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    • 41. 发明授权
    • Semiconductor device and method for manufacturing
    • 半导体装置及其制造方法
    • US08519387B2
    • 2013-08-27
    • US13185779
    • 2011-07-19
    • Yuta EndoKosei NodaToshinari Sasaki
    • Yuta EndoKosei NodaToshinari Sasaki
    • H01L29/10
    • H01L29/66969H01L21/02164H01L21/02367H01L21/02565H01L21/02631H01L29/66742H01L29/78603H01L29/78618H01L29/7869
    • An insulating layer which releases a large amount of oxygen is used as an insulating layer in contact with a channel region of an oxide semiconductor layer, and an insulating layer which releases a small amount of oxygen is used as an insulating layer in contact with a source region and a drain region of the oxide semiconductor layer. By releasing oxygen from the insulating layer which releases a large amount of oxygen, oxygen deficiency in the channel region and an interface state density between the insulating layer and the channel region can be reduced, so that a highly reliable semiconductor device having small variation in electrical characteristics can be manufactured. The source region and the drain region are provided in contact with the insulating layer which releases a small amount of oxygen, thereby suppressing the increase of the resistance of the source region and the drain region.
    • 使用释放大量氧的绝缘层作为与氧化物半导体层的沟道区域接触的绝缘层,并且使用释放少量氧的绝缘层作为与源极接触的绝缘层 区域和氧化物半导体层的漏极区域。 通过从释放大量氧的绝缘层释放氧气,可以减少沟道区域中的氧缺乏以及绝缘层和沟道区域之间的界面态密度,从而可以降低电子变化小的高度可靠的半导体器件 特性可以制造。 源极区域和漏极区域设置成与释放少量氧气的绝缘层接触,从而抑制源极区域和漏极区域的电阻的增加。
    • 42. 发明授权
    • Manufacturing method of semiconductor device
    • 半导体器件的制造方法
    • US08518740B2
    • 2013-08-27
    • US12828468
    • 2010-07-01
    • Shunpei YamazakiToshinari SasakiJunichiro SakataHiroki Ohara
    • Shunpei YamazakiToshinari SasakiJunichiro SakataHiroki Ohara
    • H01L21/00H01L21/16
    • H01L29/7869H01L21/67109H01L21/67115H01L27/1225
    • An object is to provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, impurities such as moisture existing in the gate insulating layer are reduced before formation of the oxide semiconductor film, and then heat treatment (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor film and reduce impurities such as moisture. After that, slow cooling is performed in an oxygen atmosphere. Besides impurities such as moisture existing in the gate insulating layer and the oxide semiconductor film, impurities such as moisture existing at interfaces between the oxide semiconductor film and upper and lower films provided in contact therewith are reduced.
    • 本发明的目的是提供一种具有稳定电特性的薄膜晶体管的高度可靠的半导体器件。 在制造包括薄膜晶体管的半导体器件的方法中,其中氧化物半导体膜用于包括沟道形成区域的半导体层,在形成氧化物半导体膜之前,存在于栅极绝缘层中的诸如水分的杂质减少 ,然后进行热处理(脱水或脱氢的热处理),以提高氧化物半导体膜的纯度并减少诸如水分的杂质。 之后,在氧气氛中进行缓慢冷却。 除了存在于栅极绝缘层和氧化物半导体膜中的杂质等杂质以外,氧化物半导体膜与与其接触的上下膜之间的界面处存在的诸如水分的杂质减少。
    • 46. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US08318551B2
    • 2012-11-27
    • US12627204
    • 2009-11-30
    • Kengo AkimotoToshinari Sasaki
    • Kengo AkimotoToshinari Sasaki
    • H01L21/84H01L29/10H01L29/12
    • H01L29/7869H01L27/1225H01L29/41733H01L29/66969
    • A gate electrode layer over a substrate; a gate insulating layer over the gate electrode layer; a first source electrode layer and a first drain electrode layer over the gate insulating layer; an oxide semiconductor layer over the gate insulating layer; and a second source electrode layer and a second drain electrode layer over the oxide semiconductor layer. A first part, a second part, and a third part of a bottom surface are in contact with the first source electrode layer, the first drain electrode layer, and the gate insulating layer respectively. A first part and a second part of the top surface are in contact with the second source electrode layer and the second drain electrode layer respectively. The first source electrode layer and the first drain electrode layer are electrically connected to the second source electrode layer and the second drain electrode layer respectively.
    • 衬底上的栅电极层; 栅电极层上的栅极绝缘层; 栅极绝缘层上的第一源极电极层和第一漏极电极层; 栅极绝缘层上的氧化物半导体层; 以及在所述氧化物半导体层上的第二源极电极层和第二漏极电极层。 第一部分,第二部分和底部表面的第三部分分别与第一源极电极层,第一漏极电极层和栅极绝缘层接触。 上表面的第一部分和第二部分分别与第二源极电极层和第二漏极电极层接触。 第一源极电极层和第一漏极电极层分别与第二源极电极层和第二漏极电极层电连接。