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41. 发明授权

US07728283B2 Illuminance detecting apparatus comprising a light shielding element containing openings for each detector element 有权
标题翻译：该照度检测装置包括用于每个检测器元件的开口的遮光元件
公开(公告)号：US07728283B2
公开(公告)日：2010-06-01
申请号：US12041840
申请日：2008-03-04
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H01J40/14 , H01J5/02
CPC分类号： H01L27/1446 , H01L25/042 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An illuminance detecting component includes: a supporting substrate including a substrate body made of silicon, and pads provided on an upper surface of the substrate body; a plurality of light receiving elements connected electrically to the pads and receiving light irradiated from an outside, the plurality of light receiving elements being arranged in array fashion on the upper surface side; external connection terminals connected electrically to the light receiving elements; and a translucent member provided on the substrate body. In the illuminance detecting component, an airtight space in which the plurality of light receiving elements are accommodated is formed between the translucent member and the substrate body.
摘要翻译：照度检测部件包括：支撑基板，包括由硅制成的基板主体，以及设置在所述基板主体的上表面上的焊盘; 多个光接收元件，其电连接到所述焊盘并且接收从外部照射的光，所述多个光接收元件以阵列方式布置在所述上表面侧上; 外部连接端子与光接收元件电连接; 以及设置在基板主体上的半透明构件。在照度检测部件中，在透光部件和基板主体之间形成容纳有多个受光元件的气密空间。

42. 发明授权

US07678612B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07678612B2
公开(公告)日：2010-03-16
申请号：US11898973
申请日：2007-09-18
申请人： Tomoharu Fujii , Kiyoshi Oi
发明人： Tomoharu Fujii , Kiyoshi Oi
IPC分类号： H01L21/00
CPC分类号： H05K3/4652 , H01L21/4853 , H01L23/552 , H01L24/48 , H01L25/16 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/185 , H05K3/06 , H05K3/4046 , H05K3/4614 , H05K2201/10318 , H05K2203/0369 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing a semiconductor device includes: a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure; and a step of bonding the wiring structure to a wiring substrate including electronic components mounted thereon.
摘要翻译：一种半导体器件的制造方法，其特征在于，包括：在导电层上形成通孔的步骤，将所述通孔塞嵌入绝缘层，形成配线结构; 以及将布线结构接合到包括安装在其上的电子部件的布线基板的步骤。

43. 发明申请

US20090320747A1 TAKE-UP TYPE VACUUM FILMING DEVICE 有权
标题翻译：真空型真空成膜装置
公开(公告)号：US20090320747A1
公开(公告)日：2009-12-31
申请号：US12374675
申请日：2007-07-26
申请人： Nobuhiro Hayashi , Tomoharu Fujii , Isao Tada , Atsushi Nakatsuka
发明人： Nobuhiro Hayashi , Tomoharu Fujii , Isao Tada , Atsushi Nakatsuka
IPC分类号： C23C14/56
CPC分类号： C23C14/042 , B05C1/0821 , B05C1/083 , B05C1/0834 , C23C14/562 , H01G13/00 , H01G13/006
摘要： [Object] To provide a roll-to-roll vacuum deposition apparatus capable of easily and speedily adjusting a pressing force between a printing roller and a backup roller.[Solving Means] In the present invention, by adjusting a pressing force between a printing roller and a backup roller through a relative movement of a mask forming unit including the printing roller and a transfer roller with respect to a vacuum chamber, individual adjustments of the printing roller and the transfer roller are eliminated and an adjustment of a pressing force on a unit basis is realized, thus achieving simplification of a structure, simplification and enhancement in precision of tasks, and a reduction in work time.
摘要翻译：本发明提供能够容易且快速地调整印刷辊和支承辊之间的按压力的卷对卷真空成膜装置。解决方案在本发明中，通过相对于真空室通过包括印刷辊和转印辊的掩模形成单元的相对运动调节印刷辊和支撑辊之间的按压力，可以对印刷辊和转印辊被消除，并且实现了基于单元的按压力的调节，从而实现了结构的简化，简化和提高了任务精度以及减少了工作时间。

