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41. 发明申请

US20100084176A1 PRESERVING STOPBAND CHARACTERISTICS OF ELECTROMAGNETIC BANDGAP STRUCTURES IN CIRCUIT BOARDS 失效
标题翻译：电路板电磁带结构的保护特性
公开(公告)号：US20100084176A1
公开(公告)日：2010-04-08
申请号：US12244854
申请日：2008-10-03
申请人： Tae Hong Kim
发明人： Tae Hong Kim
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , Y10T29/49155
摘要： The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a periodically patterned region having a plurality of spaced-apart patches interconnected by branches. Additional conductive layers may be included within the printed circuit board without neutralizing the bandgap by forming slots in the conductive layers in general alignment with spaces between the patches.
摘要翻译：可以通过在印刷电路板的附加导电层中选择性地形成槽来保留印刷电路板中的电磁带隙结构的阻带特性。例如，电磁带隙结构可以包括具有连续导电区域的层和具有周期性图案化区域的另一层，其具有通过分支互连的多个间隔开的贴片。附加的导电层可以包括在印刷电路板中，而不会通过在导电层中形成与填隙之间的空间对准的槽而中和带隙。

42. 发明申请

US20090011843A1 Constant Velocity Joint of Tripod Type 有权
标题翻译：三脚架类型恒速接头
公开(公告)号：US20090011843A1
公开(公告)日：2009-01-08
申请号：US12210143
申请日：2008-09-12
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/16
CPC分类号： F16D3/2055 , F16D2003/2026 , Y10S464/905
摘要： A constant velocity joint for a drive system of a vehicle comprises: a spider trunnion for transmitting torque between first and second shaft of the drive system, the spider trunnion including a spherical outer surface; and a roller assembly operatively attached on the spider trunnion, the roller assembly including an inner roller, an outer roller, and a plurality of needle rollers engaged between the inner and outer rollers, wherein the inner roller includes a tapered outer surface with a taper angle (θt), and the outer roller includes a tapered inner surface with the same taper angle (θt). The taper angle (θt) is preferably in a range from about 0.23° and to about 1.17°, and selected in consideration of both accommodating the inner roller to move without jamming in an entire effective movement range under presence of a maximum joint angle of the drive system, and preventing self separation of the roller assembly by jamming stop between the inner, outer and needle rollers due to the tapered structure of the rollers. The inner roller is preferably configured to have a ratio LL/RR1 in a range from about 0.11 to about 0.20, where LL is a distance from the center of the spider trunnion to a starting edge of the chamfer or recessed area of the inner roller at initial or neutral position thereof, and RR1 is a radius of the spherical surface of the spider trunnion.
摘要翻译：一种用于车辆的驱动系统的等速万向节包括：用于在所述驱动系统的第一和第二轴之间传递扭矩的叉形耳轴，所述蜘蛛耳轴包括球形外表面; 以及可操作地附接在所述蜘蛛耳轴上的辊组件，所述辊组件包括内辊，外辊和接合在所述内辊和外辊之间的多个针辊，其中所述内辊包括具有锥角的锥形外表面（tt），外辊包括具有相同锥角（tt）的锥形内表面。锥角（tt）优选在约0.23°至约1.17°的范围内，并且考虑到在存在最大接合角度的情况下，在内部辊容纳移动而不会在整个有效运动范围内卡住驱动系统，并且由于辊的锥形结构，防止辊组件被内，外辊和针辊之间的卡止停止自身分离。内辊优选地被配置为具有从约0.11至约0.20的范围内的LL / RR1的比率，其中LL是从蜘蛛耳轴的中心到内辊的倒角或凹入区域的起始边缘的距离初始或中性位置，RR1是蜘蛛耳轴的球面的半径。

