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41. 发明授权

US07018857B2 Method of manufacturing a semiconductor device including defect inspection using a semiconductor testing probe 失效
标题翻译：使用半导体测试探针制造包括缺陷检查的半导体器件的方法
公开(公告)号：US07018857B2
公开(公告)日：2006-03-28
申请号：US10459598
申请日：2003-06-12
申请人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
IPC分类号： H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
摘要翻译：一种用于提高半导体制造工艺中的产量并降低制造成本的制造方法产生了廉价制造的半导体器件，并且通过在合适的按压力期间可靠地进行接触检查而具有高的可靠性，同时限制对电极焊盘的损伤甚至当检查了许多检查电极时。用于检查半导体器件的衬底具有光束，所述光束上的探针具有用于与半导体器件的电极（电极焊盘）接触的突出形状，以及通过电气电连接到探针的次级电极导电构件设置在与设置探针的一侧相对的梁的侧面上。在检查过程中，具有形成在探针中的具有许多突起的层的检查装置与半导体器件的电极焊盘接触。

42. 发明申请

US20050074910A1 Manufacturing method of semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US20050074910A1
公开(公告)日：2005-04-07
申请号：US10459598
申请日：2003-06-12
申请人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Takanori Aono , Tatsuya Nagata , Kenji Kawakami , Hideyuki Aoki
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00
摘要： A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
摘要翻译：一种用于提高半导体制造工艺中的产量并降低制造成本的制造方法产生了廉价制造的半导体器件，并且通过在合适的按压力期间可靠地进行接触检查而具有高的可靠性，同时限制对电极焊盘的损伤甚至当检查了许多检查电极时。用于检查半导体器件的衬底具有光束，所述光束上的探针具有用于与半导体器件的电极（电极焊盘）接触的突出形状，以及通过电气电连接到探针的次级电极导电构件设置在与设置探针的一侧相对的梁的侧面上。在检查过程中，具有形成在探针中的具有许多突起的层的检查装置与半导体器件的电极焊盘接触。

43. 发明申请

US20050032252A1 Testing apparatus for carrying out inspection of a semiconductor device 有权
标题翻译：用于对半导体器件进行检查的测试装置
公开(公告)号：US20050032252A1
公开(公告)日：2005-02-10
申请号：US10934046
申请日：2004-09-03
申请人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
发明人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02 , G01R31/26
CPC分类号： G01R1/07314
摘要： A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device formed on the wafer. The testing process includes a step bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including a plurality of probes that come into contact with the test electrodes of the semiconductor device to be tested, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
摘要翻译：制造半导体器件的方法具有在晶片的主表面上形成半导体器件的形成工艺和用于测试形成在晶片上的半导体器件的缺陷的测试过程。测试过程包括使测试设备与半导体器件的测试电极接触的步骤。测试装置具有接触器，该接触器包括与待测半导体器件的测试电极接触的多个探针，以及与探针电连接并设置在与探针相对的表面上的二次电极; 电极通过导电装置与接触器电连通的基板。导电装置形成为在探针与测试电极接触的状态下施加到导电装置的应力大于在探针不与测试电极接触的状态下施加到导电装置的应力。

