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41. 发明授权

US07483560B2 Method for measuring three dimensional shape of a fine pattern 有权
标题翻译：用于测量精细图案的三维形状的方法
公开(公告)号：US07483560B2
公开(公告)日：2009-01-27
申请号：US10679290
申请日：2003-10-07
申请人： Chle Shishido , Ryo Nakagaki , Maki Tanaka , Kenji Watanabe , Yuya Toyoshima
发明人： Chle Shishido , Ryo Nakagaki , Maki Tanaka , Kenji Watanabe , Yuya Toyoshima
IPC分类号： G06K9/00
CPC分类号： H01L22/34 , G01N21/956 , G06T7/0004 , G06T2207/30148 , H01L2924/0002 , H01L2924/00
摘要： In a method of measuring a three dimensional shape of an arbitrary fine pattern on a semiconductor device, an optical measurement system carries out a measurement to obtain cross-section information, and an electron microscope obtains an electron beam image of the arbitrary fine pattern. Plane information and cross-section information obtained from the electron beam image of the arbitrary fine pattern are combined to measure the three dimensional shape of the arbitrary fine pattern.
摘要翻译：在半导体装置中测定任意精细图案的三维形状的方法中，光学测量系统进行测量以获得横截面信息，并且电子显微镜获得任意精细图案的电子束图像。从任意精细图案的电子束图像获得的平面信息和横截面信息被组合以测量任意精细图案的三维形状。

42. 发明申请

US20050100205A1 Method for measuring three dimensional shape of a fine pattern 有权
标题翻译：用于测量精细图案的三维形状的方法
公开(公告)号：US20050100205A1
公开(公告)日：2005-05-12
申请号：US10679290
申请日：2003-10-07
申请人： Chle Shishido , Ryo Nakagaki , Maki Tanaka , Kenji Watanabe , Yuya Toyoshima
发明人： Chle Shishido , Ryo Nakagaki , Maki Tanaka , Kenji Watanabe , Yuya Toyoshima
IPC分类号： G01B15/00 , G01N21/956 , G06K9/00 , G06T7/00 , H01J37/22 , H01L21/66 , H01L23/544
CPC分类号： H01L22/34 , G01N21/956 , G06T7/0004 , G06T2207/30148 , H01L2924/0002 , H01L2924/00
摘要： In a method of measuring a three dimensional shape of an arbitrary fine pattern on a semiconductor device, an optical measurement system carries out a measurement to obtain cross-section information, and an electron microscope obtains an electron beam image of the arbitrary fine pattern. Plane information and cross-section information obtained from the electron beam image of the arbitrary fine pattern are combined to measure the three dimensional shape of the arbitrary fine pattern.
摘要翻译：在半导体装置中测定任意精细图案的三维形状的方法中，光学测量系统进行测量以获得横截面信息，并且电子显微镜获得任意精细图案的电子束图像。从任意精细图案的电子束图像获得的平面信息和横截面信息被组合以测量任意精细图案的三维形状。

43. 发明授权

US09082585B2 Defect observation method and device using SEM 有权
标题翻译：缺陷观察方法和装置采用SEM
公开(公告)号：US09082585B2
公开(公告)日：2015-07-14
申请号：US13143345
申请日：2009-11-27
申请人： Go Kotaki , Atsushi Miyamoto , Ryo Nakagaki , Takehiro Hirai
发明人： Go Kotaki , Atsushi Miyamoto , Ryo Nakagaki , Takehiro Hirai
IPC分类号： H04N7/18 , H01J37/22 , G06T7/00 , H01J37/26 , H01J37/28 , H01L21/66
CPC分类号： H01J37/222 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01J37/265 , H01J37/28 , H01J2237/2817 , H01L22/12
摘要： An imaging region of a high-magnification reference image capable of being acquired in a low-magnification field without moving a stage from a position at which a defective region has been imaged at a low magnification is searched for and if the search is successful, an image of the imaging region itself is acquired and the high-magnification reference image is acquired. If the search is unsuccessful, the imaging scheme is switched to that in which the high-magnification reference image is acquired from a chip adjacent to the defective region.
摘要翻译：搜索能够在低放大倍率领域中获取的高倍率参考图像的成像区域，而不将舞台从低倍率下的缺陷区域成像的位置移动，并且如果搜索成功，则获取成像区域本身的图像并获取高倍率参考图像。如果搜索不成功，则将成像方案切换到从与缺陷区相邻的芯片获取高倍率参考图像的方案。

