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41. 发明授权

US08615974B2 Bagging apparatus 失效
标题翻译：装袋装置
公开(公告)号：US08615974B2
公开(公告)日：2013-12-31
申请号：US12892238
申请日：2010-09-28
申请人： Nobuhiro Suzuki , Michinori Watanabe , Shuichi Iribe , Seiichi Akutsu
发明人： Nobuhiro Suzuki , Michinori Watanabe , Shuichi Iribe , Seiichi Akutsu
IPC分类号： B65B43/26
CPC分类号： B65B43/30 , B65B5/045 , B65B25/16
摘要： An article bagging apparatus designed to reduce impacts caused by stopping at advance and retraction terminal points. The article bagging apparatus has an upper scoop (12) and a lower scoop (14) rectilinearly movable forward and backward together. The upper and lower scoops are advanced and inserted into a bag through an opening thereof, and the upper scoop is displaced upward, thereby expanding the bag vertically. In addition, the upper and lower scoops are retracted to pull the expanded bag, thereby allowing an article placed in the path of retraction to enter the bag. The article bagging apparatus includes a coupling unit (22) that allows the upper scoop to be displaced vertically and that causes the upper and lower scoops to move together forward and backward, an upper guide rail (24) supporting the upper scoop horizontally movably, and an upper drive unit (26) vertically moving the upper guide rail.
摘要翻译：一种用于减少在前进和后退终点停止引起的冲击的物品装袋装置。该物品装袋装置具有一个上下勺子（12）和一个下勺子（14），它们可一起向前和向后一起向前和向后移动。上下勺先进，通过其开口插入袋中，上勺向上移动，从而使袋垂直膨胀。此外，上下勺缩回以拉伸膨胀袋，从而允许放置在缩回路径中的物品进入袋中。该物品装袋装置包括一个联接单元（22），该联接单元允许上勺垂直移动，并使上勺和下勺一起向前和向后一起移动，一个可上下移动地支撑上勺的上导轨（24），以及上部驱动单元（26）垂直移动上部导轨。

42. 发明授权

US08380408B2 Speed change control system for industrial vehicle 有权
标题翻译：工业车辆变速控制系统
公开(公告)号：US08380408B2
公开(公告)日：2013-02-19
申请号：US12516965
申请日：2007-11-30
申请人： Koji Hyodo , Tetsuji Tanaka , Eiichi Sakai , Nobuhiro Suzuki , Koji Takano
发明人： Koji Hyodo , Tetsuji Tanaka , Eiichi Sakai , Nobuhiro Suzuki , Koji Takano
IPC分类号： F16H61/00 , G06F19/00
CPC分类号： F16H61/0213 , E02F9/2079 , E02F9/2083 , E02F9/2253 , F16H59/44 , F16H59/68 , F16H2059/467 , Y10T477/60 , Y10T477/62427 , Y10T477/6934
摘要： A speed change control system for an industrial vehicle includes: a speed ratio detecting unit that detects a speed ratio of speeds of an input shaft and of an output shaft of a torque converter; a torque converter speed ratio-based speed changer that shifts up or shifts down a speed stage of a transmission 3 in response to the detected speed ratio; a vehicle speed detection unit that detects a speed of the vehicle; a mode selection unit that selects any one of an L-mode and an H-mode; and a speed change control unit that permits an upshift provided that the vehicle speed is equal to or higher than a first predetermined value when the L-mode is selected whereas permits the upshift provided that the vehicle speed is higher than another predetermined value which is larger that the predetermined value when the H-mode is selected.
摘要翻译：一种用于工业车辆的变速控制系统包括：速比检测单元，其检测变矩器的输入轴和输出轴的速度的速度比; 基于变速器速比的变速器，其响应于所检测的速比而向变速器3的转速级向上或向下移动; 车速检测单元，其检测车辆的速度; 模式选择单元，其选择L模式和H模式中的任一个; 以及变速控制单元，其允许升档，条件是当选择L模式时，车速等于或高于第一预定值，而允许升档，只要车速高于另一个较大的预定值选择H模式时的预定值。

