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    • 45. 发明授权
    • Hardmask process for forming a reverse tone image using polysilazane
    • 使用聚硅氮烷形成反向色调图像的硬掩模工艺
    • US08084186B2
    • 2011-12-27
    • US12368720
    • 2009-02-10
    • David AbdallahRalph R. DammelYusuke TakanoJin LiKazunori Kurosawa
    • David AbdallahRalph R. DammelYusuke TakanoJin LiKazunori Kurosawa
    • G03F7/00G03F7/004G03F7/26G03F7/40
    • G03F7/40H01L21/02123H01L21/02222H01L21/02282H01L21/0234H01L21/0337H01L21/31138H01L21/3125Y10T428/24802
    • The present invention relates to a process for forming an reverse tone image on a device comprising; a) forming an optional absorbing organic underlayer on a substrate; b) forming a coating of a photoresist over the underlayer; c) forming a photoresist pattern; d) forming a polysilazane coating over the photoresist pattern from a polysilazane coating composition, where the polysilazane coating is thicker than the photoresist pattern, and further where the polysilazane coating composition comprises a silicon/nitrogen polymer and an organic coating solvent; e) etching the polysilazane coating to remove the polysilazane coating at least up to a level of the top of the photoresist such that the photoresist pattern is revealed; and, f) dry etching to remove the photoresist and the underlayer which is beneath the photoresist, thereby forming an opening beneath where the photoresist pattern was present.The invention further relates to a product of the above process and to a microelectronic device made from using the above process.
    • 本发明涉及一种在装置上形成反向色调图像的方法,包括: a)在衬底上形成可选的吸收有机底层; b)在底层上形成光致抗蚀剂的涂层; c)形成光致抗蚀剂图案; d)从聚硅氮烷涂料组合物在光致抗蚀剂图案上形成聚硅氮烷涂层,其中聚硅氮烷涂层比光致抗蚀剂图案厚,此外聚硅氮烷涂层组合物包含硅/氮聚合物和有机涂层溶剂; e)蚀刻聚硅氮烷涂层以除去聚硅氮烷涂层至少高达光致抗蚀剂顶部的水平,使得光刻胶图案显露出来; 以及f)干蚀刻以除去光致抗蚀剂下面的光致抗蚀剂和底层,从而在存在光致抗蚀剂图案的下方形成开口。 本发明还涉及上述方法的产品和使用上述方法制造的微电子器件。
    • 46. 发明申请
    • Hardmask Process for Forming a Reverse Tone Image Using Polysilazane
    • 使用聚硅氮烷形成反向色调图像的硬掩模工艺
    • US20100203299A1
    • 2010-08-12
    • US12368720
    • 2009-02-10
    • David AbdallahRalph R. DammelYusuke TakanoJin LiKazunori Kurosawa
    • David AbdallahRalph R. DammelYusuke TakanoJin LiKazunori Kurosawa
    • B32B3/10G03F7/20
    • G03F7/40H01L21/02123H01L21/02222H01L21/02282H01L21/0234H01L21/0337H01L21/31138H01L21/3125Y10T428/24802
    • The present invention relates to a process for forming an reverse tone image on a device comprising; a) forming an optional absorbing organic underlayer on a substrate; b) forming a coating of a photoresist over the underlayer; c) forming a photoresist pattern; d) forming a polysilazane coating over the photoresist pattern from a polysilazane coating composition, where the polysilazane coating is thicker than the photoresist pattern, and further where the polysilazane coating composition comprises a silicon/nitrogen polymer and an organic coating solvent; e) etching the polysilazane coating to remove the polysilazane coating at least up to a level of the top of the photoresist such that the photoresist pattern is revealed; and, f) dry etching to remove the photoresist and the underlayer which is beneath the photoresist, thereby forming an opening beneath where the photoresist pattern was present.The invention further relates to a product of the above process and to a microelectronic device made from using the above process.
    • 本发明涉及一种在装置上形成反向色调图像的方法,包括: a)在衬底上形成任选的吸收有机底层; b)在底层上形成光致抗蚀剂的涂层; c)形成光致抗蚀剂图案; d)从聚硅氮烷涂料组合物在光致抗蚀剂图案上形成聚硅氮烷涂层,其中聚硅氮烷涂层比光致抗蚀剂图案厚,此外聚硅氮烷涂层组合物包含硅/氮聚合物和有机涂层溶剂; e)蚀刻聚硅氮烷涂层以除去聚硅氮烷涂层至少高达光致抗蚀剂顶部的水平,使得光刻胶图案显露出来; 以及f)干蚀刻以除去光致抗蚀剂下面的光致抗蚀剂和底层,从而在存在光致抗蚀剂图案的下方形成开口。 本发明还涉及上述方法的产品和使用上述方法制造的微电子器件。