专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明申请

US20100027216A1 Cooling Systems and Electronic Apparatus 有权
标题翻译：冷却系统和电子设备
公开(公告)号：US20100027216A1
公开(公告)日：2010-02-04
申请号：US12370651
申请日：2009-02-13
申请人： Hitoshi MATSUSHIMA , Hiroshi Fukuda , Tadakatsu Nakajima
发明人： Hitoshi MATSUSHIMA , Hiroshi Fukuda , Tadakatsu Nakajima
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/20745
摘要： Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.
摘要翻译：安装在数据中心的电子设备之间的温度变化减小，电子设备的可靠性提高，使用寿命延长，实现电子设备组的有效冷却。此外，提供了具有低噪声的电子设备。前盖设置在电子设备的前表面上，后盖设置在其后表面上。在前盖的下侧形成供气口，在后盖的上侧形成有排气开口。所供给的空气开口与地板下方的开口连通，排气口与天花板导风管连接。天花板风管设有热交换器，并且用外部空气进行间接热交换。

42. 发明授权

US06591620B2 Air conditioning equipment operation system and air conditioning equipment designing support system 失效
公开(公告)号：US06591620B2
公开(公告)日：2003-07-15
申请号：US10066667
申请日：2002-02-06
申请人： Hiroshige Kikuchi , Tadakatsu Nakajima , Keiji Sasao
发明人： Hiroshige Kikuchi , Tadakatsu Nakajima , Keiji Sasao
IPC分类号： F25B4900
CPC分类号： G06Q50/06 , F24F11/30 , F24F11/47 , F24F11/62 , F24F2130/00 , F24F2130/10
摘要： A control server includes a device information database storing device characteristic data constituting the air conditioning equipment, a fuel/power rate database storing price and rate data regarding gas, oil, power and the like, a device characteristic and price database, an air conditioning equipment simulator for calculating running costs by using the data stored in the fuel/power rate database, and communication portion for performing communications through a network. The control server, and an air conditioning management controller for managing and controlling the air conditioning equipment provided with the communication portion for performing communications through the network, are connected to the network. An operation plan is made by the control server, the operation plan is transmitted to the air conditioning equipment management controller for controlling the air conditioning equipment through the network, and the air conditioning equipment is controlled and operated according to the operation plan.

43. 发明授权

US06454177B1 Air-conditioning controlling system 有权
标题翻译：空调控制系统
公开(公告)号：US06454177B1
公开(公告)日：2002-09-24
申请号：US09801700
申请日：2001-03-09
申请人： Keiji Sasao , Tadakatsu Nakajima
发明人： Keiji Sasao , Tadakatsu Nakajima
IPC分类号： H02J100
CPC分类号： F24F11/30 , F24F6/18 , F24F11/54 , F24F11/62 , F24F2130/00 , F24F2130/10 , Y02P80/156 , Y10T307/469
摘要： An air-conditioning operation management company provides control information concerning air-conditioning equipments to a plurality of semiconductor manufacturing factories. The air-conditioning operation management company stores a measured result of an outside-air condition measuring unit in a past outside-air condition record database and obtains forecasted maximum temperature information on-that day from a weather forecast providing system. An outside-air condition transition forecasting unit forecasts all, transition of the outside-air condition on that day on the basis of the forecasted maximum temperature information. Information stored in an air-conditioning thermal load database, an air-conditioning equipment characteristic database and a set-temperature-and-humidity-of-air-conditioning-equipment database are employed to provide an optimum operation method of the air-conditioning equipments to the semiconductor manufacturing factories. Further, a forecasted result of an outside-air condition transition, an analyzed result of an air-conditioning thermal load and an analyzed result of a controlling method are displayed in customer terminals.
摘要翻译：空调运营管理公司向多个半导体制造工厂提供关于空调设备的控制信息。空调运营管理公司将外部空气状态测量单元的测量结果存储在过去的空中状态记录数据库中，并从天气预报提供系统获得当天预测的最高温度信息。外部空中转型预测单位根据预测的最高气温信息，预测当天的空中情况全部过渡。使用存储在空调热负荷数据库中的信息，空调设备特征数据库和空调设备温度设定数据库，以提供空调设备的最佳操作方法到半导体制造工厂。此外，在客户终端中显示外部空调状态转换的预测结果，空调热负荷的分析结果和控制方法的分析结果。

