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41. 发明授权

US06336842B1 Rotary machining apparatus 有权
标题翻译：旋转加工机
公开(公告)号：US06336842B1
公开(公告)日：2002-01-08
申请号：US09574285
申请日：2000-05-19
申请人： Shigeo Ootsuki , Shigeo Moriyama , Takashi Kugaya , Kenichi Togawa , Makoto Kajiwara , Shyuichi Oowada , Yukio Suzuki , Yoko Sugawa
发明人： Shigeo Ootsuki , Shigeo Moriyama , Takashi Kugaya , Kenichi Togawa , Makoto Kajiwara , Shyuichi Oowada , Yukio Suzuki , Yoko Sugawa
IPC分类号： B24B4900
CPC分类号： B24B53/017 , B24B49/16
摘要： An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the polishing tool. In order to solve the above-mentioned problem, the present invention provide a rotary machining apparatus comprising a polishing tool for polishing a sample; a rotary disk for holding the polishing tool; a tool for configuring a surface of the polishing tool; and a position adjusting mechanism for adjusting a gap between the tool and the polishing tool, which comprises a rotating mechanism for rotating the tool; and a sensor for sensing a change in the rotation of the rotating mechanism, a height at starting to configure the polishing tool using the tool being determined based on the change in the rotation obtained by the sensor.
摘要翻译：本发明的目的是提供一种能够构造抛光工具的表面而不损坏抛光工具的抛光装置。为了解决上述问题，本发明提供了一种旋转加工装置，其包括抛光用于抛光样品的工具; 用于保持抛光工具的旋转盘; 用于配置抛光工具的表面的工具; 以及位置调节机构，用于调整所述工具和所述研磨工具之间的间隙，所述间隙包括用于旋转所述工具的旋转机构; 以及用于感测旋转机构的旋转变化的传感器，基于由传感器获得的旋转变化确定的，使用该工具来开始构造抛光工具的高度。

42. 发明授权

US06180020B2 Polishing method and apparatus 失效
标题翻译：抛光方法和设备
公开(公告)号：US06180020B2
公开(公告)日：2001-01-30
申请号：US09029903
申请日：1998-03-12
申请人： Shigeo Moriyama , Katsuhiko Yamaguchi , Yoshio Homma , Sunao Matsubara , Yoshihiro Ishida , Ryousei Kawa-ai
发明人： Shigeo Moriyama , Katsuhiko Yamaguchi , Yoshio Homma , Sunao Matsubara , Yoshihiro Ishida , Ryousei Kawa-ai
IPC分类号： C01B3300
CPC分类号： H01L21/31053 , B24B27/0076 , B24B37/04 , B24B37/042 , B24B37/24 , B24B37/245 , B24D3/002 , B24D3/28
摘要： The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as to a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains, it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered uniformly flat, irrespective of the size of the concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions.
摘要翻译：本发明涉及使用包括磨粒的磨石和用于粘结磨粒的粘合树脂的抛光方法，以及用于抛光方法的抛光装置。通过使用用于粘合磨粒的树脂，可以获得具有所需弹性模量的磨石。利用这样的磨石，与凹部和凸部的尺寸无关地，具有凹凸部的基板的表面能够均匀地平坦化。此外，通过用具有小的弹性模量的抛光工具首先抛光基板表面，然后用具有大的弹性模量的抛光工具进行抛光，可以获得损伤减小的抛光表面。本发明的方法对于具有凹凸部分的各种基板表面进行平面化是有效的。

