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41. 发明授权

US07543264B2 High frequency signal transmission line having ground line blocks to reduce noise 失效
标题翻译：高频信号传输线具有接地线模块以降低噪声
公开(公告)号：US07543264B2
公开(公告)日：2009-06-02
申请号：US11222398
申请日：2005-09-07
申请人： Young Woo Kim , Chang Myung Ryu , Han Kim , Woo Lim Chae
发明人： Young Woo Kim , Chang Myung Ryu , Han Kim , Woo Lim Chae
IPC分类号： G06F17/50 , H02H7/00
CPC分类号： H05K1/0219 , H05K2201/09618
摘要： A high frequency signal transmission line having reduced noise. Particularly, a signal transmission line of the current invention has reduced radiation noise and reflection noise, because a conventional ground guard fence line disposed between signal lines is separated into a plurality of ground line blocks that are spaced apart from each other to shield against noise.
摘要翻译：具有降低噪声的高频信号传输线。特别地，本发明的信号传输线由于将设置在信号线之间的传统的接地保护栅栏线分离成彼此间隔开的多个接地线块以防止噪声，所以本发明的信号传输线具有降低的辐射噪声和反射噪声。

42. 外观设计

USD593132S1 MP3 player 有权
公开(公告)号：USD593132S1
公开(公告)日：2009-05-26
申请号：US29327009
申请日：2008-10-29
申请人： Han Kim
设计人： Han Kim

43. 发明申请

US20080314863A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR AND METHOD OF FABRICATING SAME 有权
标题翻译：印刷电路板，包括嵌入式电容器及其制造方法
公开(公告)号：US20080314863A1
公开(公告)日：2008-12-25
申请号：US12203081
申请日：2008-09-02
申请人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
发明人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
IPC分类号： C23F1/00
CPC分类号： H05K1/162 , H05K3/0047 , H05K3/427 , H05K2201/0187 , H05K2201/09645 , H05K2201/09836 , H05K2201/09981 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156
摘要： Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
摘要翻译：公开了一种包括嵌入式电容器的PCB及其制造方法。长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。

44. 发明申请

US20080196927A1 Working panel for multilayer printed circuit board 审中-公开
标题翻译：多层印刷电路板工作面板
公开(公告)号：US20080196927A1
公开(公告)日：2008-08-21
申请号：US12004421
申请日：2007-12-21
申请人： Jae Joon Lee , Han Kim , Il Soung Yoon , Seung Hyun Cho
发明人： Jae Joon Lee , Han Kim , Il Soung Yoon , Seung Hyun Cho
IPC分类号： H05K1/00
CPC分类号： H05K3/0097 , H05K1/0271 , H05K3/0052 , H05K3/4644 , H05K2201/068 , H05K2201/09136 , H05K2203/1572
摘要： Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in the opposite order with respect to each other, are appropriately disposed, by which the working panel can resist warpage due to thermal stress applied during the substrate fabrication process, thus imparting industrially useful effects that promise improvements in the standardization, productivity and yield of products.
摘要翻译：公开了一种用于多层印刷电路板的工作面板。用于多层印刷电路板的工作面板被构造成使得具有电路层和绝缘层的第一和第二条带以相对于彼此相反的顺序层叠在芯的上侧和下侧上适当设置，通过该工作面板可以抵抗由于在基板制造工艺期间施加的热应力而产生的翘曲，从而赋予产品的标准化，生产率和产量提高的工业上有用的效果。

45. 发明申请

US20080185179A1 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US20080185179A1
公开(公告)日：2008-08-07
申请号：US12010872
申请日：2008-01-30
申请人： Han Kim , Jae-Joon Lee , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Jae-Joon Lee , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H05K1/11
CPC分类号： H05K1/0236 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/116 , H05K1/165 , H05K2201/09309 , H05K2201/09454 , H05K2201/09663 , H01L2224/0401
摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.
摘要翻译：公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

46. 发明授权

US07408120B2 Printed circuit board having axially parallel via holes 有权
标题翻译：具有轴向平行通孔的印刷电路板
公开(公告)号：US07408120B2
公开(公告)日：2008-08-05
申请号：US11042360
申请日：2005-01-24
申请人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Han Kim
发明人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Han Kim
IPC分类号： H01R12/04
CPC分类号： H05K1/115 , H05K3/429 , H05K3/4602 , H05K2201/09536 , H05K2201/096 , H05K2201/09809
摘要： Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.
摘要翻译：公开了一种PCB，其具有轴向平行的通孔，其中用作接地的外部接地通孔围绕用于PCB中的电路连接的通孔形成，从而最小化由通孔引起的噪声的影响。