43. 发明授权

US08830690B2 Minimizing plating stub reflections in a chip package using capacitance 有权
标题翻译：使用电容最小化芯片封装中的电镀短截线反射
公开(公告)号：US08830690B2
公开(公告)日：2014-09-09
申请号：US12237444
申请日：2008-09-25
申请人： Bhyrav M Mutnury , Moises Cases , Nanju Na , Tae Hong Kim
发明人： Bhyrav M Mutnury , Moises Cases , Nanju Na , Tae Hong Kim
IPC分类号： H05K1/18 , H05K1/02 , H05K1/16 , H05K3/24
CPC分类号： H01L21/4853 , C25D5/02 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H05K1/0231 , H05K1/162 , H05K3/242 , H05K2203/049 , H01L2924/00012 , H01L2924/00
摘要： Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.
摘要翻译：本发明的实施例涉及通过连接开放式电镀短截线和接地之间的电容来将高频芯片封装中的谐振频率从工作频率移开。一个实施例提供了用于将芯片与印刷电路板接口的多层基板。第一外层提供了芯片安装位置。信号互连与芯片安装位置间隔开，并且信号迹线从芯片安装位置附近延伸到信号互连。安装在芯片安装位置的芯片可以通过引线键合连接到信号迹线。电镀短截线从信号互连延伸到衬底的周围。电容器用于将电镀端子电容耦合到接地层。

44. 发明授权

US08444495B2 Cross groove type constant velocity joint 有权
标题翻译：十字槽型恒速接头
公开(公告)号：US08444495B2
公开(公告)日：2013-05-21
申请号：US12582602
申请日：2009-10-20
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/223
CPC分类号： F16C1/04 , F16D3/227
摘要： A constant velocity joint for a drive system includes an outer joint member and an inner joint member, each having a plurality of ball grooves, the ball grooves consisting of a first group of grooves of a skewed groove shape with a first skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of the outer and inner joint members, and a second group of grooves of a skewed groove shape with a second skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of the outer and inner joint members, the second skew angle less than the first skew angle. In addition to the differentiated skew angles, the contact angles of the balls in the first and second group of grooves may also be differentiated.
摘要翻译：用于驱动系统的恒速接头包括外接头构件和内接头构件，每个都具有多个球槽，所述球槽由具有第一偏斜角度而不是零的倾斜槽形状的第一组槽组成并且相对于外接头构件和内接头构件的旋转轴线相反的方向交替地布置，并且具有倾斜槽形状的第二组沟槽形状，具有除了零之外的第二歪斜角度，并且相对于外接头构件和内接头构件的旋转，第二歪斜角小于第一歪斜角。除了不同的偏斜角之外，第一组和第二组凹槽中的球的接触角也可以是不同的。

45. 发明授权

US08409020B2 Cross groove type constant velocity joint with composite groove patterns 有权
标题翻译：具有复合槽图案的十字槽型等速万向节
公开(公告)号：US08409020B2
公开(公告)日：2013-04-02
申请号：US13477186
申请日：2012-05-22
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/226
CPC分类号： F16D3/223 , F16D3/229 , F16D3/24
摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair.
摘要翻译：用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽构件与所述外接头构件的相应的外球槽大致交叉对地联接。

46. 发明授权

US08382600B2 Cross groove type constant velocity joint with composite groove patterns 有权
标题翻译：具有复合槽图案的十字槽型等速万向节
公开(公告)号：US08382600B2
公开(公告)日：2013-02-26
申请号：US12563029
申请日：2009-09-18
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/226
CPC分类号： F16D3/223 , F16D3/229 , F16D3/24
摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair; and a cage having circumferentially displaced cage windows to accommodate a plurality of balls therein. The groove patterns of the ball grooves can be a combination of skewed grooves and non-linear grooves, a combination of non-linear grooves such as a curved groove or a compositely shaped groove, or a combination of linear grooves and non-linear grooves.
摘要翻译：用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽构件与所述外接头构件的相应的外球槽大致交叉对地联接; 以及笼，其具有周向移位的笼窗，以容纳其中的多个球。球槽的凹槽图案可以是斜槽和非直线槽的组合，诸如弯曲凹槽或复合形状凹槽的非线性凹槽的组合，或者线性凹槽和非直线凹槽的组合。