44. 发明申请

US20110285839A1 DEFECT OBSERVATION METHOD AND DEVICE USING SEM 有权
标题翻译：缺陷观察方法和使用SEM的设备
公开(公告)号：US20110285839A1
公开(公告)日：2011-11-24
申请号：US13143345
申请日：2009-11-27
申请人： Go Kotaki , Atsushi Miyamoto , Ryo Nakagaki , Takehiro Hirai
发明人： Go Kotaki , Atsushi Miyamoto , Ryo Nakagaki , Takehiro Hirai
IPC分类号： H04N7/18
CPC分类号： H01J37/222 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01J37/265 , H01J37/28 , H01J2237/2817 , H01L22/12
摘要： An imaging region of a high-magnification reference image capable of being acquired in a low-magnification field without moving a stage from a position at which a defective region has been imaged at a low magnification is searched for and if the search is successful, an image of the imaging region itself is acquired and the high-magnification reference image is acquired. If the search is unsuccessful, the imaging scheme is switched to that in which the high-magnification reference image is acquired from a chip adjacent to the defective region.
摘要翻译：搜索能够在低放大倍率领域中获取的高倍率参考图像的成像区域，而不将舞台从低倍率下的缺陷区域成像的位置移动，并且如果搜索成功，则获取成像区域本身的图像并获取高倍率参考图像。如果搜索不成功，则将成像方案切换到从与缺陷区相邻的芯片获取高倍率参考图像的方案。

45. 发明授权

US07657078B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US07657078B2
公开(公告)日：2010-02-02
申请号：US11311254
申请日：2005-12-20
申请人： Ryo Nakagaki , Toshifumi Honda
发明人： Ryo Nakagaki , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： An apparatus for reviewing defects including an image processing section (defect classification device section) with a function of estimating a non-defective state (reference image) of a portion in which the defect exists by use of a defect image, and a function of judging criticality or non-flat state of the defect by use of the estimation result. It becomes possible to establish both of a high-throughput image collecting sequence in which any reference image is not acquired and high-precision defect classification, and then to realize both of a high performance classifying function and a high-throughput image collecting function in a defect reviewing apparatus which automatically collects and classifies images of defects existing on a sample of a semiconductor wafer or the like.
摘要翻译：一种用于检查缺陷的装置，包括具有通过使用缺陷图像来估计存在缺陷的部分的非缺陷状态（参考图像）的功能的图像处理部分（缺陷分类装置部分），以及判断通过使用估计结果，缺陷的关键性或非平坦状态。可以建立不获取任何参考图像的高通量图像采集序列和高精度缺陷分类，然后实现高性能分类功能和高吞吐量图像采集功能缺陷检查装置，其自动地收集和分类存在于半导体晶片等的样本上的缺陷的图像。

46. 发明授权

US07511272B2 Method for controlling charged particle beam, and charged particle beam apparatus 有权
标题翻译：用于控制带电粒子束的方法和带电粒子束装置
公开(公告)号：US07511272B2
公开(公告)日：2009-03-31
申请号：US11607928
申请日：2006-12-04
申请人： Hiroki Kawada , Ryo Nakagaki
发明人： Hiroki Kawada , Ryo Nakagaki
IPC分类号： G01N23/00 , G21K7/00 , A61N5/00
CPC分类号： G01N23/225 , H01J37/28 , H01J2237/216
摘要： According to the invention, to achieve the above objective, there is provided a charged particle beam apparatus that creates a first image by irradiating a charged particle beam on a sample to scan a first pattern of the sample, controls on the basis of the first image the focus of the charged particle beam and the brightness and/or contrast of the image, and irradiates the charged particle beam to correctly scan a second pattern different from the first pattern by using the control conditions used to control the focus of the charged particle beam and the brightness and/or contrast of the image.
摘要翻译：根据本发明，为了实现上述目的，提供了一种带电粒子束装置，其通过在样本上照射带电粒子束来扫描样品的第一图案来产生第一图像，基于第一图像进行控制带电粒子束的焦点以及图像的亮度和/或对比度，并且通过使用用于控制带电粒子束的焦点的控制条件照射带电粒子束以正确地扫描与第一图案不同的第二图案以及图像的亮度和/或对比度。

47. 发明申请

US20070201739A1 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US20070201739A1
公开(公告)日：2007-08-30
申请号：US11704350
申请日：2007-02-09
申请人： Ryo Nakagaki , Masaki Kurihara , Toshifumi Honda
发明人： Ryo Nakagaki , Masaki Kurihara , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G06K9/6256 , G06T7/0004 , G06T7/001 , G06T2207/10056 , G06T2207/10061 , G06T2207/30148
摘要： In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed.
摘要翻译：在用于自动获取并且还自动分类诸如半导体晶片的样本上存在的缺陷的图像的设备中，提供了能够容易地接受甚至基于以下情况产生大量分类等级的情况的分类系统由用户发出的请求，甚至是分类等级的基础被高频地改变的情况。当用户定义分类类时，提供用于指定由各个分级类所拥有的属性的设备。分类系统自动地在内部提供的基于规则的分类器和基于示例的分类器之间改变连接模式，从而自动构建适合用户分类基础的这样的分类系统。