44. 发明授权

US4561497A Heat transfer surface and manufacturing method for same 失效
标题翻译：传热面及其制造方法相同
公开(公告)号：US4561497A
公开(公告)日：1985-12-31
申请号：US561070
申请日：1983-12-14
申请人： Tadakatsu Nakajima , Wataru Nakayama , Takahiro Daikoku , Heikichi Kuwahara , Akira Yasukawa , Katsuhiko Kasuya , Kazuaki Yokoi , Hideo Nakae , Hiromichi Yoshida
发明人： Tadakatsu Nakajima , Wataru Nakayama , Takahiro Daikoku , Heikichi Kuwahara , Akira Yasukawa , Katsuhiko Kasuya , Kazuaki Yokoi , Hideo Nakae , Hiromichi Yoshida
IPC分类号： F28F13/02 , F28F1/10 , F28F13/18
CPC分类号： F28F13/187 , Y10T29/49378
摘要： In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.
摘要翻译：在具有空腔组和外表面区域中的限制开口组的传热表面中，空腔组由多排空隙条构件组成。空腔条构件平行地布置在传热表面的基底构件上，并且层叠成一层或多层。每个带状构件具有横向布置成平行的多个细长空腔。细长的空腔在上表面封闭并且在两端开口。相同层中的相邻空腔通过各个设置在空腔条形构件之间的连通部分和开口彼此连通。限制的开口组形成在连通部的上表面上。受限制的开口组使一个层中的通信部分，另一层中的通信部分和外部彼此通信。还公开了制造这种传热表面的方法。

45. 发明授权

US08200995B2 Information processing system and power-save control method for use in the system 有权
标题翻译：信息处理系统和节电控制方法用于系统中
公开(公告)号：US08200995B2
公开(公告)日：2012-06-12
申请号：US12388710
申请日：2009-02-19
申请人： Yoko Shiga , Keisuke Hatasaki , Yoshifumi Takamoto , Takeshi Kato , Tadakatsu Nakajima
发明人： Yoko Shiga , Keisuke Hatasaki , Yoshifumi Takamoto , Takeshi Kato , Tadakatsu Nakajima
IPC分类号： G06F11/00
CPC分类号： G06F1/3203 , G05D23/1919 , G06F1/329 , G06F9/5027 , G06F9/5094 , Y02D10/22 , Y02D10/24 , Y02D50/20
摘要： A technique for determining task allocation for reducing power consumption of an entire system is disclosed. This system includes physical computers, a cooling apparatus for cooling the physical computers, and a power-saving control server for controlling the physical computers and cooling apparatus. The power-saving control server includes a virtual server layout generator which sets up a plurality of sets of task allocations with respect to the physical computers, a server power calculator for calculating power consumption of the physical computers in each task allocation, a physical computer profile used to estimate a heat release amount of the physical computers in each task allocation, a cooling power calculator which computes power consumption of the cooling apparatus, and a virtual server relocator which determines a task allocation with a total of calculated values of the server/cooling power calculators being minimized to be the optimum task allocation for the physical computers.
摘要翻译：公开了一种用于确定用于降低整个系统的功耗的任务分配的技术。该系统包括物理计算机，用于冷却物理计算机的冷却装置，以及用于控制物理计算机和冷却装置的节电控制服务器。节电控制服务器包括虚拟服务器布局生成器，其针对物理计算机设置多组任务分配，服务器功率计算器，用于计算每个任务分配中的物理计算机的功耗;物理计算机简档用于估计每个任务分配中的物理计算机的散热量，计算冷却装置的功率消耗的冷却功率计算器，以及用服务器/冷却的计算值的总计确定任务分配的虚拟服务器重定位器功率计算器被最小化为物理计算机的最佳任务分配。

46. 发明申请

US20110113273A1 OPERATION MANAGEMENT METHOD OF INFORMATION PROCESSING SYSTEM 有权
标题翻译：信息处理系统的操作管理方法
公开(公告)号：US20110113273A1
公开(公告)日：2011-05-12
申请号：US13003687
申请日：2009-03-09
申请人： Jun Okitsu , Takeshi Kato , Tatsuya Saito , Tadakatsu Nakajima
发明人： Jun Okitsu , Takeshi Kato , Tatsuya Saito , Tadakatsu Nakajima
IPC分类号： G06F1/32
CPC分类号： G06F1/206 , G06F1/3203 , G06F9/5027 , G06F9/5094 , Y02D10/16 , Y02D10/22
摘要： In a computer room including information processing devices and air conditioners, power saving of the computer room by means of optimization of workload allocation to the information processing devices is achieved in a short time. There, a coefficient of air conditioner performance with respect to the information processing device (device-specific COP) is calculated for each air conditioner. Further, a device-associated power consumption expression representing a total of device power and air conditioner power is created for each information processing device. Also, power consumption of the entire computer room is calculated from the device-associated power consumption expression of the information processing devices. Also, workload allocation is determined by using power saving performance evaluation indexes based on the device-associated power consumption expression of the information processing devices. Further, output of the air conditioner is controlled based on a result of the air conditioner power calculation.
摘要翻译：在包括信息处理装置和空调的计算机室中，通过优化在信息处理装置中的工作量分配来实现计算机室的省电在短时间内。在此，针对各空调器计算出相对于信息处理装置（装置专用COP）的空调机性能系数。此外，为每个信息处理设备创建表示设备功率和空调功率的总和的与设备相关联的功耗表达式。而且，根据信息处理设备的设备相关功耗表达式计算整个计算机房的功耗。此外，通过使用基于信息处理装置的与设备相关联的功耗表达式的节电性能评估指标来确定工作负荷分配。此外，基于空调机功率计算的结果来控制空调的输出。