44. 发明申请

US20090039999A1 INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电感器件及其制造方法
公开(公告)号：US20090039999A1
公开(公告)日：2009-02-12
申请号：US12186317
申请日：2008-08-05
申请人： Tomoharu Fujii , Masahiro Sunohara , Manabu Nakamura
发明人： Tomoharu Fujii , Masahiro Sunohara , Manabu Nakamura
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F27/323 , H01F41/041 , H01F41/122 , H01F2017/0046 , H01L23/49822 , H01L23/49838 , H01L23/645 , H01L28/10 , H01L2224/16225 , H01L2924/19105 , H01L2924/3011 , Y10T29/4902
摘要： An inductor device formed on a semiconductor substrate includes an inductor body penetrating the semiconductor substrate, taking a spiral shape and having a conductivity, and an insulating film provided between a side surface of the inductor body and the semiconductor substrate.
摘要翻译：形成在半导体衬底上的电感器件包括穿过半导体衬底的电感体，呈螺旋形并具有导电性，以及设置在电感体侧面和半导体衬底之间的绝缘膜。

45. 发明申请

US20070096992A1 Antenna and wiring board 有权
标题翻译：天线和接线板
公开(公告)号：US20070096992A1
公开(公告)日：2007-05-03
申请号：US11586624
申请日：2006-10-26
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0414 , H05K1/0298 , H05K1/16
摘要： An antenna 1 which is incorporated in a multilayer wiring board 2 has: radiating elements 11-1, 11-2, 11-3, and 11-4 which are laid on faces of A-, B-, and C-layers of the wiring board 2, respectively; power supplying portions 12-1, 12-2, 12-3, and 12-4 which are laid on the faces of the layers, respectively to supply an electric power to the radiating elements 11-1, 11-2, 11-3, and 11-4; short-circuiting portions 13-1, 13-2, 13-3, and 13-4 which are laid on the faces of the layers, respectively to ground the radiating elements 11-1, 11-2, 11-3, and 11-4; and a connecting portion 14 which penetrates the A-, B-, and C-layers of the wiring board 2, and through which the power supplying portions 12-1, 12-2, 12-3, and 12-4 are electrically connected to each other.
摘要翻译：并入多层布线基板2中的天线1具有放置在该多层布线基板2的A，B，C层的面上的辐射元件11-1,11-1,23〜11。接线板2; 供电部分12-1,12-12,23和12-4分别铺设在各层的表面上以向辐射元件11-1,11-2至11-3提供电力，和11 - 4; 分别铺设在层的表面上的短路部分13-1,13-13,13-3和13-4分别对辐射元件11-1,11-2,23-3和11进行接地 - 4; 以及连接部分14，其穿过布线板2的A，B和C层，电源部分12-1,12-2,23和12-4通过电连接对彼此。

46. 发明申请

US20070086145A1 Capacitor-built-in substrate and method of manufacturing the same 审中-公开
标题翻译：电容器内置基板及其制造方法
公开(公告)号：US20070086145A1
公开(公告)日：2007-04-19
申请号：US11546889
申请日：2006-10-13
申请人： Kazuyuki Kubota , Tomoharu Fujii
发明人： Kazuyuki Kubota , Tomoharu Fujii
IPC分类号： H01G4/06
CPC分类号： H05K1/186 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H05K1/0231 , H05K1/162 , H05K3/002 , H05K3/4644 , H05K2201/0175 , H05K2201/0179 , H05K2201/0187 , H05K2201/09509 , H05K2201/09909 , H05K2201/10522 , H05K2201/10636 , Y02P70/611 , H01L2924/00
摘要： A capacitor-built-in substrate of the present invention contains a capacitor which includes a lower common electrode, a plurality of dielectric portions formed on the lower common electrode to be isolated mutually and coupled electrically to the lower common electrode, an insulating layer formed between the plurality of dielectric portions and on a surrounding area, and an upper common electrode formed on the plurality of dielectric portions and the insulating layer, and coupled electrically to the plurality of dielectric portions.
摘要翻译：本发明的电容器内置基板包括电容器，该电容器包括下公共电极，形成在下公共电极上的多个电介质部分，用于互相隔离并与下公共电极电连接;绝缘层，所述多个电介质部分和周围区域，以及形成在所述多个电介质部分和所述绝缘层上的上部公共电极，并且电耦合到所述多个电介质部分。

47. 发明申请

US20070029656A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20070029656A1
公开(公告)日：2007-02-08
申请号：US11462196
申请日：2006-08-03
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H01L23/02
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/3128 , H01L23/49811 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Electronic parts 12, 13 and a terminal 14 are provided on a substrate 11, an upper surface 18A of a terminal main body portion 18 is set higher than surfaces 12A, 13A of the electronic parts 12, 13, a sealing resin is provided to expose the upper surface 18A of the terminal main body portion 18, and the terminal 14 and the wiring pattern 16 are connected directly to each other.
摘要翻译：电子部件12,13和端子14设置在基板11上，端子主体部18的上表面18A设定为高于电子部件12,13的表面12A，13A，密封树脂为设置为露出端子主体部18的上表面18A，并且端子14和布线图案16彼此直接连接。

