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    • 43. 发明授权
    • Method of producing semiconductor devices
    • 半导体器件的制造方法
    • US4210689A
    • 1980-07-01
    • US969007
    • 1978-12-13
    • Shigeru Komatsu
    • Shigeru Komatsu
    • H01L21/033H01L21/285H01L21/3105H01L21/311H01L21/38
    • H01L21/28525H01L21/033H01L21/3105H01L21/31111
    • Semiconductor devices are produced by forming a first insulation film of a relatively high density on a semiconductor substrate having a first semiconductor region formed therein in advance, said first insulation film covering said first semiconductor region, and forming a second insulation film of a relatively low density on the first insulation film. The second insulation film is provided with at least one hole, and the second insulation film is densified to a level substantially equal to that of the first insulation film. Then the exposed portion of the first insulation film is provided with at least one opening with a nitride film used as a mask, and an impurity is diffused through the opening into the first semiconductor region to form therein a second semiconductor region.
    • 半导体器件通过在预先形成有第一半导体区域的半导体衬底上形成具有较高密度的第一绝缘膜来制造,所述第一绝缘膜覆盖所述第一半导体区域,并且形成相对低密度的第二绝缘膜 在第一绝缘膜上。 第二绝缘膜设置有至少一个孔,并且第二绝缘膜被致密化至与第一绝缘膜基本相等的水平。 然后,第一绝缘膜的暴露部分设置有至少一个具有用作掩模的氮化物膜的开口,并且杂质通过开口扩散到第一半导体区域中以在其中形成第二半导体区域。
    • 47. 发明授权
    • Semiconductor device and a method of manufacturing the same
    • 半导体装置及其制造方法
    • US4882290A
    • 1989-11-21
    • US148351
    • 1988-01-25
    • Shigeru Komatsu
    • Shigeru Komatsu
    • H01L29/73H01L21/285H01L21/331H01L29/10H01L29/732
    • H01L29/66272H01L21/28525H01L29/1004H01L29/732Y10S148/01Y10S148/011Y10S148/123Y10S148/124
    • In an NPN transistor, a contact base region, an active base region, and a further base region are formed in the silicon substrate. The further base region is between the contact base region and the active base region, and is adjacent to the contact base region and the active base region. The further base region has a depth shallower than that of the contact base region and deeper than that of the active base region. In the method of forming the bipolar transistor, a polysilicon semiconductor layer is formed on a semiconductor substrate. The polysilicon semiconductor layer is partially etched to form a base leading electrode and an emitter leading electrode. A semiconductor impurity is implanted into a base forming region of the silicon substrate via that portion where the polysilicon semiconductor layer is removed.
    • 在NPN晶体管中,在硅衬底中形成接触基极区域,有源基极区域和另外的基极区域。 另外的基极区域在接触基极区域和有源基极区域之间,并且与接触基极区域和活性基极区域相邻。 另外的基极区域的深度比接触基极区域的深度浅,并且比活性基极区域的深度深。 在形成双极晶体管的方法中,在半导体衬底上形成多晶硅半导体层。 部分蚀刻多晶硅半导体层以形成基极引出电极和发射极引线电极。 通过去除多晶硅半导体层的部分将半导体杂质注入到硅衬底的基底形成区域中。
    • 48. 发明授权
    • Method of making a bipolar semiconductor device
    • 制造双极型半导体器件的方法
    • US4824799A
    • 1989-04-25
    • US178875
    • 1988-04-04
    • Shigeru Komatsu
    • Shigeru Komatsu
    • H01L29/73H01L21/20H01L21/225H01L21/285H01L21/331H01L29/423H01L29/732H01L21/38
    • H01L29/66287H01L21/2257H01L21/28531H01L29/42304H01L29/732
    • An n.sup.+ -type buried layer is formed in the surface region of a p-type semiconductor substrate. Isulating films are formed on the semiconductor substrate. The insulating films have openings located above the buried layer. An n-type monocrystalline silicon layer is formed in one opening located above the buried layer. A base region is formed in the monocrystalline silicon layer. The base region defines a remaining portion of the monocrystalline silicon layer as a collector region. An emitter region is formed in the base region. A polycrystalline silicon layer is buried in the insulating films to have ohmic contact with the base region and serve as a portion of a base connection region. The polycrystalline silicon layer contains a p-type impurity and serves as an impurity diffusion source for the formation of an external base of the base region. An MoSi.sub.2 layer is buried in the insulating films to have ohmic contact with the polycrystalline silicon layer and to serve as a portion of the base connection region, thereby reducing the base resistance. A conductive layer for connection with a collector is formed in another opening.
    • 在p型半导体衬底的表面区域形成n +型掩埋层。 在半导体衬底上形成有隔离膜。 绝缘膜具有位于掩埋层上方的开口。 在位于掩埋层上方的一个开口中形成n型单晶硅层。 在单晶硅层中形成基极区。 基极区域将单晶硅层的剩余部分限定为集电极区域。 在基极区域形成发射极区域。 多晶硅层被埋在绝缘膜中以与基极区域欧姆接触并用作基极连接区域的一部分。 多晶硅层含有p型杂质,作为形成基极区域的外部基底的杂质扩散源。 MoSi2层被埋在绝缘膜中以与多晶硅层欧姆接触并用作基极连接区域的一部分,由此降低了基极电阻。 在另一个开口中形成用于与收集器连接的导电层。