43. 发明授权

US08288247B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08288247B2
公开(公告)日：2012-10-16
申请号：US13402383
申请日：2012-02-22
申请人： Satoshi Taniguchi , Nobuhiro Suzuki , Hideki Ono
发明人： Satoshi Taniguchi , Nobuhiro Suzuki , Hideki Ono
IPC分类号： H01L21/46
CPC分类号： H01L29/205 , H01L21/02392 , H01L21/02463 , H01L21/02543 , H01L21/30612 , H01L29/66318 , H01L33/0079 , H01L33/02
摘要： There is provided a method of manufacturing a semiconductor device which, in the case where an InP-based device is formed with a sacrificial layer in between, is capable of obtaining better device characteristics than those in the case where an AlAs single layer is used as the sacrificial layer, and which does not have the possibility that the device layer is etched together with the sacrificial layer during etching of the sacrificial layer. A method of manufacturing a semiconductor device includes: a formation step of forming a sacrificial layer which is pseudomorphic to InP on an InP substrate, and then forming an InP-based device layer on the sacrificial layer; and a separation step of separating the InP substrate and the device layer from each other by etching the sacrificial layer.
摘要翻译：提供一种制造半导体器件的方法，其中在其间形成有牺牲层的基于InP的器件的情况下，与使用AlAs单层的情况相比，能够获得更好的器件特性牺牲层，并且在蚀刻牺牲层期间不具有将牺牲层与器件层一起蚀刻的可能性。一种制造半导体器件的方法包括：形成步骤，在InP衬底上形成与InP伪造的牺牲层，然后在牺牲层上形成基于InP的器件层; 以及通过蚀刻牺牲层将InP衬底和器件层彼此分离的分离步骤。

44. 发明授权

US08240457B2 Bread conveying apparatus 有权
标题翻译：面包输送设备
公开(公告)号：US08240457B2
公开(公告)日：2012-08-14
申请号：US12929167
申请日：2011-01-05
申请人： Nobuhiro Suzuki , Shuichi Iribe , Michinori Watanabe , Seiichi Akutsu
发明人： Nobuhiro Suzuki , Shuichi Iribe , Michinori Watanabe , Seiichi Akutsu
IPC分类号： B65G47/31
CPC分类号： B65G47/31 , B65G47/841
摘要： A bread conveying apparatus comprises: a first discharge conveyer for conveying bread, the first discharge conveyer disposed along a conveying path on which the bread is conveyed; and a second discharge conveyer for conveying the bread, the first discharge conveyer disposed along the conveying path and having a common region that partially overlaps with a region on the conveying path where the first discharge conveyer runs, wherein the first discharge conveyer has a first flight for urging the bread, and the second discharge conveyer has a second flight for urging the bread, and wherein a conveying speed at which the bread is conveyed by the second discharge conveyer is different from a conveying speed at which the bread is conveyed by the first discharge conveyer.
摘要翻译：面包输送装置包括：用于输送面包的第一排出输送机，沿着输送面包的输送路径设置的第一排出输送机; 以及用于输送面包的第二排放输送机，所述第一排放输送机沿着所述输送路径设置并且具有与所述第一排放输送机运行的输送路径上的区域部分重叠的公共区域，其中所述第一排出输送机具有第一飞行用于推动面包，并且第二排出输送机具有用于推动面包的第二飞行，并且其中由第二排出输送机输送面包的输送速度不同于通过第一排出口传送面包的输送速度排放输送机。

45. 发明申请

US20120149179A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20120149179A1
公开(公告)日：2012-06-14
申请号：US13402383
申请日：2012-02-22
申请人： Satoshi Taniguchi , Nobuhiro Suzuki , Hideki Ono
发明人： Satoshi Taniguchi , Nobuhiro Suzuki , Hideki Ono
IPC分类号： H01L21/20
CPC分类号： H01L29/205 , H01L21/02392 , H01L21/02463 , H01L21/02543 , H01L21/30612 , H01L29/66318 , H01L33/0079 , H01L33/02
摘要： There is provided a method of manufacturing a semiconductor device which, in the case where an InP-based device is formed with a sacrificial layer in between, is capable of obtaining better device characteristics than those in the case where an AlAs single layer is used as the sacrificial layer, and which does not have the possibility that the device layer is etched together with the sacrificial layer during etching of the sacrificial layer. A method of manufacturing a semiconductor device includes: a formation step of forming a sacrificial layer which is pseudomorphic to InP on an InP substrate, and then forming an InP-based device layer on the sacrificial layer; and a separation step of separating the InP substrate and the device layer from each other by etching the sacrificial layer.
摘要翻译：提供一种制造半导体器件的方法，其中在其间形成有牺牲层的基于InP的器件的情况下，与使用AlAs单层的情况相比，能够获得更好的器件特性牺牲层，并且在蚀刻牺牲层期间不具有将牺牲层与器件层一起蚀刻的可能性。一种制造半导体器件的方法包括：形成步骤，在InP衬底上形成与InP伪造的牺牲层，然后在牺牲层上形成基于InP的器件层; 以及通过蚀刻牺牲层将InP衬底和器件层彼此分离的分离步骤。