48. 发明申请

US20070023888A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20070023888A1
公开(公告)日：2007-02-01
申请号：US11459543
申请日：2006-07-24
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H01L23/04 , H01L21/44
CPC分类号： H01L23/5227 , H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/66 , H01L2223/6677 , H01L2224/02372 , H01L2224/03 , H01L2224/0401 , H01L2224/05 , H01L2224/05024 , H01L2224/05571 , H01L2224/13023 , H01L2224/131 , H01L2924/0002 , H01L2924/19041 , H01L2924/3011 , H01Q1/2283 , H01Q9/0407 , H01Q9/0421 , H01L2924/014 , H01L2924/00012 , H01L2224/05552
摘要： A semiconductor chip 11 comprising an element formation layer 36 which is formed on a first main surface 35A of a semiconductor substrate 35 and has a semiconductor element, through electrodes 15, 16 which are electrically connected to the semiconductor element and extend through the semiconductor chip 11, and a patch antenna 33 formed on the side of a second main surface 35B of the semiconductor substrate 35 are disposed, and the patch antenna 33 is electrically connected to the through electrode 15 electrically connected to a line for power feeding of the semiconductor element.
摘要翻译：一种半导体芯片11，包括元件形成层36，其通过电连接到半导体元件并延伸穿过半导体芯片的电极15,16形成在半导体衬底35的第一主表面35A上并具有半导体元件如图11所示，并且在半导体衬底35的第二主表面35B的侧面上形成贴片天线33，并且贴片天线33电连接到电连接到半导体的供电线的通孔15 元件。

49. 发明授权

US06591494B2 Method for manufacturing a non-contact type IC card 失效
标题翻译：非接触型IC卡的制造方法
公开(公告)号：US06591494B2
公开(公告)日：2003-07-15
申请号：US09940566
申请日：2001-08-28
申请人： Shigeru Okamura , Tomoharu Fujii
发明人： Shigeru Okamura , Tomoharu Fujii
IPC分类号： H05K330
CPC分类号： G06K19/07779 , G06K19/07749 , G06K19/07783 , H01L2924/0002 , Y10T29/49071 , Y10T29/49073 , Y10T29/4913 , H01L2924/00
摘要： A non-contact type IC card includes a plane coil comprising a conductor line wound several times on substantially the same surface. The plane coil has respective terminals at the innermost and outermost ends. A semiconductor element has electrode terminals electrically connected to the terminals of the plane coil, respectively. A resin-filled portion is defined by a part of the circumference of the plane coil where spaces between adjacent loops of conductor line of the plane coil are filled with light-setting resin to maintain predetermined intervals between the adjacent conductors lines of the plane coil.
摘要翻译：非接触型IC卡包括平面线圈，该平面线圈包括在基本上相同的表面上多次缠绕的导体线。平面线圈在最内端和最外端具有相应的端子。半导体元件具有分别与平面线圈的端子电连接的电极端子。树脂填充部分由平面线圈的圆周的一部分限定，其中平面线圈的导线的相邻环之间的空间用光固化树脂填充，以保持平面线圈的相邻导体线之间的预定间隔。

50. 发明授权

US06380614B1 Non-contact type IC card and process for manufacturing same 失效
标题翻译：非接触式IC卡及其制造方法
公开(公告)号：US06380614B1
公开(公告)日：2002-04-30
申请号：US09602073
申请日：2000-06-23
申请人： Tsutomu Higuchi , Tomoharu Fujii , Shigeru Okamura , Tsuyoshi Sato , Takayoshi Wakabayashi , Masatoshi Akagawa
发明人： Tsutomu Higuchi , Tomoharu Fujii , Shigeru Okamura , Tsuyoshi Sato , Takayoshi Wakabayashi , Masatoshi Akagawa
IPC分类号： H01L2302
CPC分类号： G06K19/0775 , G06K19/07749 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/16225 , H01L2224/16227 , H01L2224/81395 , H01L2924/00014
摘要： An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.
摘要翻译： IC卡包括：具有相应端子部分的平面线圈; 半导体元件，其布置在与所述平面线圈不重叠的位置处，所述半导体元件具有电极端子; 用于将平面线圈的各个端子部分电连接到半导体元件的电极端子的装置; 以及加强框架，其设置在与半导体元件基本相同的面上，使得半导体元件被加强框架包围。

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