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41. 发明专利

JP2006119961A Memory card 有权
标题翻译：存储卡
公开(公告)号：JP2006119961A
公开(公告)日：2006-05-11
申请号：JP2004307976
申请日：2004-10-22
申请人： Renesas Technology Corp , Sony Corp , ソニー株式会社 , 株式会社ルネサステクノロジ
发明人： AOKI SADATAKA , BANDO HIDEAKI , TSUTSUI KEIICHI , NISHIZAWA HIROTAKA , OSAWA KENJI , TOTSUKA TAKASHI
IPC分类号： G06K19/07
CPC分类号： G06K19/07732 , G06K19/07735 , G06K19/07743 , G06K19/07769
摘要： PROBLEM TO BE SOLVED: To stably perform data communication without being affected by noise, in a memory card to which a module for data communication is newly added. SOLUTION: The memory card 100 includes a holding body 20 like a thin plate, a memory 24 buried in the holding body 20, a plurality of first contacts 2 to 10 connected to the memory 24, a data communication part 26 buried in the holding body 20, and two second contacts 11 and 12 connected to the data communication part 26. The two second contacts 11 and 12 are arranged at the end of a column R1 where only the plurality of first contacts 2 to 10 are arrayed. One first contact 10 placed at the end of the column R1 is a ground terminal. That is, the first contact 10 adjacent to the second contact 11 out of the plurality of first contacts 2 to 10 is the ground terminal. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了稳定地执行不受噪声影响的数据通信，在新添加了用于数据通信的模块的存储卡中。存储卡100包括：薄板状的保持体20，埋藏在保持体20中的存储器24，与存储器24连接的多个第一触点2〜10，埋入保持体20和连接到数据通信部分26的两个第二触点11和12.两个第二触点11和12布置在仅排列多个第一触点2至10的列R1的端部。放置在列R1的端部的一个第一触头10是接地端子。也就是说，与多个第一触点2至10中的第二触点11相邻的第一触点10是接地端子。版权所有（C）2006，JPO＆NCIPI

42. 发明专利

JP2001168259A LEAD FRAME, MANUFACTURING METHOD OF LEAD FRAME, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001168259A
公开(公告)日：2001-06-22
申请号：JP35393999
申请日：1999-12-14
申请人： SONY CORP
发明人： OSAWA KENJI , KUSANO HIDETOSHI
IPC分类号： H01L23/50 , H01L21/60 , H01L23/498
摘要： PROBLEM TO BE SOLVED: To provide a lead frame 6, which has a wiring means capable of connecting electrically a plurality of semiconductor components 7 and 7 with each other and makes it possible to mount the components on one semiconductor device without increasing the manhour of assembly while the thickness of the device is made thin and moreover, without reducing the reliability of the elements or the yield of the manufacture of the components. SOLUTION: A lead frame has outer leads 3 consisting of a metal base material 1, wiring films 2, which are respectively connected with the outer leads 3 at the inner end parts of the surfaces on one side of the surfaces of the outer leads 3 on the insides of the outer leads 3 and consist of a metal plating layer, a wiring film 2s liberated from the outer leads and an insulating film 5 to hold each wiring film of the wiring films 2 and 2s in such a way as to cover the wiring films 2 and 2s from the surfaces, which are positioned on the side opposite to the outer leads, of the films 2 and 2s and the surfaces, which are positioned on the side opposite to the film 5, of the films 2 and 2s are used as semiconductor component mounting surfaces.

43. 发明专利

JPH1197573A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH1197573A
公开(公告)日：1999-04-09
申请号：JP25454997
申请日：1997-09-19
申请人： SONY CORP
发明人： OSAWA KENJI , OIDE TOMOSHI
IPC分类号： H01L23/12 , H01L23/36 , H01L23/495 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package which can improve the heat- radiation of the package, and eliminate the ball-size unevenness of protruding electrodes such as solder balls formed by an electrolytic plating method. SOLUTION: A package comprises a semiconductor chip 2 having a plurality of electrode pads 3, the inside of the region in which the pads 3 are formed as an effective element region 4, a reinforcing plate 7 surrounding the semiconductor chip 2, a plurality of leads 10 including an outer lead 10b and an inner lead 10a, the outer lead 10b having a protruding electrode 12b thereon and the tip of the inner lead 10a being connected to the electrode pads 3, and sealing resin 15 filled in the peripheral region of the semiconductor chip 2. A semiconductor pattern 6 is formed on the effective element region 4 of the semiconductor chip 2, the semiconductor pattern 6 being covered with an isolation film 11a and provided with a protruding electrode 12a thereon.