46. 发明申请

US20120067705A1 Bread packaging system 有权
标题翻译：面包包装系统
公开(公告)号：US20120067705A1
公开(公告)日：2012-03-22
申请号：US12929165
申请日：2011-01-05
申请人： Nobuhiro Suzuki , Shuichi Iribe , Michinori Watanabe , Seiichi Akutsu
发明人： Nobuhiro Suzuki , Shuichi Iribe , Michinori Watanabe , Seiichi Akutsu
IPC分类号： B65G17/36
CPC分类号： B65B25/16
摘要： A bread packaging system comprising: a movable member on which a scoop for holding a packaging member to package bread is mounted; a guide member for defining a moving path along which the movable member is moved; a reciprocating motion mechanism having an endless revolving member for reciprocating the movable member along the guide member; and a link member for linking the endless revolving member with the movable member, wherein the bread packaging system is configured to reciprocate the movable member along the guide member by revolving the endless revolving member in one direction.
摘要翻译：一种面包包装系统，包括：可移动部件，其上安装有用于保持包装部件以包装面包的勺子; 引导构件，用于限定可移动构件沿其移动的移动路径; 往复运动机构，其具有用于使可动构件沿导向件往复运动的环形旋转构件; 以及用于将环形旋转构件与可动构件连接的连杆构件，其中，所述面包包装系统构造成通过使所述环形旋转构件沿一个方向旋转来使所述可动构件沿着所述引导构件往复运动。

47. 发明申请

US20100285625A1 LIGHT-EMITTING ELEMENT ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光元件组件及其制造方法
公开(公告)号：US20100285625A1
公开(公告)日：2010-11-11
申请号：US12841812
申请日：2010-07-22
申请人： Rintaro Koda , Takahiro Arakida , Satoshi Taniguchi , Yuji Masui , Nobuhiro Suzuki , Tomoyuki Oki , Chiyomi Uchiyama , Kayoko Kikuchi
发明人： Rintaro Koda , Takahiro Arakida , Satoshi Taniguchi , Yuji Masui , Nobuhiro Suzuki , Tomoyuki Oki , Chiyomi Uchiyama , Kayoko Kikuchi
IPC分类号： H01L33/00
CPC分类号： H01S5/18311 , H01L33/0079 , H01L33/44 , H01L33/62 , H01L33/647 , H01L2924/0002 , H01S5/0207 , H01S5/0215 , H01S5/0216 , H01S5/0217 , H01S5/02272 , H01S5/0425 , H01L2924/00
摘要： A method for making a light-emitting element assembly including a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.
摘要翻译：一种制造发光元件组件的方法，包括：具有形成在所述凹部的所述第一表面和所述内表面上的第一表面，面向所述第一表面的第二表面，凹陷部分和导电材料层的支撑基板，和发光元件。发光元件具有包括第一化合物半导体层，发光部和第二化合物半导体层的层叠结构，至少第二化合物半导体层和构成台面结构的发光部。发光元件还包括形成的绝缘层，第二电极和第一电极。台面结构被放置在凹部中，使得导电材料层和第二电极彼此至少部分接触，并且从发光部分发射的光从第一化合物半导体的第二表面侧发射层。

