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41. 发明授权

US4229619A Method and apparatus for driving a multi way speaker system 失效
标题翻译：用于驱动多路扬声器系统的方法和装置
公开(公告)号：US4229619A
公开(公告)日：1980-10-21
申请号：US956265
申请日：1978-10-31
申请人： Nobuaki Takahashi , Eiichi Funasaka , Masanobu Shinozaki , Yasuo Kaizu
发明人： Nobuaki Takahashi , Eiichi Funasaka , Masanobu Shinozaki , Yasuo Kaizu
IPC分类号： H04R3/14 , H04R3/00
CPC分类号： H04R3/02 , H04R3/14 , H04R3/04
摘要： A multi way speaker system comprises an amplifier, frequency dividing network including a plurality of filters, a plurality of speakers respectively responsive to the output signals of the filters, and a summing circuit responsive to the output signals of the filters for producing a composite signal to be fed back to the input of the amplifier to establish a negative feedback loop. Because of the feedback loop undesirable influences by various elements included in the filters are diminished and thus the speakers reproduce audio frequencies with high fidelity. At least one equalizer may be employed in the feedback loop, while auxiliary filters may be used in such a manner that the output terminals of the auxiliary filters are connected to only the summing circuit so that the output signals of the auxiliary filters are added to an output signal of at least one filter of the frequency dividing network. In order to supply the network with the output signal of the amplifier and to feed the composite signal back to the amplifier a three-wire coaxial cable may be used. The three-wire coaxial cable is used in such a manner that the composite signal flows through a conductor which is shielded by another conductor carrying the output signal of the amplifier. A switch and a resistor network may be used in the feedback loop for avoiding undesirable oscillation and output level variation.
摘要翻译：多路扬声器系统包括放大器，包括多个滤波器的分频网络，分别响应于滤波器的输出信号的多个扬声器，以及响应于滤波器的输出信号的求和电路，用于产生复合信号反馈到放大器的输入以建立负反馈回路。由于反馈回路，包括在滤波器中的各种元件的不期望的影响减小，因此扬声器以高保真度再现音频。在反馈回路中可以采用至少一个均衡器，而辅助滤波器可以以这样的方式使用：辅助滤波器的输出端仅与求和电路连接，使得辅助滤波器的输出信号被加到分频网络的至少一个滤波器的输出信号。为了向网络提供放大器的输出信号，并将复合信号反馈给放大器，可以使用三线同轴电缆。三线同轴电缆的使用方式是复合信号流过导体，导体由承载放大器输出信号的另一个导体屏蔽。可以在反馈回路中使用开关和电阻网络，以避免不期望的振荡和输出电平变化。

42. 发明授权

US4156202A Impulsive noise reducing system 失效
标题翻译：脉冲降噪系统
公开(公告)号：US4156202A
公开(公告)日：1979-05-22
申请号：US809526
申请日：1977-06-24
申请人： Nobuaki Takahashi
发明人： Nobuaki Takahashi
IPC分类号： H03G3/20 , H03G3/34 , H04B1/10
CPC分类号： H03G3/3015 , H03G3/345
摘要： An impulsive noise reducing system comprises a peak level detector for producing a detection signal with specific rise and fall time constants, in response to positive and/or negative peak levels of an input signal. Any signal which relatively exceeds the level of the detection signal by positive and/or negative peak levels of impulsive noise admixed in the input signal causes a control signal to be generated. Responsive to the control signal, that part of the input signal wherein the impulsive noise exists is suppressed.
摘要翻译：脉冲降噪系统包括响应于输入信号的正和/或负峰值电平产生具有特定上升和下降时间常数的检测信号的峰值电平检测器。通过在输入信号中混合的脉冲噪声的正和/或负峰值电平相对超过检测信号的信号的任何信号导致产生控制信号。响应于控制信号，其中存在脉冲噪声的输入信号的那部分被抑制。