47. 发明申请

US20080057756A1 Printed circuit board having connectors 有权
标题翻译：具有连接器的印刷电路板
公开(公告)号：US20080057756A1
公开(公告)日：2008-03-06
申请号：US11896298
申请日：2007-08-30
申请人： Han Kim , Yang Je Lee , Sang Jin Oh , Mi Ja Han
发明人： Han Kim , Yang Je Lee , Sang Jin Oh , Mi Ja Han
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01R12/58 , H05K3/365 , H05K2201/10295
摘要： Disclosed herein is a Printed Circuit Board (PCB) having connectors. The PCB includes a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.
摘要翻译：本文公开了具有连接器的印刷电路板（PCB）。 PCB包括端子部分和连接器引脚。端子部分形成在PCB的一端并设有端子孔。连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到设置在目标PCB中用于连接的焊盘部分。因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

48. 外观设计

USD555085S1 Battery pack 有权
公开(公告)号：USD555085S1
公开(公告)日：2007-11-13
申请号：US29269146
申请日：2006-11-22
申请人： Han Kim
设计人： Han Kim

49. 发明申请

US20070238865A1 1-Alpha-Halo-2,2-Difluoro-2-Deoxy-D-Ribofuranose Derivatives and Process for the Preparation Thereof 失效
标题翻译： 1-α-卤代-2,2-二氟-2-脱氧-D-呋喃核糖衍生物及其制备方法
公开(公告)号：US20070238865A1
公开(公告)日：2007-10-11
申请号：US11572790
申请日：2005-06-21
申请人： Jaeheon Lee , Gha Park , Moonsub Lee , Han Kim , Hyo-Jeong Bang , Young-Kil Chang , Gwan Lee
发明人： Jaeheon Lee , Gha Park , Moonsub Lee , Han Kim , Hyo-Jeong Bang , Young-Kil Chang , Gwan Lee
IPC分类号： C07H15/00
CPC分类号： C07H3/08
摘要： 1-α-halo-2,2-difluoro-2-deoxy-D-ribofuranose derivative of formula (I) having the 3-hydroxy group protected with a biphenylcarbonyl group is a solid which can be easily purified by a simple procedure such as recrystallization, and therefore, it can be advantageously used as an intermediate in the preparation of gemcitabine in a large scale. Further, the 1-α-halo-2,2-difluoro-2-deoxy-D-ribofuranose derivative of formula (I) can be prepared with high stereoselectivity using the compound of formula (V) as an intermediate.
摘要翻译：具有用联苯基羰基保护的3-羟基的式（I）的1-α-卤代-2,2-二氟-2-脱氧-D-呋喃核糖衍生物是可以通过简单的方法容易地纯化的固体，例如重结晶，因此可以有利地用作大量制备吉西他滨的中间体。此外，式（I）的1-α-卤代-2,2-二氟-2-脱氧-D-呋喃核糖衍生物可以使用式（V）化合物作为中间体以高立体选择性制备。

50. 发明申请

US20070111380A1 Fabricating method of printed circuit board having embedded component 审中-公开
标题翻译：具有嵌入式元件的印刷电路板的制造方法
公开(公告)号：US20070111380A1
公开(公告)日：2007-05-17
申请号：US11598141
申请日：2006-11-13
申请人： Suk-Hyeon Cho , Chang-Sup Ryu , Han-Seo Cho , Han Kim
发明人： Suk-Hyeon Cho , Chang-Sup Ryu , Han-Seo Cho , Han Kim
IPC分类号： H01L21/00
CPC分类号： H05K1/162 , H01F17/0033 , H01F41/046 , H05K1/165 , H05K1/167 , H05K2201/0355 , H05K2201/086 , H05K2201/09509 , H05K2201/09881 , H05K2203/0361
摘要： A method of fabricating a printed circuit board having embedded components is disclosed. The method of fabricating a printed circuit board having embedded components according to an embodiment of the present invention comprises stacking a first conductive layer and a second conductive layer on a substrate in order, forming a hole in the second conductive layer and filling with dielectric material, stacking a third conductive layer on the second conductive layer and removing portions to form an upper electrode located on the dielectric material and a pad electrically connected with the first conductive layer, and stacking an insulation layer on the third conductive layer and forming a via hole and an outer layer circuit electrically connected with the upper electrode and the pad, so that it is easy to process the dielectric material to have a uniform thickness, and the capacitor and the resistor can be implemented simultaneously.
摘要翻译：公开了一种制造具有嵌入式部件的印刷电路板的方法。根据本发明的实施例的制造具有嵌入部件的印刷电路板的方法包括在基板上层叠第一导电层和第二导电层，以在第二导电层中形成孔并填充电介质材料，在所述第二导电层上堆叠第三导电层并去除部分以形成位于所述电介质材料上的上电极和与所述第一导电层电连接的焊盘，以及在所述第三导电层上堆叠绝缘层并形成通孔，以及与上电极和焊盘电连接的外层电路，使得容易将电介质材料加工成具有均匀的厚度，并且可以同时实现电容器和电阻器。

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