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    • 41. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07718497B2
    • 2010-05-18
    • US12130296
    • 2008-05-30
    • Yasushi AkasakaNoriaki FukiageYoshihiro KatoKazuhide HasebePao-Hwa Chou
    • Yasushi AkasakaNoriaki FukiageYoshihiro KatoKazuhide HasebePao-Hwa Chou
    • H01L21/8234
    • H01L21/823864H01L21/823814
    • A semiconductor device manufacturing method includes: forming a sidewall spacer on a sidewall surface of a gate electrode; forming a pair of second conductive type source and drain regions in an active region; covering top surfaces of a semiconductor layer, a device isolation region, the sidewall spacer and the gate electrode with a metal film; reducing resistance of the source and drain regions and the gate electrode partially by making the metal film react with the semiconductor layer and the gate electrode; and removing an unreacted portion of the metal film and the sidewall spacer simultaneously by using an etchant which readily etches the unreacted portion of the metal film and the sidewall spacer while hardly etching the device isolation region, resistance-reduced portions of the gate electrode and resistance-reduced portions of the source and drain regions.
    • 半导体器件制造方法包括:在栅电极的侧壁表面上形成侧壁间隔物; 在有源区中形成一对第二导电型源区和漏区; 用金属膜覆盖半导体层的顶表面,器件隔离区,侧壁间隔物和栅电极; 通过使金属膜与半导体层和栅极电极反应,部分地降低源极和漏极区域和栅电极的电阻; 并且通过使用易于蚀刻金属膜和侧壁间隔物的未反应部分的蚀刻剂同时去除金属膜和侧壁间隔物的未反应部分,同时几乎不蚀刻器件隔离区域,栅电极的电阻减少部分和电阻 - 源区和漏区的部分。
    • 43. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20080299728A1
    • 2008-12-04
    • US12130296
    • 2008-05-30
    • Yasushi AkasakaNoriaki FukiageYoshihiro KatoKazuhide HasebePao-Hwa Chou
    • Yasushi AkasakaNoriaki FukiageYoshihiro KatoKazuhide HasebePao-Hwa Chou
    • H01L21/8236
    • H01L21/823864H01L21/823814
    • A semiconductor device manufacturing method includes: forming a sidewall spacer on a sidewall surface of a gate electrode; forming a pair of second conductive type source and drain regions in an active region; covering top surfaces of a semiconductor layer, a device isolation region, the sidewall spacer and the gate electrode with a metal film; reducing resistance of the source and drain regions and the gate electrode partially by making the metal film react with the semiconductor layer and the gate electrode; and removing an unreacted portion of the metal film and the sidewall spacer simultaneously by using an etchant which readily etches the unreacted portion of the metal film and the sidewall spacer while hardly etching the device isolation region, resistance-reduced portions of the gate electrode and resistance-reduced portions of the source and drain regions.
    • 半导体器件制造方法包括:在栅电极的侧壁表面上形成侧壁间隔物; 在有源区中形成一对第二导电型源区和漏区; 用金属膜覆盖半导体层的顶表面,器件隔离区,侧壁间隔物和栅电极; 通过使金属膜与半导体层和栅极电极反应,部分地降低源极和漏极区域和栅电极的电阻; 并且通过使用易于蚀刻金属膜和侧壁间隔物的未反应部分的蚀刻剂同时去除金属膜和侧壁间隔物的未反应部分,同时几乎不蚀刻器件隔离区域,栅电极的电阻减少部分和电阻 - 源区和漏区的部分。
    • 50. 发明授权
    • Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    • 用激光制作通孔的方法,适合制作孔的覆铜层压板,以及用于制作孔的辅助材料
    • US06337463B1
    • 2002-01-08
    • US09271897
    • 1999-03-18
    • Morio GakuNobuyuki IkeguchiYasuo TanakaYoshihiro Kato
    • Morio GakuNobuyuki IkeguchiYasuo TanakaYoshihiro Kato
    • B23K2600
    • H05K3/0038B23K26/18H05K1/0373H05K3/427H05K2201/0112H05K2201/0215H05K2201/0323H05K2203/1383
    • A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.
    • 一种制造小孔直径通孔的方法,其具有高孔率的孔壁,高速率地输出高输出二氧化碳气体激光器的能量,而不在铜箔中预先制造任何孔,形成或布置 包含或含有3至97体积%的至少一种选自熔点为900℃以上的金属化合物粉末,碳粉末和金属粉末的粉末的有机物的片材,以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面,并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔,辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料,辅助材料是含有3〜97体积%的至少一种粉末的涂层或片材,所述粉末选自 G 该组合物由金属化合物粉末,碳粉末和金属粉末组成,其熔点至少为900℃,结合能为至少300KJ / mol。