43. 发明授权

US3946330A Voltage controlled oscillator circuit 失效
标题翻译：压控振荡电路
公开(公告)号：US3946330A
公开(公告)日：1976-03-23
申请号：US561672
申请日：1975-03-25
申请人： Nobuaki Takahashi
发明人： Nobuaki Takahashi
IPC分类号： H03B1/00 , H03B5/02 , H03C3/00 , H03K3/011 , H03K3/0231 , H03K7/06 , H03L7/00 , H03L7/099 , H03K3/282
CPC分类号： H03K3/011 , H03K3/0231 , H03K7/06
摘要： A voltage controlled oscillator circuit comprises a voltage controlled oscillator circuit, first and second constant-current circuits respectively for causing first and second constant currents, current dividing means for dividing the first constant current in accordance with an outside control voltage, and means for adjustably varying the control voltage. The oscillation frequency is controlled responsive to an input control current equal to the sum of one of the divided currents and the second constant current. The adjustment means causes an adjustment of the output currents of the current dividing means and of the free-running oscillation frequency.
摘要翻译：压控振荡器电路包括分别用于产生第一和第二恒定电流的压控振荡器电路，第一恒定电流电路和第二恒流电路，用于根据外部控制电压分割第一恒定电流的电流分配装置，以及可调节变化的装置控制电压。响应于等于分压电流和第二恒定电流之和的输入控制电流来控制振荡频率。调节装置使得电流分配装置的输出电流和自由振荡频率的调整。

44. 发明授权

US09758594B2 Stable multivalent antibody 有权
公开(公告)号：US09758594B2
公开(公告)日：2017-09-12
申请号：US12989600
申请日：2009-04-27
申请人： Nobuaki Takahashi
发明人： Nobuaki Takahashi
IPC分类号： C07K16/28 , C07K16/00 , C07K16/46 , A61K39/395
CPC分类号： C07K16/468 , A61K39/39591 , C07K16/2818 , C07K16/2878 , C07K2317/51 , C07K2317/56 , C07K2317/622 , C07K2317/624 , C07K2317/626 , C07K2317/64 , C07K2319/00
摘要： The present invention relates to a multivalent antibody comprising multiple heavy chain variable regions of antibody linked to each other via a linker comprising an amino acid sequence encoding an immunoglobulin domain or a fragment thereof.

45. 发明授权

US09059429B2 Manufacturing method for organic electroluminescent panel and organic electroluminescent panel manufactured using the same 有权
标题翻译：使用其制造的有机电致发光面板和有机电致发光面板的制造方法
公开(公告)号：US09059429B2
公开(公告)日：2015-06-16
申请号：US13640355
申请日：2011-04-18
申请人： Masaaki Murayama , Nobuaki Takahashi , Daisuke Numakura
发明人： Masaaki Murayama , Nobuaki Takahashi , Daisuke Numakura
IPC分类号： H01J9/00 , H01L51/52
CPC分类号： H01L51/5246
摘要： A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.
摘要翻译：一种有机电致发光面板的简单制造方法，其中有机电致发光元件由密封胶布置和密封。电致发光面板由于有机电致发光元件通过热固性粘合剂彼此粘合而具有优异的密封性和优异的耐久性。该制造方法用于有机电致发光面板，其中至少第一电极，含有发光层的有机功能层，具有第二电极的有机电致发光元件和密封基板通过热量在基板上接合在一起可固化粘合剂。该方法包括在密封基板上形成热固性粘合剂层，对形成在密封基板上的热固性粘合剂层进行预热处理，将预热的可热固化粘合剂层接合到有机电致发光元件，以及以给定的顺序对热固性粘合剂层进行热固化。