44. 发明授权

US06828810B2 Semiconductor device testing apparatus and method for manufacturing the same 失效
标题翻译：半导体器件测试装置及其制造方法
公开(公告)号：US06828810B2
公开(公告)日：2004-12-07
申请号：US10207145
申请日：2002-07-30
申请人： Masatoshi Kanamaru , Yoshishige Endo , Takanori Aono , Ryuji Kohno , Hiroya Shimizu , Naoto Ban , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Yoshishige Endo , Takanori Aono , Ryuji Kohno , Hiroya Shimizu , Naoto Ban , Hideyuki Aoki
IPC分类号： G01R3102
CPC分类号： G01R1/0466
摘要： A semiconductor device testing apparatus is realized, which allows contactors to be positioned throughout the wafer surface highly accurately for uniform contact, testing a large-sized wafer, and cost reduction. A plurality of divided contactor blocks is formed with a positioning groove. The groove is used to position the plurality of contactor blocks with a positioning frame. Because the contactor blocks are divided into plurals, it is less likely that a partial surface distortion affects other portions to impair surface flatness as compared with the case where a plurality of non-divided contactors is formed integrally, and the plurality of contactor blocks can be brought into contact with a wafer to be tested uniformly. Additionally, even though abnormality is generated in a part of the contactor blocks, only the part of the contactor blocks is replaced. Therefore, replacement costs can be reduced as compared with the case where a plurality of non-divided contactors is formed integrally.
摘要翻译：实现半导体器件测试装置，其允许接触器高精度地定位在整个晶片表面，用于均匀接触，测试大尺寸晶片以及降低成本。多个分开的接触器块形成有定位槽。凹槽用于定位具有定位框架的多个接触器块。由于接触器块被分成多个，与多个非分隔接触器形成为一体的情况相比，部分表面变形对其他部分的影响较小可能损害表面平坦度，并且多个接触器块可以与待测试的晶片均匀接触。此外，即使在接触器块的一部分中产生异常，仅更换接触器块的一部分。因此，与多个非分割接触器一体形成的情况相比，可以降低更换成本。

45. 发明授权

US06444172B1 Water quality meter and water quality monitoring system 有权
公开(公告)号：US06444172B1
公开(公告)日：2002-09-03
申请号：US09828902
申请日：2001-04-10
申请人： Masao Fukunaga , Tamio Ishihara , Koji Saito , Katsutoshi Yamada , Hideo Enoki , Sadao Mori , Ryo Miyake , Takao Terayama , Masatoshi Kanamaru
发明人： Masao Fukunaga , Tamio Ishihara , Koji Saito , Katsutoshi Yamada , Hideo Enoki , Sadao Mori , Ryo Miyake , Takao Terayama , Masatoshi Kanamaru
IPC分类号： G01N1500
摘要： A water quality meter is composed of a plurality of water quality monitoring meters including analyzing units for analyzing water samples introduced from a water distribution pipe, each analyzing unit analyzing the water samples and a measuring cell, and a liquid introducing unit integrated with the analyzing units, which is composed of a single member in which a plurality of fluid flow paths for feeding various types of liquid including the water sample into the analyzing unit are formed. Furthermore, the cells and the plurality of three-dimensional fluid flow paths formed in the single member are fabricated by a micro-fabrication technique using photo-curing resin.

46. 发明授权

US4610718A Method for manufacturing ultra-fine particles 失效
标题翻译：超细颗粒的制造方法
公开(公告)号：US4610718A
公开(公告)日：1986-09-09
申请号：US726651
申请日：1985-04-24
申请人： Takeshi Araya , Ryoji Okada , Yoshiro Ibaraki , Susumu Hioki , Masatoshi Kanamaru , Yoshishige Endo , Mitsuaki Haneda
发明人： Takeshi Araya , Ryoji Okada , Yoshiro Ibaraki , Susumu Hioki , Masatoshi Kanamaru , Yoshishige Endo , Mitsuaki Haneda
IPC分类号： B22F9/14 , H05H1/28 , B01J2/04
CPC分类号： B22F9/14 , H05H1/28 , B22F2998/00
摘要： In a method wherein arcs are struck across a material to vaporize into ultra-fine particles and an electrode, thereby to manufacture the ultra-fine particles; the material to turn into the ultra-fine particles is arranged for at least either of the electrodes, and plasma currents are generated from the material and the electrode, whereby the formation rate of the ultra-fine particles per unit input is increased, and the material is formed in the shape of a rod or a wire, and a feeder capable of continuously supplying the material is disposed, whereby the ultra-fine particles can be continuously manufactured.
摘要翻译：在将电弧撞击穿过材料蒸发成超细颗粒和电极的方法中，从而制造超细颗粒; 对于电极中的至少任一个设置变成超细颗粒的材料，并且从材料和电极产生等离子体电流，由此每单位输入的超细颗粒的形成速率增加，并且材料形成为棒状或线状，并且配置能够连续供给材料的馈线，由此可以连续地制造超细颗粒。

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