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    • 41. 发明授权
    • Methods of forming field effect transistors and related field effect transistor constructions
    • 形成场效应晶体管和相关场效应晶体管结构的方法
    • US06673663B2
    • 2004-01-06
    • US10143264
    • 2002-05-08
    • Zhiqiang WuPaul Hatab
    • Zhiqiang WuPaul Hatab
    • H01L218238
    • H01L29/66583H01L29/1045H01L29/105H01L29/41775H01L29/66537H01L29/66553H01L29/66606H01L29/7833Y10S257/917
    • Methods of forming field effect transistors and related field effect transistor constructions are described. A masking layer is formed over a semiconductive substrate and an opening having sidewalls is formed therethrough. The opening defines a substrate area over which a field effect transistor gate is to be formed. A dopant of a first conductivity type is provided through the opening and into the substrate. Sidewall spacers are formed over respective sidewalls of the opening. Enhancement dopant of a second conductivity type which is different from the first conductivity type is provided through the opening and into the substrate. A transistor gate is formed within the opening proximate the sidewall spacers, and source/drain regions of the second conductivity type are diffused into the substrate operably proximate the transistor gate. The first conductivity type dopant forms a halo region proximate the source/drain regions and lightly doped drain (LDD) regions for the transistor.
    • 描述形成场效应晶体管和相关场效应晶体管结构的方法。 在半导体衬底上形成掩模层,并且通过其形成具有侧壁的开口。 开口限定了要在其上形成场效应晶体管栅极的衬底区域。 通过开口提供第一导电类型的掺杂剂并进入衬底。 侧壁间隔件形成在开口的相应侧壁上。 通过开口和衬底提供与第一导电类型不同的第二导电类型的增强掺杂剂。 晶体管栅极形成在靠近侧壁间隔物的开口内,并且第二导电类型的源极/漏极区域可操作地在晶体管栅极附近扩散到衬底中。 第一导电类型掺杂剂在晶体管的源极/漏极区域和轻掺杂漏极(LDD)区域附近形成晕圈。
    • 43. 发明授权
    • Method and apparatus for reducing isolation stress in integrated circuits
    • 降低集成电路隔离应力的方法和装置
    • US06414376B1
    • 2002-07-02
    • US09252837
    • 1999-02-19
    • Randhir P. S. ThakurKevin G. DonohoeZhiqiang WuAlan R. Reinberg
    • Randhir P. S. ThakurKevin G. DonohoeZhiqiang WuAlan R. Reinberg
    • H01L2358
    • H01L21/32H01L21/0332
    • Stress resulting from silicon nitride is diminished by forming an oxidation mask with silicon nitride having a graded silicon concentration. Grading is accomplished by changing the silicon content in the silicon nitride by varying the amount of hydride, such as dichlorosilane (DCS), mixed with ammonia. The silicon nitride can be graded in a substantially linear or non-linear fashion. Silicon nitride formed with higher levels of DCS mixed with ammonia is referred to as silicon rich nitride because of its relatively higher silicon content. In one embodiment, the graded silicon nitride may be formed with one type of non-linear silicon grading, an abrupt junction. In other embodiments, the silicon nitride is formed in a variety of shapes fashioned during or after silicon nitride growth. In one embodiment, the stress from the silicon nitride is reduced by forming a polysilicon buffer layer between two silicon nitride layers. In another embodiment, the stress from the silicon nitride is reduced by forming the silicon nitride on a pad layer, which in turn is formed on a base layer.
    • 通过用具有梯度硅浓度的氮化硅形成氧化掩模来减小氮化硅产生的应力。 通过改变与氨混合的氢化物(例如二氯硅烷(DCS))的量来改变氮化硅中的硅含量来实现分级。 氮化硅可以以基本线性或非线性方式分级。 由于硅含量相对较高,因此与氨混合的较高水平的DCS形成的氮化硅被称为富含氮的氮化物。 在一个实施例中,渐变氮化硅可以用一种类型的非线性硅分级,突变结形成。 在其它实施例中,氮化硅形成为在氮化硅生长期间或之后形成的各种形状。 在一个实施例中,通过在两个氮化硅层之间形成多晶硅缓冲层来减小来自氮化硅的应力。 在另一个实施方案中,通过在衬底层上形成氮化硅来降低来自氮化硅的应力,衬垫层又形成在基底层上。
    • 44. 发明授权
    • Methods of forming field effect transistors and related field effect transistor constructions
    • 形成场效应晶体管和相关场效应晶体管结构的方法
    • US06406957B1
    • 2002-06-18
    • US09494973
    • 2000-01-31
    • Zhiqiang WuPaul Hatab
    • Zhiqiang WuPaul Hatab
    • H01L218238
    • H01L29/66583H01L29/1045H01L29/105H01L29/41775H01L29/66537H01L29/66553H01L29/66606H01L29/7833Y10S257/917
    • Methods of forming field effect transistors and related field effect transistor constructions are described. A masking layer is formed over a semiconductive substrate and an opening having sidewalls is formed therethrough. The opening defines a substrate area over which a field effect transistor gate is to be formed. A dopant of a first conductivity type is provided through the opening and into the substrate. Sidewall spacers are formed over respective sidewalls of the opening. Enhancement dopant of a second conductivity type which is different from the first conductivity type is provided through the opening and into the substrate. A transistor gate is formed within the opening proximate the sidewall spacers, and source/drain regions of the second conductivity type are diffused into the substrate operably proximate the transistor gate. The first conductivity type dopant forms a halo region proximate the source/drain regions and lightly doped drain (LDD) regions for the transistor.
    • 描述形成场效应晶体管和相关场效应晶体管结构的方法。 在半导体衬底上形成掩模层,并且通过其形成具有侧壁的开口。 开口限定了要在其上形成场效应晶体管栅极的衬底区域。 通过开口提供第一导电类型的掺杂剂并进入衬底。 侧壁间隔件形成在开口的相应侧壁上。 通过开口和衬底提供与第一导电类型不同的第二导电类型的增强掺杂剂。 晶体管栅极形成在靠近侧壁间隔物的开口内,并且第二导电类型的源极/漏极区域可操作地在晶体管栅极附近扩散到衬底中。 第一导电类型掺杂剂在晶体管的源极/漏极区域和轻掺杂漏极(LDD)区域附近形成晕圈。