专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US09380700B2 Method for forming traces of a printed circuit board 有权
标题翻译：用于形成印刷电路板的迹线的方法
公开(公告)号：US09380700B2
公开(公告)日：2016-06-28
申请号：US14281631
申请日：2014-05-19
申请人： Konstantine Karavakis , Kenneth S. Bahl , Steve Carney
发明人： Konstantine Karavakis , Kenneth S. Bahl , Steve Carney
IPC分类号： H05K3/02 , H05K3/10 , H05K1/03 , H05K1/09 , H05K1/11 , H05K3/08 , H05K3/40 , H05K3/18 , H05K3/00
CPC分类号： H05K1/0306 , H05K1/09 , H05K1/115 , H05K3/0041 , H05K3/08 , H05K3/107 , H05K3/185 , H05K3/4038 , H05K2201/017 , H05K2201/0236 , H05K2201/0376 , H05K2203/025 , H05K2203/0716 , H05K2203/107
摘要： A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.
摘要翻译：印刷电路板包括层叠基板。层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。金属痕迹形成在层压基板内的痕迹通道内。通道延伸到催化材料的表面之下。

42. 发明申请

US20150334836A1 VIA IN A PRINTED CIRCUIT BOARD 有权
标题翻译：通过印刷电路板
公开(公告)号：US20150334836A1
公开(公告)日：2015-11-19
申请号：US14281802
申请日：2014-05-19
申请人： Konstantine Karavakis , Kenneth S. Bahl
发明人： Konstantine Karavakis , Kenneth S. Bahl
IPC分类号： H05K1/11 , H05K3/00 , H05K3/42 , H05K1/09
CPC分类号： H05K3/426 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/387 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.
摘要翻译：印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

43. 发明申请

US20150334825A1 EMBEDDED TRACES 有权
标题翻译：嵌入式轨迹
公开(公告)号：US20150334825A1
公开(公告)日：2015-11-19
申请号：US14297516
申请日：2014-06-05
申请人： Kenneth S. Bahl , Konstantine Karavakis , Steve Carney
发明人： Kenneth S. Bahl , Konstantine Karavakis , Steve Carney
IPC分类号： H05K1/02 , H05K3/18 , H05K3/40 , H05K1/11 , C23C18/38 , C23C18/20 , C23C18/16 , H05K1/03 , H05K3/10 , H05K3/46
CPC分类号： C23C18/1608 , C23C18/204 , C23C18/38 , H05K3/185 , H05K3/4602 , H05K2201/0236 , H05K2201/0376 , H05K2203/025 , H05K2203/0716 , H05K2203/107 , Y10T29/49165
摘要： A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.
摘要翻译：印刷电路板包括层叠基板。层压基板包括抵抗金属电镀的催化芯材料，除了催化材料的表面被烧蚀之外。金属痕迹形成在层压基板内的痕迹通道内。通道延伸到催化材料的表面之下。

44. 发明授权

US07491069B1 Self-cleaning socket for microelectronic devices 有权
标题翻译：微电子器件自清洁插座
公开(公告)号：US07491069B1
公开(公告)日：2009-02-17
申请号：US11970394
申请日：2008-01-07
申请人： Thomas H. Di Stefano , Anthony B. Faraci , Konstantine Karavakis , Peter T. Di Stefano
发明人： Thomas H. Di Stefano , Anthony B. Faraci , Konstantine Karavakis , Peter T. Di Stefano
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , G01R1/0491 , G01R1/06722 , G01R1/07314 , G01R3/00 , H01R13/111
摘要： A self-cleaning socket for contacting terminals on a microelectronic device wherein the first end of compliant tubular contactors rotate and wipe against terminals urged downwardly against the first end of the contactors. A rotational wipe of a contactor against a mating terminal breaks through any surface contamination layers on the terminal, thereby producing good electrical contact therebetween. Rotation of the first end of a contactor is caused by a downward deflection of a collar supported by two or more helical legs along a midsection of the contactor. Deflection of the collar distorts the resilient helical legs, each of which exerts a force on the collar which add up to produce a torsional force on the collar, thereby providing a rotational wipe in response to a downward urging of a terminal against the contactor. A void along the axis of the tubular contactor provides a reservoir to hold debris dislodged from the terminal and to keep the debris from interfering with operation of the contactor.
摘要翻译：一种用于接触微电子装置上的端子的自清洁插座，其中柔性管状接触器的第一端旋转并且擦拭抵靠接触器的第一端向下的端子。接触器抵靠配合端子的旋转擦拭物破坏端子上的任何表面污染层，从而在它们之间产生良好的电接触。接触器第一端的旋转是由沿着接触器的中部两个或更多个螺旋腿支撑的轴环的向下偏转引起的。衣领的偏转扭曲了弹性螺旋腿，每个弹性螺旋腿在颈圈上施加一个力，加在轴环上产生扭转力，从而响应于端子向着接触器的向下推动而提供旋转擦拭物。沿着管状接触器的轴线的空隙提供储存器以保持从端子移出的碎屑并且保持碎屑免受接触器的操作的干扰。

45. 发明授权

US06557253B1 Method of making components with releasable leads 有权
标题翻译：使用可释放引线制造部件的方法
公开(公告)号：US06557253B1
公开(公告)日：2003-05-06
申请号：US09549638
申请日：2000-04-14
申请人： Belgacem Haba , Konstantine Karavakis
发明人： Belgacem Haba , Konstantine Karavakis
IPC分类号： H01R4316
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , Y10T29/49121 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
摘要翻译：用于连接到微电子元件的连接部件是通过在聚合物层的表面上提供导线并蚀刻聚合物层以将引线部分地从聚合物层分离的方式制成的，每个引线的一部分可释放地连接到聚合物层上一个小的聚合物连接元件，可以从铅中破碎或剥离。连接元件的引线可以由通过涂覆工艺施加的绝缘护套覆盖，并且绝缘护套也可以被导电层覆盖，使得每个引线变成微型同轴电缆。这种布置提供了对干扰的抗扰性，并且便于高速运行。