43. 发明授权

US6099393A Polishing method for semiconductors and apparatus therefor 失效
标题翻译：半导体抛光方法及其设备
公开(公告)号：US6099393A
公开(公告)日：2000-08-08
申请号：US80728
申请日：1998-05-21
申请人： Soichi Katagiri , Shigeo Moriyama , Kan Yasui , Katsuhiko Yamaguchi
发明人： Soichi Katagiri , Shigeo Moriyama , Kan Yasui , Katsuhiko Yamaguchi
IPC分类号： B24B37/00 , B24B53/007 , B24B53/013 , H01L21/304 , B24B1/00
CPC分类号： B24B53/017 , B24B53/013
摘要： In the polishing machine 10 for pressing the polished surface 7 of the workpiece 1 against the face where there are abrasives 15 of the rotating polishing tool 11 and executing chemical mechanical polishing, the brushing device 30, the cleaner 40, the abrasive supplier 52, and the pure water supplier 60 are sequentially arranged behind the location of the head 20 for pressing the workpiece 1 against the polishing tool 11 in the rotational direction. The cleaner 40 sprays the cleaning water 47 to the face where there are abrasives 15 of the rotating polishing tool 11 and sucks and collects it by the vacuum hole 45. Fresh slurry 62 is always supplied by the slurry supplier 63 comprising the abrasive supplier 52 and the pure water supplier 60.
摘要翻译：在用于将工件1的抛光表面7压靠在旋转抛光工具11的磨料15的表面上并执行化学机械抛光的抛光机10中，刷洗装置30，清洁器40，磨料供应器52和纯水供应器60顺序地布置在头部20的位置之后，用于将工件1沿着旋转方向压靠在抛光工具11上。清洁器40将清洗水47喷射到旋转研磨工具11的磨料15的表面，并通过真空孔45吸收并收集。新鲜浆料62总是由包含磨料供应器52的浆料供给器63供应，纯水供应商60。

44. 发明授权

US6077027A Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device 有权
标题翻译：具有无轴承接头的物品的半导体制造装置及半导体装置的制造方法
公开(公告)号：US6077027A
公开(公告)日：2000-06-20
申请号：US289677
申请日：1999-04-12
申请人： Yoshio Kawamura , Hideo Kashima , Shigeo Moriyama
发明人： Yoshio Kawamura , Hideo Kashima , Shigeo Moriyama
IPC分类号： B65G49/07 , H01L21/677 , B25J17/00
CPC分类号： H01L21/67742 , Y10S414/139 , Y10T74/20329
摘要： In order to manufacture a semiconductor device of high performance a small-sized transfer arm mechanism, capable of retaining a predetermined transfer stroke, is put to practical use without any increase in the height of the arm mechanism. The transfer arm includes arcuate portions having center axes different from each other, and restraint generating means for generating restraints in directions where the individual center axes are attracted. This way, a plurality of arms are joined by joints having a structure for transmitting rolling motions to the arcuate portions contacting each other to thereby control the drive shaft of the arcuate portions rotationally and thereby move the arms. This transfer arm mechanism is used in various environments including semiconductor manufacturing, such as DRAMs.
摘要翻译：为了制造高性能的半导体装置，能够保持预定的传送冲程的小型传送臂机构被实际使用，而不会增加臂机构的高度。传送臂包括具有彼此不同的中心轴的弓形部分，以及用于在各个中心轴被吸引的方向上产生约束的约束产生装置。这样，多个臂通过具有用于将滚动运动传递到彼此接触的弓形部分的结构的接头连接，从而旋转地控制弓形部分的驱动轴，从而移动臂。该转移臂机构用于包括半导体制造在内的各种环境，例如DRAM。

45. 发明授权

US6043155A Polishing agent and polishing method 失效
公开(公告)号：US6043155A
公开(公告)日：2000-03-28
申请号：US33690
申请日：1998-03-03
申请人： Yoshio Homma , Kikuo Kusukawa , Shigeo Moriyama , Masayuki Nagasawa
发明人： Yoshio Homma , Kikuo Kusukawa , Shigeo Moriyama , Masayuki Nagasawa
IPC分类号： C09G1/02 , C09K3/14 , H01L21/3105
CPC分类号： H01L21/31053 , C09G1/02 , C09K3/1463
摘要： In order to polish an insulating film, a cerium oxide polishing agent (ceria slurry) is used. The ceria slurry is composed of cerium oxide powder containing Na, Ca, Fe, and Cr concentration of which is less than 10 ppm. Fragile inorganic and organic insulating films formed at relatively low temperatures can be polished without degrading the characteristics of the semiconductor element due to Na diffusion.