44. 发明专利

JPH10326795A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH10326795A
公开(公告)日：1998-12-08
申请号：JP18509297
申请日：1997-07-10
申请人： SONY CORP
发明人： OSAWA KENJI , SATO KAZUHIRO , SHIGETA HIROYUKI
IPC分类号： H01L21/52 , H01L23/31 , H01L23/495
摘要： PROBLEM TO BE SOLVED: To prevent a film circuit and, especially, its outside part from being bent, by a method wherein an adhesive sheet which is provided with rigidity and which comprises also a part to be bonded to the backside in the outside of the film circuit is used. SOLUTION: A film circuit 1 which is provided with an element corresponding part 4 and with an outside part 5 is used also so as to correspond to an increase in the number of electrodes with reference to the size of a semiconductor element 7 when its integrating density is enhanced. A resin 13 seals a part between the film circuit 1 and the semiconductor element 7. An adhesive sheet 8 bonds a part between the backside of the element corresponding part 4 at the film circuit 1 and the surface of the semiconductor element 7, and a rigid sheet layer 10 which forms the intermediate layer of the adhesive sheet 8 is composed of, e.g. stainless steel, a polyimide or the like. Since the adhesive sheet 8 uses the rigid sheet layer 10 as the intermediate layer, the film circuit 1 and, especially, its outside part 5 can be supported strongly due to its rigidity. Consequently, it is possible to prevent the film circuit 1 and, especially, its outside part 5 from being bent.

45. 发明专利

JPH10209339A SEMICONDUCTOR DEVICE AND LEAD FRAME 失效
公开(公告)号：JPH10209339A
公开(公告)日：1998-08-07
申请号：JP795397
申请日：1997-01-20
申请人： SONY CORP
发明人： OSAWA KENJI , MAKINO HARUHIKO
IPC分类号： H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To improve the adhesion strength between an outer ring and seal resin and mechanical strength to obtain a stable outer ring structure, by providing an outer ring having through-holes or blind holes and seal resin filled between a semiconductor chip and outer ring. SOLUTION: An outer ring 11 is provided outside a semiconductor chip 2 with a seal resin 12 filled between the chip 2 and the ring 11 having through- holes 15 discontinuously formed at the four corners, and the ring is integrated with a wiring film 5. The resin 12 is filled in the through-holes 15 to increase the contact area between the resin 12 and ring 11, thereby raising the adhesion strength of the resin 12 to the ring 11. Thus, the resin 12 is fixed tightly to the ring 11 to stabilize the resin seal of the entire semiconductor package 1 including the outer ring.

46. 发明专利

JPH1065081A LEAD FRAME AND SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH1065081A
公开(公告)日：1998-03-06
申请号：JP22203396
申请日：1996-08-23
申请人： SONY CORP
发明人： OSAWA KENJI , MAKINO HARUHIKO , SATO KAZUHIRO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor package by preventing the disconnection failure of a lead due to environmental stress. SOLUTION: A semiconductor package includes a semiconductor chip 15 where a plurality of electrode pads 16 are formed at the peripheral edge of a chip surface, a wiring film 7 that is arranged and fixed at the surface side of the semiconductor chip 15 and at the same time where an insulation film 6 is laminated on a lead pattern 5, a plurality of leads 9 that are extended from the wiring film 7, at the same time where the extended edge is connected to the electrode pad 16 of the semiconductor chip 15 by a specific bending forming and its bending position L is arranged inside the lamination region of the insulation film 6, and a sealing resin 17 where the peripheral region of the semiconductor chip 15 including the boundary part between each lead 9 and the insulation film 6.