47. 发明授权

US06701727B2 Apparatus and method for managing heat source unit for air conditioner 有权
标题翻译：用于管理空调的热源单元的设备和方法
公开(公告)号：US06701727B2
公开(公告)日：2004-03-09
申请号：US10268100
申请日：2002-10-10
申请人： Tomohiro Komatsu , Tadakatsu Nakajima , Akira Nishiguchi , Tatsuo Fujii , Masaru Noujyo , Kyoichi Sekiguchi , Kenji Machizawa , Yoshikazu Hanawa , Tomio Nakajima , Haruo Nashimoto
发明人： Tomohiro Komatsu , Tadakatsu Nakajima , Akira Nishiguchi , Tatsuo Fujii , Masaru Noujyo , Kyoichi Sekiguchi , Kenji Machizawa , Yoshikazu Hanawa , Tomio Nakajima , Haruo Nashimoto
IPC分类号： F25B1500
CPC分类号： F24F11/30 , F25B49/005
摘要： A management apparatus and a management method which can forecast inspection time before the lowering of performance or the occurrence of abnormality in a heat source unit for an air conditioner are provided. The operating condition of the air conditioner heat source unit is monitored by a central monitoring unit of the management apparatus connected to the heat source unit through an information communication network. Operating data of the heat source unit is analyzed so that the lowering of the performance and the advance of the degree of abnormality in the heat source unit are diagnosed. Thus, the loss of a user caused by the failure stop or the performance lowering of the heat source unit is reduced. Further, the load on the heat source unit is grasped by the central monitoring unit so that remote central control is carried out to make the operating cost minimal.
摘要翻译：提供了能够在空调的热源单元的性能降低或异常发生之前预测检查时间的管理装置和管理方法。空调热源单元的运行状态由通过信息通信网络连接到热源单元的管理设备的中央监控单元进行监视。分析热源单元的运行数据，从而诊断热源单元的性能的降低和异常程度的提高。因此，由故障停止引起的用户的损失或热源单元的性能下降降低。此外，由中央监控单元掌握热源单元上的负载，进行远程中央控制以使操作成本最小化。

48. 发明授权

US5270572A Liquid impingement cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的液体冲击冷却模块
公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译：一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件。每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

49. 发明授权

US4949164A Semiconductor cooling apparatus and cooling method thereof 失效
标题翻译：半导体冷却装置及其冷却方法
公开(公告)号：US4949164A
公开(公告)日：1990-08-14
申请号：US216704
申请日：1988-07-07
申请人： Shigeo Ohashi , Heikichi Kuwabara , Tadakatsu Nakajima , Wataru Nakayama , Motohiro Sato , Kenichi Kasai
发明人： Shigeo Ohashi , Heikichi Kuwabara , Tadakatsu Nakajima , Wataru Nakayama , Motohiro Sato , Kenichi Kasai
IPC分类号： H01L23/427
CPC分类号： H01L23/427 , H01L23/44 , H01L2924/0002
摘要： High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

50. 发明授权

US4619316A Heat transfer apparatus 失效
标题翻译：传热装置
公开(公告)号：US4619316A
公开(公告)日：1986-10-28
申请号：US726715
申请日：1985-04-24
申请人： Wataru Nakayama , Tadakatsu Nakajima , Shigeki Hirasawa , Akiomi Kohno , Takaji Takenaka
发明人： Wataru Nakayama , Tadakatsu Nakajima , Shigeki Hirasawa , Akiomi Kohno , Takaji Takenaka
IPC分类号： H01L23/44 , F28F13/02 , F28F13/18 , H01L23/427 , H01L39/04 , F28D15/00
CPC分类号： H01L23/427 , F28F13/187 , H01L2924/0002 , Y10S505/90
摘要： In an apparatus wherein heat generating bodies such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member which has a plurality of layers of cavity groups and apertures for bringing the cavity groups into communication is installed on a surface of each of the heat generating bodies.
摘要翻译：在利用液体沸腾来冷却集成电路芯片等发热体的装置中，一种传热装置，其特征在于，在每个发热体的表面上安装有具有多个空腔组层和用于使空腔组连通的孔的导热构件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式