47. 发明申请

US20130008696A1 CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE 有权
标题翻译：具有最小化焊盘电容的多层电路基板
公开(公告)号：US20130008696A1
公开(公告)日：2013-01-10
申请号：US13614314
申请日：2012-09-13
申请人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
发明人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
IPC分类号： H05K1/00
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L2224/16 , H01L2224/16235 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H05K1/0231 , H05K1/024 , H05K1/0251 , H05K1/113 , H05K1/144 , H05K2201/0187 , H05K2201/041 , H05K2201/09481 , H05K2201/09718 , H05K2201/10734 , Y10T29/49124 , Y10T29/49151 , H01L2924/00
摘要： A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
摘要翻译：多层互连衬底具有至少两个间隔开的金属层，每个金属层上具有导电焊盘。在金属层之间放置两种不同类型的绝缘层。这种放置使得两种不同类型的绝缘层中的一种被放置在导电焊盘之间，另一种类型的绝缘层被放置在两个间隔开的金属层之间。

48. 发明申请

US20130003335A1 CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE 审中-公开
标题翻译：具有最小化焊盘电容的无线多层电路基板
公开(公告)号：US20130003335A1
公开(公告)日：2013-01-03
申请号：US13612459
申请日：2012-09-12
申请人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
发明人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
IPC分类号： H05K7/06
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L2224/16 , H01L2224/16235 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H05K1/0231 , H05K1/024 , H05K1/0251 , H05K1/113 , H05K1/144 , H05K2201/0187 , H05K2201/041 , H05K2201/09481 , H05K2201/09718 , H05K2201/10734 , Y10T29/49124 , Y10T29/49151 , H01L2924/00
摘要： A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
摘要翻译：多层互连衬底具有至少两个间隔开的金属层，每个金属层上具有导电焊盘。在金属层之间放置两种不同类型的绝缘层。这种放置使得两种不同类型的绝缘层中的一种被放置在导电焊盘之间，另一种类型的绝缘层被放置在两个间隔开的金属层之间。

49. 发明申请

US20120238370A1 CROSS GROOVE TYPE CONSTANT VELOCITY JOINT WITH COMPOSITE GROOVE PATTERNS 有权
标题翻译：具有复合沟槽图案的交叉型恒定速度接头
公开(公告)号：US20120238370A1
公开(公告)日：2012-09-20
申请号：US13477186
申请日：2012-05-22
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/24
CPC分类号： F16D3/223 , F16D3/229 , F16D3/24
摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair.
摘要翻译：用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽构件与所述外接头构件的相应的外球槽大致交叉对地联接。

50. 发明申请

US20110273855A1 POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS 有权
标题翻译：电力分配系统的电力和地面VIAS
公开(公告)号：US20110273855A1
公开(公告)日：2011-11-10
申请号：US12776888
申请日：2010-05-10
申请人： Tae Hong Kim , Sang Y. Lee , Nam H. Pham
发明人： Tae Hong Kim , Sang Y. Lee , Nam H. Pham
IPC分类号： H05K7/00 , H05K1/16 , H05K3/10 , H05K1/11
CPC分类号： H05K3/40 , H01L2224/16225 , H01L2924/19105 , H05K1/0265 , H05K1/115 , H05K2201/09854 , Y10T29/49155 , Y10T29/49165
摘要： A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape.
摘要翻译：用于为功率分配系统提供电源和接地通孔的系统包括微电子封装上的第一和第二导电层。导电层可以包括一个或多个导电部件，例如但不限于用于电连接到电子部件的电源平面，接地平面，焊盘，迹线等。通孔可以电连接第一和第二导电层。通孔可以具有至少三个部分重叠形状的横截面。每个形状部分地与至少两个其他形状重叠。形状可以是例如圆形，三角形，矩形，正方形，多边形，菱形或任何其它形状。

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