46. 发明授权

US08911726B2 Stabilized human Igg4 antibodies 有权
标题翻译：稳定的人Igg4抗体
公开(公告)号：US08911726B2
公开(公告)日：2014-12-16
申请号：US11663340
申请日：2005-09-22
申请人： Nobuaki Takahashi , Hideaki Yoshida
发明人： Nobuaki Takahashi , Hideaki Yoshida
IPC分类号： A61K39/395 , C07K16/28 , C12N15/13 , C07K16/00
CPC分类号： C07K16/2878 , A61K39/39591 , C07K16/00 , C07K2317/21 , C07K2317/24 , C07K2317/52 , C07K2317/56 , C07K2317/76 , C07K2317/94
摘要： A highly stable mutant of human IgG4 antibody is provided. Such antibody is an antibody in which the CH3 domain of human IgG4 is substituted with the CH3 domain of human IgG1 and which exhibits inhibited aggregate formation, an antibody in which the CH3 and CH2 domains of human IgG4 are substituted with the CH3 and CH2 domains of human IgG1, respectively, or an antibody in which arginine at position 409 indicated in the EU index proposed by Kabat et al. of human IgG4 is substituted with lysine and which exhibits inhibited aggregate formation.
摘要翻译：提供了高度稳定的人IgG4抗体突变体。这样的抗体是其中人IgG4的CH3结构域被人IgG1的CH3结构域取代并且表现出抑制聚集体形成的抗体，其中人IgG4的CH 3和CH 2结构域被CH 3和CH 2结构域所取代的抗体或者其中在Kabat等人提出的欧盟指标中指出的409位精氨酸的抗体。的人IgG4被赖氨酸取代，并且其表现出抑制的聚集体形成。

47. 发明授权

US08728950B2 Coating method, and organic electroluminescence element 有权
标题翻译：涂布方法和有机电致发光元件
公开(公告)号：US08728950B2
公开(公告)日：2014-05-20
申请号：US13260068
申请日：2010-06-15
申请人： Shigetoshi Kawabe , Nobuaki Takahashi
发明人： Shigetoshi Kawabe , Nobuaki Takahashi
IPC分类号： H01L21/31
CPC分类号： H01L51/0004 , B05C5/025 , B05C5/0254 , B05D1/265 , B05D5/06 , H01L51/56
摘要： Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero.
摘要翻译：公开了使用狭缝型模涂机和使用涂布法制备的有机电致发光元件，从具有低粘度的涂布溶液形成具有稳定厚度的涂层的涂布方法。使用狭缝型模涂机的涂布方法包括以下步骤：使狭缝型模涂机的唇尖靠近基板，以在唇尖和基板之间形成涂布溶液珠，并在基板上涂布在狭缝型模具涂布机和基板相对移动的同时从唇尖处的狭缝出口喷射的涂布溶液，从而形成至少两条条状涂层，其特征在于，唇尖在其中具有至少一个凹槽在涂布宽度方向上的涂布区域，珠的涂布溶液的狭缝出口处的压力为负或为零。

48. 发明申请

US20130315435A1 SPEAKER EDGE, METHOD FOR MANUFACTURING SAME AND SPEAKER 审中-公开
标题翻译：扬声器边缘，其制造方法和扬声器
公开(公告)号：US20130315435A1
公开(公告)日：2013-11-28
申请号：US13990721
申请日：2010-11-30
申请人： Masatoshi Sato , Nobuaki Takahashi , Masaru Nakagawa , Teruaki Kaiya , Junichi Sato
发明人： Masatoshi Sato , Nobuaki Takahashi , Masaru Nakagawa , Teruaki Kaiya , Junichi Sato
IPC分类号： H04R7/16 , H04R7/02
CPC分类号： H04R7/20 , B32B5/22 , B32B7/02 , B32B27/12 , H04R7/02 , H04R7/16 , H04R31/003 , H04R2231/001 , H04R2231/003 , H04R2307/204 , H04R2307/207 , H04R2499/11 , H04R2499/13 , H04R2499/15
摘要： A speaker edge includes a resin layer including a resin member and a fiber layer including a tangled fiber body. A melting temperature of the tangled fiber body is higher than a melting temperature of the resin member. The hardness of the tangled fiber body is lower than the hardness of the resin member.
摘要翻译：扬声器边缘包括包括树脂构件的树脂层和包括缠结纤维体的纤维层。缠结纤维体的熔融温度高于树脂部件的熔融温度。缠结纤维体的硬度低于树脂部件的硬度。