47. 发明专利

JPH09213863A MANUFACTURE OF LEAD FRAME 失效
公开(公告)号：JPH09213863A
公开(公告)日：1997-08-15
申请号：JP3573096
申请日：1996-01-31
申请人： SONY CORP
发明人： OSAWA KENJI , ITO MAKOTO
IPC分类号： H01L21/60 , H01L21/48 , H01L23/495 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a lead frame of high quality. SOLUTION: A pattern layer 12 is selectively formed on a copper plate 11, and the surface of the copper plate 11 is plated with gold using the pattern layer 12 as a mask for the formation of a gold layer 13a. Then, the gold layer 13a is plated with copper for the formation of a copper layer 13b, whereby a fine wire lead 13 composed of the gold layer 13a and the copper layer 13b is obtained. Thereafter, the pattern 12 is selectively removed, an insulating resist film 14 is formed, and the copper plate 11 is etched. At this point, the gold layer 13a is made to serve as an etching s top layer. By this setup, a lead frame with the fine wire lead of two-layered structure can be formed.

48. 发明专利

JPH0992750A MANUFACTURE OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH0992750A
公开(公告)日：1997-04-04
申请号：JP24482195
申请日：1995-09-22
申请人： SONY CORP
发明人： ITO MAKOTO , OSAWA KENJI
IPC分类号： H01L23/12 , H01L23/495 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To manufacture a highly accurate semiconductor package having high density multipin structure easily by forming the leads accurately in a fine pattern. SOLUTION: The method for manufacturing a semiconductor package comprises a step for forming a plurality of leads 17 by copper plating on the surface of a metal base 11, a step for forming an insulating film which holds each lead, a step for forming an electrode projecting from the outer lead part of lead, a step for separating each lead by removing the metal base selectively by etching, and a step for bonding a semiconductor chip to the inner lead part of the lead. The metal base 11 is produced by depositing aluminum 13 and nickel 14 sequentially onto a copper or copper alloy board 12 and the lead 17 is formed on the nickel 14.

49. 发明专利

JPH08241945A LEAD FRAME, SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08241945A
公开(公告)日：1996-09-17
申请号：JP4384395
申请日：1995-03-03
申请人： SONY CORP
发明人： OSAWA KENJI , MAKINO HARUHIKO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE: To eliminate a need of a resin sealing operation by a transfer molding operation by a method wherein a hole part in a ring-shaped insulator which comes into contact with the connecting part between an outer lead and an inner lead is formed in such a way that its inside is faced with the inner lead and the hole part is made to be larger than a semiconductor chip to be mounted. CONSTITUTION: A lead frame 21 has a ring-shaped insulator 20 in contact with connections A between outer leads 1,... and inner leads 2,.... The insulator 20 is composed of an insulating material such as a ceramic, a rigid resin, a glass, specifically alumina, beryllia, an epoxy resin or the like. The insulator has a surface that is coincident with a plane which includes the connections A between the outer leads 1,... and the inner leads 2,.... The insulator 20 is arranged in such a way that tip parts of the inner leads 2,... are faced with the inside of a hole part 20b, the hole part 20b is larger by a prescribed size than a semiconductor chip to be mounted, and it is deeper to a prescribed extent than the semiconductor chip is thick.

50. 发明专利

JPH07211849A LEAD FRAME 失效
公开(公告)号：JPH07211849A
公开(公告)日：1995-08-11
申请号：JP1994494
申请日：1994-01-19
申请人： SONY CORP
发明人： NAGANO MUTSUMI , OSAWA KENJI , ITO MAKOTO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To avoid the phenomenon that a bonding part protrudes the side surface of an inner lead and becomes wider by forming the bonding part of the tip part of the inner lead so that the part is narrower than the base part of the lead. CONSTITUTION:An inner lead 1 of a lead frame is formed so that a width Wb of a bonding part 5 is narrower than a width Wa of the base part. Therefore, even if the width of the bonding part 5 is expanded by single bonding, the width does not exceed Wa. In this way, even if the bonding part 5 expands by the bonding, the width at a expanded part 6 does not exceed Wa. Therefore, it is not possible that an interval G between the neighboring inner leads 1 become narrower in thc vicinity of the part of bonding in the bonding work. In this way, a pitch P can be made small without narrowing the width Wa of the inner lead 1.

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