46. 发明授权

US06495462B1 Components with releasable leads 失效
标题翻译：具有可释放引线的部件
公开(公告)号：US06495462B1
公开(公告)日：2002-12-17
申请号：US09566273
申请日：2000-05-05
申请人： Belgacem Haba , Hamid Eslampour , Konstantine Karavakis
发明人： Belgacem Haba , Hamid Eslampour , Konstantine Karavakis
IPC分类号： H01L21302
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , H01L2924/00
摘要： A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is then etched to partially detach the leads from the dielectric layer, leaving at least one end of each lead permanently connected to the dielectric layer. The remainder of the lead may be fully or partially detached from the dielectric layer. If the remainder of the lead is only partially detached, the connecting elements that connects the leads to the polymeric layer can be broken or peeled away from the leads during the step of moving the microelectronic element and dielectric layer away from one another. A microelectronic element assemble by includes a support structure having a dielectric layer and terminals disposed on the dielectric layer; a microelectronic element and a plurality of leads connecting contacts on the microelectronic element to terminals on the dielectric layer. The dielectric layer has a central region and a periphery region which surrounds the central region. The periphery region is disposed beneath the periphery of the microelectronic element.
摘要翻译：通过提供具有介电层的起始结构并在电介质层的表面上引出微电子部件。引线的端部连接到微电子元件上的触点，例如半导体芯片或晶片上的触点。然后蚀刻电介质层以将引线部分地从电介质层分离，留下每个引线的至少一端永久地连接到电介质层。引线的剩余部分可以与电介质层完全或部分分离。如果引线的剩余部分仅部分分离，则在将微电子元件和电介质层彼此远离的步骤期间，将引线连接到聚合物层的连接元件可以从引线断开或剥离。微电子元件组装通过包括具有电介质层的支撑结构和设置在电介质层上的端子; 微电子元件和将微电子元件上的触点连接到电介质层上的端子的多个引线。电介质层具有围绕中心区域的中心区域和周边区域。周边区域设置在微电子元件的外围的下方。

47. 发明授权

US06423907B1 Components with releasable leads 有权
标题翻译：具有可释放引线的部件
公开(公告)号：US06423907B1
公开(公告)日：2002-07-23
申请号：US09549633
申请日：2000-04-14
申请人： Belgacem Haba , Konstantine Karavakis
发明人： Belgacem Haba , Konstantine Karavakis
IPC分类号： H01R1204
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , Y10T29/49121 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
摘要翻译：用于连接到微电子元件的连接部件是通过在聚合物层的表面上提供导线并蚀刻聚合物层以将引线部分地从聚合物层分离的方式制成的，每个引线的一部分可释放地连接到聚合物层上一个小的聚合物连接元件，可以从铅中破碎或剥离。连接元件的引线可以由通过涂覆工艺施加的绝缘护套覆盖，并且绝缘护套也可以被导电层覆盖，使得每个引线变成微型同轴电缆。这种布置提供了对干扰的抗扰性，并且便于高速运行。

48. 发明授权

US5971253A Microelectronic component mounting with deformable shell terminals 失效
标题翻译：具有可变形外壳端子的微电子部件安装
公开(公告)号：US5971253A
公开(公告)日：1999-10-26
申请号：US777307
申请日：1996-12-27
申请人： Kenneth B. Gilleo , Konstantine Karavakis
发明人： Kenneth B. Gilleo , Konstantine Karavakis
IPC分类号： H01L23/498 , H05K3/34 , B23K31/02 , B23K31/12
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K3/3436
摘要： A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
摘要翻译：诸如半导体芯片组件的微电子元件组件使用在其中结合有电导元件的电介质片的连接部件。每个导电元件可以包括柔性壳。可以形成柔性壳体以确保与配合接触垫片的可靠接合。

49. 发明授权

US09631279B2 Methods for forming embedded traces 有权
公开(公告)号：US09631279B2
公开(公告)日：2017-04-25
申请号：US14297516
申请日：2014-06-05
申请人： Kenneth S. Bahl , Konstantine Karavakis , Steve Carney
发明人： Kenneth S. Bahl , Konstantine Karavakis , Steve Carney
IPC分类号： H05K3/10 , C23C18/16 , C23C18/38 , C23C18/20 , H05K3/18 , H05K3/46
CPC分类号： C23C18/1608 , C23C18/204 , C23C18/38 , H05K3/185 , H05K3/4602 , H05K2201/0236 , H05K2201/0376 , H05K2203/025 , H05K2203/0716 , H05K2203/107 , Y10T29/49165
摘要： A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

50. 发明授权

US09398703B2 Via in a printed circuit board 有权
标题翻译：通过印刷电路板
公开(公告)号：US09398703B2
公开(公告)日：2016-07-19
申请号：US14281802
申请日：2014-05-19
申请人： Konstantine Karavakis , Kenneth S. Bahl
发明人： Konstantine Karavakis , Kenneth S. Bahl
IPC分类号： H05K1/03 , H05K3/38 , H05K3/42
CPC分类号： H05K3/426 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/387 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.
摘要翻译：印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式