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41. 发明专利

JPH11261202A MANUFACTURE OF FLEXIBLE WIRING BOARD 失效
公开(公告)号：JPH11261202A
公开(公告)日：1999-09-24
申请号：JP6146598
申请日：1998-03-12
申请人： HITACHI LTD , NITTO DENKO CORP
发明人： KYOI MASAYUKI , OWAKI YASUHITO , ERIGUCHI FUYUKI
IPC分类号： H05K3/28 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To efficiently manufacture a flexible wiring board containing no void. SOLUTION: After a laminated body A is formed by laying the wiring surface of a base substrate 30 on the bonding surface of an insulating film 31, the laminated body A is positioned between upper and lower hot plates 19b and 19a and heated to a prescribed temperature. After the joining surface of the upper hot plate 19b is brought into contact with an elastic sealing material 20 put on the joining surface of the lower hot plate 19a, the airtight space between the hot plates 19b and 19a are evacuated to a vacuum and the laminated body A is heated and compressed by lowering the upper hot plate 19b by utilizing the differential pressure ΔP between the internal and external pressures of the airtight space. In addition, the hot plates 19a and 19b are locked with locking blocks 11a and 11b. After the evacuation by means of a vacuum pump is stopped and the internal pressure of the airtight space is returned to the atmospheric pressure at a breath, compressed air is continuously introduced to the airtight space until an insulating adhesive hardens.

42. 发明专利

JPH11238959A CIRCUIT BOARD 失效
公开(公告)号：JPH11238959A
公开(公告)日：1999-08-31
申请号：JP3702998
申请日：1998-02-19
申请人： NITTO DENKO CORP
发明人： OMOTE TOSHIHIKO , OWAKI YASUHITO , ITO KENICHIRO
IPC分类号： H05K3/28 , G11B5/60 , H01L21/60 , H05K3/24 , H05K3/32 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain a high reliability in the connection of an electronic part mounted on a circuit board and the terminal of the circuit board, by locating the surface of a terminal lower than the surface of a cover lay, and specifying the step between the surface of the cover lay and the terminal surface less than the specified value. SOLUTION: A circuit board is formed by providing a conductor circuit 1 on an insulating layer 2, providing a cover lay 3 on the conductor circuit 1 and a terminal 4, which is conducted to the conductor circuit through the cover lay 3. Then, the terminal surface is located lower than the surface of the cover lay. A step difference 30 between the cover-lay surface and the terminal surface is very small. This step difference is mess than 3 μm, but it is recommendable to be less than 2 μm and ideally less than 1 μm. Then, the terminal of the electronic part mounted on the circuit board and the terminal of the circuit board are connected by a metal ball 34. The metal ball 34 is in contact with bath of the terminal 32 of the electronic part and the terminal 4 of the circuit board. As the material for the metal ball 34, solder, gold and the like are listed, but especially the gold is recommendable.

43. 发明专利

JPH11233905A CIRCUIT BOARD 失效
公开(公告)号：JPH11233905A
公开(公告)日：1999-08-27
申请号：JP2693398
申请日：1998-02-09
申请人： NITTO DENKO CORP
发明人： OMOTE TOSHIHIKO , OWAKI YASUHITO , ITO KENICHIRO
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To inhibit the occurrence of short circuits, when a circuit board is used under high temperature and humidity conditions for a long time by setting the end of a conductor circuit on an insulating layer on the inner side of the end of the insulating layer. SOLUTION: A circuit board is provided with a conductor circuit 1 on an insulating layer 2, in such a way that the end of the conductor circuit 1 is on the inner side of the end of the insulating layer 2. A metal base 4 is disposed under the insulating layer 2 and a cover lay 5 is formed on the conductor circuit 1. The end of the cover lay 5 is on the inner side of the end of the insulating layer 2 similar to the case of the end of the conductor circuit 1 or are flush with each other as the end of the insulating layer 2. The end of the conductor circuit 1 preferably is on enter in the inner side of the end of the insulating layer 2 by 0.01-0.02 mm. The conductor circuit 1 is made of materials such as copper, aluminum and tungsten. The insulating layer 2 is made of resins such as polyimide, polyester and epoxy resin and is normally 3-50 μm thick.

44. 发明专利

JPH06164093A CIRCUIT BOARD 失效
公开(公告)号：JPH06164093A
公开(公告)日：1994-06-10
申请号：JP30707092
申请日：1992-11-17
申请人： NITTO DENKO CORP
发明人： OWAKI YASUHITO , SHIBAGAKI KAZUYOSHI
IPC分类号： H05K1/11 , H05K3/00 , H05K3/42
摘要： PURPOSE:To provide a circuit board having reliable connections between conductor wiring layers. CONSTITUTION:A circuit board has plated through holes 4. The hole 4 has a roughened inner wall surface 6 with a roughnes height of 0.1-10mum 0.1-10mum before plating, and the plated wall of the hole has a roughness reduced 1/100-1/2 of the initial roughness.

45. 发明专利

JPH03105816A TOUCH-PANEL SWITCH 失效
公开(公告)号：JPH03105816A
公开(公告)日：1991-05-02
申请号：JP24295489
申请日：1989-09-18
申请人： NITTO DENKO CORP
发明人： MORI YOSHIHISA , OYA YOSHIYUKI , OWAKI YASUHITO
IPC分类号： H01H13/52 , G06F3/041 , H01H13/02
摘要： PURPOSE:To eliminate the input inoperable part and to improve the appearance by providing an insulating membrane on a transparent electrode in a plane form. CONSTITUTION:Both electrodes 1 and 2 are provided opposing each other maintaining a very small interval 5, and the very small interval 5 is secured by the thickness of an adhesive 6 which connects transparent sheets 3 and 4 around the whole periphery of the electrodes. And an insulating membrane 7 is arranged over the surface of the transparent electrode. This membrane 7 performs a role of a spacer, and at the same time, it makes a continuity between the both electrodes 1 and 2 at the pressed part when depressed by a pushing, and furthermore, it is transparent not to be recognized visually of its presence. Consequently, no input inoperable part is generated, and a good appearance can be obtained.

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