49. 发明授权

US08426311B2 Method and apparatus for manufacturing semiconductor device 失效
标题翻译：用于制造半导体器件的方法和装置
公开(公告)号：US08426311B2
公开(公告)日：2013-04-23
申请号：US12801458
申请日：2010-06-09
申请人： Nobuaki Takahashi , Masahiro Komuro
发明人： Nobuaki Takahashi , Masahiro Komuro
IPC分类号： H01L21/445
CPC分类号： C23C18/1651 , C23C18/1632 , C23C18/32 , C23C18/54 , H01L21/288 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05556 , H01L2224/05644 , H01L2224/13 , H01L2224/13099 , H01L2224/48463 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment.
摘要翻译：一种半导体器件的制造方法包括使用无电镀法在半导体衬底上形成多个金属膜的叠层结构。金属膜的形成包括：使用第一镀槽进行包括还原反应的无电镀处理; 并且仅使用第二镀槽进行取代反应进行化学镀处理。包括使用第一镀槽进行的还原反应的化学镀处理在遮蔽环境中进行，并且在非遮蔽环境中进行仅使用第二镀槽的取代反应进行的化学镀处理。

50. 发明授权

US08177925B2 High-tensile steel plate, welded steel pipe or tube, and methods of manufacturing thereof 有权
标题翻译：高强度钢板，焊接钢管或管，及其制造方法
公开(公告)号：US08177925B2
公开(公告)日：2012-05-15
申请号：US11886423
申请日：2006-03-08
申请人： Nobuaki Takahashi , Masahiko Hamada , Shuji Okaguchi , Akihiro Yamanaka , Ichirou Seta
发明人： Nobuaki Takahashi , Masahiko Hamada , Shuji Okaguchi , Akihiro Yamanaka , Ichirou Seta
IPC分类号： C22C38/14 , C22C38/12 , C22C38/04 , C22C38/48 , C22C38/50 , C21D8/00 , C21D8/10 , C21D9/08
CPC分类号： C21D8/0226 , B21B3/02 , B21C37/08 , C21D8/10 , C21D9/08 , C21D9/50 , C21D2211/002 , C21D2211/005 , C22C38/002 , C22C38/005 , C22C38/02 , C22C38/04 , C22C38/08 , C22C38/12 , C22C38/14 , C22C38/40 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/50 , C22C38/58 , Y10S148/908 , Y10T428/12292
摘要： In a high-tensile steel plate according to the invention, the carbon equivalent Pcm represented in Expression (1) is from 0.180% to 0.220%, the surface hardness is a Vicker's hardness of 285 or less, the ratio of a Martensite Austenite constituent in the surface layer is not more than 10%, the ratio of a mixed structure of ferrite and bainite inside beyond the surface layer is not less than 90%, the ratio of the bainite in the mixed structure is not less than 10%, the thickness of the lath of bainite is not more than 1 μm, the length of the lath is not more than 20 μm, and the segregation ratio as the ratio of the Mn concentration in the center segregation part relative to the Mn concentration at a part in a depth equal to ¼ of the thickness of the plate from the surface is not more than 1.3. Pcm=C+Si/30+(Mn+Cu+Cr)/20+Ni/60+Mo/15+V/10+5B . . . (1) where the element symbols in Expression (1) represent the % by mass of the respective elements. In this way, the high-tensile steel plate according to the invention has a yield strength of at least 551 MPa and a tensile strength of at least 620 MPa as well as high toughness, high propagating shear fracture and high weldability.
摘要翻译：在本发明的高强度钢板中，式（1）所示的碳当量Pcm为0.180〜0.220％，表面硬度为维氏硬度为285以下，马氏体奥氏体成分表面层不超过10％，铁素体和贝氏体在表面层之外的混合结构的比例不小于90％，混合结构中的贝氏体比不小于10％，厚度贝氏体的板条的长度不超过1μm，板条的长度不大于20μm，偏析中心偏析部分的Mn浓度相对于一部分的Mn浓度的偏析比与表面厚度相当的1/4的厚度不大于1.3。 Pcm = C + Si / 30 +（Mn + Cu + Cr）/ 20 + Ni / 60 + Mo / 15 + V / 10 + 5B。。。（1）其中，式（1）中的元素符号表示各元素的质量％。这样，根据本发明的高强度钢板的屈服强度至少为551MPa，拉伸强度为至少620MPa，韧性高，传播剪切断裂高，焊接性高。

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