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    • 42. 发明授权
    • Scratch repairing processing method and scanning probe microscope (SPM) used therefor
    • 刮擦修复处理方法和扫描探针显微镜(SPM)
    • US07285792B2
    • 2007-10-23
    • US11086812
    • 2005-03-21
    • Naoya WatanabeOsamu Takaoka
    • Naoya WatanabeOsamu Takaoka
    • G01B5/28
    • G03F1/72G01Q80/00
    • A sample to be processed is disposed within a processing cell which contains a liquid. Scratch processing using a scanning probe microscope is performed within the liquid so that chips or shavings removed from the sample scatter within the liquid rather than collecting on the surface of the sample. The processing cell has a supply port and a discharge port so that new liquid can be supplied within the cell through the supply port after the termination of the scratch processing to clean the cell. In this manner, chips or shavings generated by scratch processing a defect portion of the sample can be removed completely without being collected at the surface of a sample despite the surface tension of adsorbed water existing on the sample surface and/or electrostatic charges caused by friction.
    • 要处理的样品设置在含有液体的处理单元内。 在液体内进行使用扫描探针显微镜的划痕处理,使得从样品中除去的碎屑或碎屑在液体内分散而不是收集在样品的表面上。 处理单元具有供给口和排出口,使得能够在暂时处理结束之后通过供给口在电池内供给新的液体,以清洁电池。 以这种方式,尽管样品表面存在吸附水的表面张力和/或由摩擦引起的静电电荷,但是通过刮擦处理产生的切屑或刨屑可以被完全去除而不被收集在样品的表面 。
    • 45. 发明授权
    • Scanning probe device and processing method by scanning probe
    • 通过扫描探头扫描探针装置和处理方法
    • US07107826B2
    • 2006-09-19
    • US11096875
    • 2005-04-01
    • Naoya WatanabeOsamu Takaoka
    • Naoya WatanabeOsamu Takaoka
    • H01J37/352
    • G01Q60/32G01Q80/00G03F1/72
    • There is provided a device in which a probe can be used for both of observation and correction, and which can, even if a next generation photomask of ultra minute structure is made an object, perform a desired processing without injuring a normal portion in a process of obtaining information of a position and a shape of a defect part, and without impairing the probe also at a processing time. It has been adapted such that, at an observation time, a contact pressure between a probe and a mask is reduced to 0.1 nN by applying a vibration of 1 kHz to 1 MHz to the probe. It has been adapted such that a cantilever used in the present invention is formed by a silicon material of 100–600 μm in length and 5–50 μm in thickness and, at the observation time, the probe contacts with the mask at the contact pressure of 0.1 nN and, at the processing time, a defect correction can be performed by causing the probe to contact with the mask at the contact pressure of 10 nN to 1 mN.
    • 提供了一种可以将探头用于观察和校正的装置,并且即使下一代超微小结构的光掩模被制成物体也可以进行所需的处理而不损害处理中的正常部分 获得缺陷部分的位置和形状的信息,并且在处理时间也不损害探针。 已经适应使得在观察时间,通过向探针施加1kHz至1MHz的振动,将探针和掩模之间的接触压力降低至0.1nN。 已经适应使得本发明中使用的悬臂由长度为100〜600μm,厚度为5-50μm的硅材料形成,并且在观察时刻,探针以接触压力与掩模接触 0.1nN,并且在处理时间,可以通过使探针以10nN至1mN的接触压力与掩模接触来进行缺陷校正。
    • 46. 发明授权
    • Semiconductor memory device having easily redesigned memory capacity
    • 半导体存储器件具有容易重新设计的存储容量
    • US07009906B2
    • 2006-03-07
    • US10721999
    • 2003-11-26
    • Naoya Watanabe
    • Naoya Watanabe
    • G11C8/00
    • G11C8/12
    • Sub-blocks SBA0–SBA3, SBB0–SBB3, SBC0–SBC3, SBD0–SBD3 respectively form four groups. In each group, a refresh end signal REF_END is successively transferred to the next sub-block. Therefore, when a refresh counter of the number of bits corresponding to the number of word lines present in a sub-block is provided in a central control circuit, a memory capacity can easily be redesigned by changing the number of sub-blocks and changing a group configuration of sub-blocks. As a result, there can be provided a memory core for embedded memory in which a memory capacity can easily be changed and a refresh control-related circuitry can easily be changed.
    • 子块SBA 0 -SBA 3,SBB 0 -SBB 3,SBC 0 -SBC 3,SBD 0 -SBD 3分别形成四组。 在每组中,刷新结束信号REF_END被依次传送到下一个子块。 因此,当在中央控制电路中设置与子块中存在的字线数相对应的位数的刷新计数器时,可以通过改变子块的数量并改变一个位置来容易地重新设计存储容量 子组的组配置。 结果,可以提供一种用于嵌入式存储器的存储器核,其中存储器容量可以容易地改变,并且刷新控制相关电路可以容易地改变。
    • 50. 发明授权
    • Circuit module
    • 电路模块
    • US06392897B1
    • 2002-05-21
    • US09131688
    • 1998-08-10
    • Yasunobu NakaseTsutomu YoshimuraYoshikazu MorookaNaoya Watanabe
    • Yasunobu NakaseTsutomu YoshimuraYoshikazu MorookaNaoya Watanabe
    • H01R1216
    • H05K1/14H05K1/117H05K3/403H05K2201/09481H05K2201/10159H05K2201/10689H05K2203/1572
    • A circuit module includes a connector terminal (4A) provided on a front surface of a printed wiring board (2) and connected to a data pin (DQt) of a memory IC (3) through an interconnect line (5a). A conductive connector terminal (4c) corresponds to the connector terminal (4a) and is provided on a back surface of the printed wiring board (2). A through hole (16) extends between part of the front surface of the printed wiring board (2) where the connector terminal (4a) is formed and part of the back surface thereof where the conductive connector terminal (4c) is formed. A conductor fills the through hole (16), thereby suppressing skews resulting from a difference in interconnect line length on the circuit module and decreasing a stub capacitance to achieve the reduction in power consumption.
    • 电路模块包括设置在印刷电路板(2)的前表面并通过互连线(5a)连接到存储器IC(3)的数据引脚(DQt)的连接器端子(4A)。 导电连接器端子(4c)对应于连接器端子(4a)并且设置在印刷电路板(2)的背面上。 在形成有连接器端子(4a)的印刷电路板(2)的前表面的一部分和形成导电连接器端子(4c)的背面的一部分之间延伸有一个通孔(16)。 导体填充通孔(16),从而抑制由电路模块上的互连线长度的差异引起的偏移,并且减小短截线电容以实现功耗的降低。