toward the other die structure to cause the integrated circuit structure to compress the mold block within the die cavity in order to form a mold cap covering at least one of the one or more integrated circuit devices.
摘要翻译：提供了一种用于在集成电路结构上形成模具盖的压缩模制方法。薄膜定位在第一模具结构附近，使得耦合到薄膜的模具块位于第一模具结构中的模腔中。模具块包括模具化合物并且至少基本上保持其自身的形状。包括耦合到衬底的一个或多个集成电路器件的集成电路结构位于第二管芯结构附近。第一模具结构和第二模具结构中的至少一个朝向另一个模具结构移动，以使集成电路结构压缩模具腔内的模具块，以形成覆盖至少一个模具盖更多的集成电路器件。

48. 发明授权

US5663981A Radio communication apparatus 失效
标题翻译：无线通信装置
公开(公告)号：US5663981A
公开(公告)日：1997-09-02
申请号：US423661
申请日：1995-04-17
申请人： Yoshimi Takahashi
发明人： Yoshimi Takahashi
IPC分类号： H04B1/707 , H04J13/16 , H04L7/00 , H04K1/00
CPC分类号： H04B1/707
摘要： The present invention relates to a radio communication apparatus for transmitting and receiving signals according to a modulation technique using the so-called flipper, and more particularly to a radio communication apparatus which can detect a flipper data element in a received signal, with simple configuration in the receiver's side. The invention further relates to a radio communication apparatus which can efficiently execute verification of an ID code also in the transmitter side, for instance, by verifying the ID code by checking for the flipper data element to determine whether it is included.
摘要翻译：本发明涉及一种根据使用所谓的引导器的调制技术来发送和接收信号的无线电通信装置，更具体地说，涉及一种无线通信装置，其能够以简单的配置在接收信号中检测引导器数据元素接收方。本发明还涉及一种无线电通信装置，其也可以在发送机侧有效地执行ID码的验证，例如，通过检查引导数据元素来确定是否包含ID码，来验证该ID码。

49. 发明授权

US5603272A Two-needle type sewing machine 失效
标题翻译：双针式缝纫机
公开(公告)号：US5603272A
公开(公告)日：1997-02-18
申请号：US487099
申请日：1995-06-07
申请人： Yoshimi Takahashi , Yasushi Kakizaki
发明人： Yoshimi Takahashi , Yasushi Kakizaki
IPC分类号： D05B19/12 , D05B65/02 , D05B1/08 , D05B65/00
CPC分类号： D05B65/02 , D05B19/12
摘要： A two-needle sewing machine includes first and second sewing needles for performing two stitching operations at the same time; a motor for driving the first and second sewing needles; first and second thread cutting mechanisms provided for the first and second sewing needles, respectively, for cutting threads at the ends of the stitching operations; a first actuator and a second actuator for driving respective ones of the first and second thread cutting mechanisms; and a thread cutting control circuit which stores data corresponding to the timing of a first thread cutting drive signal to the first actuator and the timing of a second thread cutting drive signal to the second actuator, both signals corresponding to rotational speeds of the motor, and which, according to the data and the rotational speeds of the motor, applies the first and second thread cutting drive signals to the first and second actuators at different times defined by the data.
摘要翻译：双针缝纫机包括同时执行两次缝合操作的第一和第二缝纫针; 用于驱动第一和第二缝纫针的电动机; 第一和第二线切割机构，分别设置在第一和第二缝纫针上，用于在缝合操作的端部切割螺纹; 第一致动器和用于驱动第一和第二螺纹切削机构中的相应螺纹切削机构的第二致动器; 以及螺纹切削控制电路，其将对应于第一螺纹切削驱动信号的定时的数据存储到第一致动器，并将第二螺纹切削驱动信号的定时存储到第二致动器，两个信号对应于马达的转速，以及根据电机的数据和转速，第一和第二螺纹切削驱动信号在由数据限定的不同时间施加到第一和第二致动器。

50. 发明授权

US5144900A Control device for sewing machine 失效
标题翻译：缝纫机控制装置
公开(公告)号：US5144900A
公开(公告)日：1992-09-08
申请号：US468858
申请日：1990-01-19
申请人： Yoshimi Takahashi
发明人： Yoshimi Takahashi
IPC分类号： D05B69/18 , D05B69/20 , D05B69/22
CPC分类号： D05B69/20 , D05B69/22
摘要： A control device for sewing machines which includes a drive system controller which controls each of numerous driving units provided in the sewing machine and which is connected to an optional command system controller that is positioned outside of the sewing machine. Thus, a control code from the outside command system may be input and decoded to control the drive system controller.
摘要翻译：一种缝纫机的控制装置，其特征在于，具备驱动系统控制器，所述驱动系统控制器控制设置在所述缝纫机中的各种驱动单元，所述驱动系统控制器与位于所述缝纫机外部的选择指令系统控制器连接。因此，可以输入和解码来自外部命令系统的控制代码，以控制驱动系统控制器。

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