48. 发明申请

US20090168825A1 LIGHT-EMITTING ELEMENT ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光元件组件及其制造方法
公开(公告)号：US20090168825A1
公开(公告)日：2009-07-02
申请号：US12333972
申请日：2008-12-12
申请人： Rintaro Koda , Takahiro Arakida , Satoshi Taniguchi , Yuji Masui , Nobuhiro Suzuki , Tomoyuki Oki , Chiyomi Uchiyama , Kayoko Kikuchi
发明人： Rintaro Koda , Takahiro Arakida , Satoshi Taniguchi , Yuji Masui , Nobuhiro Suzuki , Tomoyuki Oki , Chiyomi Uchiyama , Kayoko Kikuchi
IPC分类号： H01S5/026 , H01L21/02
CPC分类号： H01S5/18311 , H01L33/0079 , H01L33/44 , H01L33/62 , H01L33/647 , H01L2924/0002 , H01S5/0207 , H01S5/0215 , H01S5/0216 , H01S5/0217 , H01S5/02272 , H01S5/0425 , H01L2924/00
摘要： A light-emitting element assembly includes a support substrate having a first surface, a second surface facing the first surface, a recessed portion, and a conductive material layer formed over the first surface and the inner surface of the recessed portion, and a light-emitting element. The light-emitting element has a laminated structure including a first compound semiconductor layer, a light-emitting portion, and a second compound semiconductor layer, at least the second compound semiconductor layer and the light-emitting portion constituting a mesa structure. The light-emitting element further includes an insulating layer formed, a second electrode, and a first electrode. The mesa structure is placed in the recessed portion so that the conductive material layer and the second electrode are in at least partial contact with each other, and light emitted from the light-emitting portion is emitted from the second surface side of the first compound semiconductor layer.
摘要翻译：发光元件组件包括具有第一表面，面向第一表面的第二表面，凹陷部分和形成在凹部的第一表面和内表面上的导电材料层的支撑基板，发光元件。发光元件具有包括第一化合物半导体层，发光部和第二化合物半导体层的层叠结构，至少第二化合物半导体层和构成台面结构的发光部。发光元件还包括形成的绝缘层，第二电极和第一电极。台面结构被放置在凹部中，使得导电材料层和第二电极彼此至少部分接触，并且从发光部分发射的光从第一化合物半导体的第二表面侧发射层。

49. 发明申请

US20090012093A1 Receptor Function Regulator 有权
标题翻译：受体功能调节器
公开(公告)号：US20090012093A1
公开(公告)日：2009-01-08
申请号：US10534081
申请日：2003-11-06
申请人： Kohji Fukatsu , Shinobu Sasaki , Shuji Hinuma , Yasuaki Ito , Nobuhiro Suzuki , Masataka Harada , Tsuneo Yasuma
发明人： Kohji Fukatsu , Shinobu Sasaki , Shuji Hinuma , Yasuaki Ito , Nobuhiro Suzuki , Masataka Harada , Tsuneo Yasuma
IPC分类号： A61K31/4965 , C07C62/34 , C07D241/18 , C07D277/42 , G01N33/566 , A61K31/427 , A61K31/192
CPC分类号： C07C255/24 , A61K31/192 , A61K31/195 , A61K31/216 , A61K31/343 , A61K31/381 , A61K31/401 , A61K31/404 , A61K31/426 , A61K31/428 , A61K31/437 , C07C59/64 , C07C59/68 , C07C59/72 , C07C59/74 , C07C59/76 , C07C59/90 , C07C65/24 , C07C69/734 , C07C69/736 , C07C217/48 , C07C217/58 , C07C217/76 , C07C235/42 , C07C255/54 , C07C317/28 , C07C323/19 , C07C2601/02 , C07C2601/14 , C07C2602/08 , C07C2602/10 , C07C2602/12 , C07D209/12 , C07D277/36 , C07D277/42 , C07D277/64 , C07D295/13 , C07D307/91 , C07D333/32 , C07D333/54 , C07D333/62 , C07D333/78 , C07D471/04
摘要： The GPR40 receptor function regulator of the present invention, which comprises a compound having an aromatic ring and a group capable of releasing cation is useful as an insulin secretagogue or an agent for the prophylaxis or treatment of diabetes and the like.
摘要翻译：本发明的GPR40受体功能调节剂包含具有芳香环的化合物和能释放阳离子的基团，可用作胰岛素促分泌素或预防或治疗糖尿病等的药剂。

50. 发明申请

US20070259927A1 Remedy for Diabetes 审中-公开
标题翻译：补救糖尿病
公开(公告)号：US20070259927A1
公开(公告)日：2007-11-08
申请号：US11660939
申请日：2005-08-25
申请人： Nobuhiro Suzuki , Yusuke Moritoh , Masanori Watanabe
发明人： Nobuhiro Suzuki , Yusuke Moritoh , Masanori Watanabe
IPC分类号： A61K31/4436 , A61K31/4439 , A61P3/10
CPC分类号： A61K31/40 , A61K31/4439 , A61K31/455 , A61K31/4985 , A61K45/06
摘要： The present invention provides an agent for increasing the pancreatic insulin content useful for the treatment of diabetes and the like. In one embodiment, the present invention provides an agent for increasing the pancreatic insulin content, which contains a blood glucose lowering drug that does not stimulate insulin secretion, and a dipeptidyl-peptidase IV inhibitor in combination.
摘要翻译：本发明提供了用于增加可用于治疗糖尿病等的胰岛素含量的药剂。在一个实施方案中，本发明提供了用于增加胰岛素含量的试剂，其含有不刺激胰岛素分泌的降血糖药物和组合的二肽基肽酶IV抑制剂。

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