48. 发明申请

US20070031026A1 Method and apparatus for reviewing defects of semiconductor device 有权
标题翻译：检查半导体器件缺陷的方法和装置
公开(公告)号：US20070031026A1
公开(公告)日：2007-02-08
申请号：US11488636
申请日：2006-07-19
申请人： Masaki Kurihara , Toshifumi Honda , Ryo Nakagaki
发明人： Masaki Kurihara , Toshifumi Honda , Ryo Nakagaki
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/2817
摘要： A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.
摘要翻译：提供了一种用于检查半导体器件缺陷的方法和装置，其涉及检测在低放大倍率下拍摄的SEM图像上的缺陷，并且以高倍放大倍数检查SEM图像上的缺陷，并且可以检查在短时间内可以提高缺陷检查的效率。在本发明中，用于检查半导体器件的缺陷的方法包括以下步骤：通过使用扫描电子显微镜以第一放大率获得由检测装置检测的半导体器件上的缺陷的图像，从而所述图像包括在第一放大处获得的缺陷，通过将包括在第一放大获得的缺陷的图像与由包含第一放大率的缺陷构成的图像进行比较的图像进行比较来检测缺陷，并且获取检测到的缺陷的图像在大于第一放大率的第二放大倍率下。

49. 发明授权

US09342879B2 Method and apparatus for reviewing defect 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US09342879B2
公开(公告)日：2016-05-17
申请号：US14347127
申请日：2012-07-06
申请人： Yohei Minekawa , Kenji Nakahira , Minoru Harada , Takehiro Hirai , Ryo Nakagaki
发明人： Yohei Minekawa , Kenji Nakahira , Minoru Harada , Takehiro Hirai , Ryo Nakagaki
IPC分类号： G06K9/00 , G06T7/00
CPC分类号： G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/20016 , G06T2207/30148
摘要： A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.
摘要翻译：一种检查缺陷的方法，包括以下步骤：作为图像获取步骤，使用从多个图像获取条件中选择的任意图像获取条件对样本的表面进行成像并获得缺陷图像; 作为缺陷位置计算步骤，进行通过图像获取步骤获得的缺陷图像，并计算样本表面上的缺陷位置; 作为缺陷检测精度计算步骤，获得由缺陷位置计算步骤计算的缺陷位置的缺陷检测精度; 以及作为结论确定步骤，确定由缺陷检测精度计算步骤获得的缺陷检测精度是否满足预定要求; 其中直到确定由缺陷检测精度计算步骤获得的缺陷检测精度在结论确定步骤中达到预定值时，再次从多个图像获取条件中选择图像获取条件，并且图像获取步骤，缺陷位置计算步骤，重复缺陷检测精度计算步骤和结论确定步骤。

50. 发明授权

US08824773B2 Defect observation method and defect observation device 有权
标题翻译：缺陷观察方法和缺陷观察装置
公开(公告)号：US08824773B2
公开(公告)日：2014-09-02
申请号：US13515643
申请日：2010-11-19
申请人： Yohei Minekawa , Ryo Nakagaki , Kenji Nakahira , Takehiro Hirai , Katsuhiro Kitahashi
发明人： Yohei Minekawa , Ryo Nakagaki , Kenji Nakahira , Takehiro Hirai , Katsuhiro Kitahashi
IPC分类号： G06K9/00 , G06K9/46 , G01N23/22 , H01J37/26 , G06T7/00
CPC分类号： H01J37/26 , G01N23/22 , G01N2223/421 , G01N2223/6116 , G01N2223/6466 , G06T7/0004 , G06T2200/24 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148
摘要： A defect observation device including an input-output unit supplied with information of a taught defect, and information of an ideal output of the taught defect, and configured to display a processing result based upon a determined image processing parameter set; and an automatic determination unit configured to: select image processing parameter sets which are less in number than the total number of all image processing parameter sets, out of all image processing parameter sets, calculate image processing results on an input defect image, by using the selected image processing parameter sets, calculate a coincidence degree for each of the selected image processing parameter sets, estimate distribution of an index value in all image processing parameter sets from distribution of the coincidence degree for the selected image processing parameter sets, and determine an image processing parameter set to have a high coincidence degree out of all image processing parameter sets.
摘要翻译：一种缺陷观察装置，包括：提供教导缺陷的信息的输入输出单元和教导缺陷的理想输出的信息，并且被配置为基于确定的图像处理参数集显示处理结果; 以及自动确定单元，被配置为：在所有图像处理参数组中，选择数量少于所有图像处理参数组的总数的图像处理参数组，通过使用所述图像处理参数组来计算输入缺陷图像上的图像处理结果选择的图像处理参数组，对所选择的图像处理参数组中的每一个计算一致度，根据所选择的图像处理参数组的重合程度的分布来估计所有图像处理参数组中的索引值的分布，并且确定图像处理参数设置为在所有图像处理参数集中具有高重合度。

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