46. 发明授权

US5971701A Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device 失效
标题翻译：具有无轴承接头的物品的半导体制造装置及半导体装置的制造方法
公开(公告)号：US5971701A
公开(公告)日：1999-10-26
申请号：US795858
申请日：1997-02-06
申请人： Yoshio Kawamura , Hideo Kashima , Shigeo Moriyama
发明人： Yoshio Kawamura , Hideo Kashima , Shigeo Moriyama
IPC分类号： B65G49/07 , H01L21/677 , B65G65/00
CPC分类号： H01L21/67742 , Y10S414/139 , Y10T74/20329
摘要： In order to manufacture a semiconductor device of high performance a small-sized transfer arm mechanism, capable of retaining a predetermined transfer stroke, is put to practical use without any increase in the height of the arm mechanism. The transfer arm includes arcuate portions having center axes different from each other, and restraint generating means for generating restraints in directions where the individual center axes are attracted. This way, a plurality of arms are joined by joints having a structure for transmitting rolling motions to the arcuate portions contacting each other to thereby control the drive shaft of the arcuate portions rotationally and thereby move the arms. This transfer arm mechanism is used in various environments including semiconductor manufacturing, such as DRAMs (dynamic random access memory).
摘要翻译：为了制造高性能的半导体装置，能够保持预定的传送冲程的小型传送臂机构被实际使用，而不会增加臂机构的高度。传送臂包括具有彼此不同的中心轴的弓形部分，以及用于在各个中心轴被吸引的方向上产生约束的约束产生装置。这样，多个臂通过具有用于将滚动运动传递到彼此接触的弓形部分的结构的接头连接，从而旋转地控制弓形部分的驱动轴，从而移动臂。该转移臂机构用于包括半导体制造在内的各种环境，例如DRAM（动态随机存取存储器）。

47. 发明授权

US5658115A Transfer apparatus 失效
标题翻译：转运设备
公开(公告)号：US5658115A
公开(公告)日：1997-08-19
申请号：US521957
申请日：1995-08-31
申请人： Takashi Yamazaki , Hiroyuki Sakai , Hiroshi Sugano , Shigeo Moriyama
发明人： Takashi Yamazaki , Hiroyuki Sakai , Hiroshi Sugano , Shigeo Moriyama
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677 , B65H5/08
CPC分类号： H01L21/67748 , H01L21/67069 , Y10S414/135
摘要： A transfer apparatus is to be used for a wafer loader of an electron beam drawing apparatus, and is constructed particularly in consideration of downsizing of the apparatus as a whole, high-speed transfer for coping with high throughput, and prevention of adhesion of foreign matters for the application to DRAM of 64 and 256 megabits. A transferring mechanism for positioning and fixing an object to be transferred due to combination of positioning projections which are formed on fixing tables on which an object to be transferred is set and transferring arm assemblies and groove portions which are formed in a lower surface of the transferred object. Positioning projections are formed on fixing tables on which an object to be transferred is set and on a transferring arm, and a transferring mechanism for positioning and fixing the object by means of the combination of the positioning projections and groove portions formed in a lower surface of the object is disposed in parallel with a main apparatus. The transferring arm has a vertically moving mechanism and a waiting position of the arm is set in the middle of the transferring path. This transfer apparatus has the structure suitable for high-speed transfer and has less possibility of generation and adhesion of foreign matters. In addition, the apparatus can be reduced in size as a whole.
摘要翻译：转印装置用于电子束拉伸装置的晶片装载机，特别考虑到整体装置的小型化，高速转印，高产量的处理，防止异物附着适用于64位和256兆位的DRAM。一种转印机构，用于定位和固定由于形成在待转印物体的固定台上的定位突起的组合而被转印的物体和传送臂组件和形成在被转印物体的下表面中的槽部分目的。定位突起形成在其上设置有待转印物体的固定台上，并且在转印臂上形成有用于定位和固定物体的转印机构，该转印机构通过定位突起和形成在下表面的槽部的组合该物体与主装置平行设置。传送臂具有垂直移动机构，并且臂的等待位置设置在传送路径的中间。该转印装置具有适于高速转印的结构，并且异物的产生和附着的可能性较小。另外，该装置的整体尺寸可以减小。

48. 发明授权

US5305364A Projection type X-ray lithography apparatus 失效
标题翻译：投影型X射线光刻设备
公开(公告)号：US5305364A
公开(公告)日：1994-04-19
申请号：US945146
申请日：1992-09-15
申请人： Kozo Mochiji , Hiroaki Oizumi , Shigeo Moriyama , Shinji Okazaki , Tsuneo Terasawa , Masaaki Itou
发明人： Kozo Mochiji , Hiroaki Oizumi , Shigeo Moriyama , Shinji Okazaki , Tsuneo Terasawa , Masaaki Itou
IPC分类号： G03F7/20 , H01L21/027 , G21K5/00
CPC分类号： G03F7/70233 , G03F7/70808 , G03F7/70841 , G03F7/70866 , G03F7/70883 , G03F7/70933
摘要： Reduction projection type X-ray lithography with an exposing beam wavelength of 40-150A, longer than in conventional 1:1 proximity exposure, has a high-vacuum space. This would reduce wafer replacement work efficiency and contaminate optical mirrors with substances released by a resist decomposed during exposure except for separating an optical system chamber and a wafer exposing chamber by a differential pumping section and a thin-film window. Wafer exposure is under atmospheric pressure, improving productivity, accuracy of exposure and longevity of the optical devices.
摘要翻译：具有40-150A的曝光光束波长的还原投影型X射线光刻比传统的1：1接近曝光更长，具有高真空空间。这将降低晶片更换工作效率，并且通过在曝光期间分解的抗蚀剂释放的物质污染光学反射镜，除了通过差分泵送部分和薄膜窗口分离光学系统室和晶片曝光室之外。晶圆曝光在大气压下，提高了生产率，曝光精度和光学元件的寿命。

49. 发明授权

US5272744A Reflection mask 失效
标题翻译：反射面具
公开(公告)号：US5272744A
公开(公告)日：1993-12-21
申请号：US933300
申请日：1992-08-21
申请人： Masaaki Itou , Hiroaki Oizumi , Shigeo Moriyama
发明人： Masaaki Itou , Hiroaki Oizumi , Shigeo Moriyama
IPC分类号： G03F1/22 , G03F1/24 , G21K1/06 , H01L21/027 , G21K5/00
CPC分类号： G21K1/062 , B82Y10/00 , G03F1/24
摘要： In a reflection mask, there is formed at least one laminate structure comprising a high reflectivity portion, a middle portion and a high reflectivity portion. When there is a defect in the high reflectivity portion as the top layer, this high reflectivity portion and the underlying middle portion are removed in that defective position, thereby allowing the high reflectivity portion as the bottom layer to be exposed to repair the defect.
摘要翻译：在反射掩模中，形成至少一层包括高反射率部分，中间部分和高反射率部分的层压结构。当作为顶层的高反射率部分存在缺陷时，在该缺陷位置除去该高反射率部分和下面的中间部分，从而允许暴露高反射率部分以暴露以修复缺陷。

50. 发明授权

US5222112A X-ray pattern masking by a reflective reduction projection optical system 失效
标题翻译：通过反射缩小投影光学系统的X射线图案掩模
公开(公告)号：US5222112A
公开(公告)日：1993-06-22
申请号：US812022
申请日：1991-12-23
申请人： Tsuneo Terasawa , Masaaki Itou , Shigeo Moriyama , Soichi Katagiri , Hiroshi Fukuda
发明人： Tsuneo Terasawa , Masaaki Itou , Shigeo Moriyama , Soichi Katagiri , Hiroshi Fukuda
IPC分类号： G03F7/20 , G21K1/06
CPC分类号： G03F7/7085 , G03F7/2039 , G03F7/702 , G03F7/70233 , G03F7/70283 , G03F7/70358 , G03F7/70558 , G03F7/70566 , G03F7/70583 , G21K1/06
摘要： In printing patterns on a mask onto a wafer with high accuracy via a reflective reduction projection optical system by using an X-ray or vacuum ultraviolet beam there is an elliptical mirror having a source position defined in an X-ray source and a position of reflection image of entrance pupil of an imaging optical system with respect to the mask as foci and introducing means for synchronously scanning the mask and wafer. Due to inserting a plane mirror for bending an X-ray by approximately 90.degree. at at least one point in the imaging optical system so that the plane of incidence may be perpendicular to the polarization plane the reflectivity does not lower even when the angle of incidence is 45.degree.. A reflecting mirror or an X-ray filter having a lower reflectivity in the peripheral part thereof as compared with the reflectivity of the central part thereof in the stop position of the imaging optical system, brings about an effect of lessened influence of mutual interference between adjacent pattern provides pattern printing with high shape accuracy.
摘要翻译：通过使用X射线或真空紫外线，通过反射式还原投影光学系统将掩模上的印刷图案高精度地印刷在晶片上，具有在X射线源和反射位置中定义的源位置的椭圆镜相对于掩模作为焦点的成像光学系统的入射光瞳的图像和用于同步扫描掩模和晶片的引入装置。由于在成像光学系统的至少一个点处插入用于将X射线弯曲大约90°的平面镜，使得入射平面可以垂直于偏振面，即使当入射角也是如此，反射率也不降低是45度。与其在成像光学系统的停止位置的中心部分的反射率相比，其周边部分具有较低反射率的反射镜或X射线滤光器产生相邻干涉的相互干扰影响减小的效果图案提供具有高形状精度的图案印刷。

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