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41. 发明授权

US08568244B2 Tripod constant velocity joint 有权
标题翻译：三脚架等速万向节
公开(公告)号：US08568244B2
公开(公告)日：2013-10-29
申请号：US13023837
申请日：2011-02-09
申请人： Tae Hong Kim , Hun Hee Lee , Il Hun Ryu , Jose Da Silva
发明人： Tae Hong Kim , Hun Hee Lee , Il Hun Ryu , Jose Da Silva
IPC分类号： F16D3/205
CPC分类号： F16D3/2055
摘要： A constant velocity joint for a drive system comprises: a tripod housing coupled to the first rotating shaft and having a plurality of guide grooves therein, each guide groove extending in an axial direction of the tripod housing; a spider coupled to the second rotating shaft and having a plurality of trunnions, each trunnion positioned in a corresponding guide groove of the tripod housing; and a spherical roller disposed between the trunnion and the guide groove of the tripod housing, and a plurality of needle rollers disposed between the trunnion and spherical roller. Each spherical roller is in angular contact with the guide groove of the tripod housing with two contact points displaced relative to a pitch circle diameter line of the tripod housing. The ratio of the length (CL) between two contact points of tripod housing groove to the length (SL) between two edges of spherical roller is between 0.5 and 0.85, and the ratio of the radius (TGR2) of the guide groove of the tripod housing to the radius (SRR) of the spherical roller is between 1.1 and 1.4.
摘要翻译：用于驱动系统的恒速接头包括：三脚架壳体，其联接到第一旋转轴并且在其中具有多个引导槽，每个引导槽沿三角架壳体的轴向方向延伸; 一个与所述第二旋转轴相连并且具有多个耳轴的蜘蛛，每个耳轴位于所述三脚架壳体的对应引导槽中; 以及设置在三角架壳体的耳轴和引导槽之间的球面滚子，以及设置在耳轴和球面滚子之间的多个滚针。每个球面滚子与三脚架壳体的引导槽成角度接触，两个接触点相对于三脚架外壳的节圆直径线移动。三脚架壳体槽的两个接触点与球面滚子的两个边缘之间的长度（SL）之间的长度（CL）的比率在0.5和0.85之间，并且三脚架的引导槽的半径（TGR2）外壳到球面滚子的半径（SRR）在1.1和1.4之间。

42. 发明授权

US08558345B2 Integrated decoupling capacitor employing conductive through-substrate vias 有权
标题翻译：集成的去耦电容采用导电贯穿衬底通孔
公开(公告)号：US08558345B2
公开(公告)日：2013-10-15
申请号：US12614883
申请日：2009-11-09
申请人： Tae Hong Kim , Edmund J. Sprogis , Michael F. McAllister , Michael J. Shapiro
发明人： Tae Hong Kim , Edmund J. Sprogis , Michael F. McAllister , Michael J. Shapiro
IPC分类号： H01L27/108 , H01L29/94 , H01L23/04 , H01L21/02
CPC分类号： H01L28/40 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/642 , H01L24/16 , H01L25/0657 , H01L2224/13025 , H01L2225/06513 , H01L2225/06541 , H01L2924/01078 , H01L2924/10253 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.
摘要翻译：半导体衬底中的电容器采用导电贯穿衬底通孔（TSV）作为内部电极和柱状掺杂半导体区域作为外部电极。电容器在小面积上提供大的去耦电容，并且不影响电路密度或Si3D结构设计。可以在半导体衬底中提供附加的导电TSV，以提供用于电源和通过其的信号传输的电连接。电容器具有比具有相当电容的传统电容器阵列更低的电感，从而能够降低层叠半导体芯片的电源系统中的高频噪声。

43. 发明授权

US08288660B2 Preserving stopband characteristics of electromagnetic bandgap structures in circuit boards 失效
标题翻译：保持电路板中电磁带隙结构的阻带特性
公开(公告)号：US08288660B2
公开(公告)日：2012-10-16
申请号：US12244854
申请日：2008-10-03
申请人： Tae Hong Kim
发明人： Tae Hong Kim
IPC分类号： H05K1/11
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , Y10T29/49155
摘要： The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a periodically patterned region having a plurality of spaced-apart patches interconnected by branches. Additional conductive layers may be included within the printed circuit board without neutralizing the bandgap by forming slots in the conductive layers in general alignment with spaces between the patches.
摘要翻译：可以通过在印刷电路板的附加导电层中选择性地形成槽来保留印刷电路板中的电磁带隙结构的阻带特性。例如，电磁带隙结构可以包括具有连续导电区域的层和具有周期性图案化区域的另一层，其具有通过分支互连的多个间隔开的贴片。附加的导电层可以包括在印刷电路板中，而不会通过在导电层中形成与填隙之间的空间对准的槽而中和带隙。

44. 发明申请

US20120020042A1 NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES 有权
标题翻译：噪声抑制器用于半导体封装
公开(公告)号：US20120020042A1
公开(公告)日：2012-01-26
申请号：US12840861
申请日：2010-07-21
申请人： Nickolaus J. Gruendler , Paul M. Harvey , Tae Hong Kim , Sang Y. Lee , Michael J. Shapiro
发明人： Nickolaus J. Gruendler , Paul M. Harvey , Tae Hong Kim , Sang Y. Lee , Michael J. Shapiro
IPC分类号： H05K7/02 , H05K3/30 , H05K3/34 , H05K1/16
CPC分类号： G01L9/12 , H01L2224/16227 , H01L2224/16235 , H01L2924/1531 , H01L2924/3025 , H05K1/0228 , H05K1/0231 , H05K1/0251 , Y10T29/49139 , Y10T29/49142
摘要： One or more decoupling capacitors are coupled to a low inductance mount that is connected to the bottom layer of a printed circuit board (PCB) on which a semiconductor module is mounted. The low inductance mount includes a magnetic planar structure with vias that are coupled to the one or more decoupling capacitors and to like vias positioned on the PCB.
摘要翻译：一个或多个去耦电容器耦合到低电感安装座，该低电感安装件连接到其上安装有半导体模块的印刷电路板（PCB）的底层。低电感安装座包括磁性平面结构，其具有耦合到一个或多个去耦电容器的过孔以及位于PCB上的相似通孔。

45. 发明授权

US08060457B2 Systems and methods for electromagnetic band gap structure synthesis 有权
标题翻译：电磁带隙结构合成的系统和方法
公开(公告)号：US08060457B2
公开(公告)日：2011-11-15
申请号：US11854997
申请日：2007-09-13
申请人： Tae Hong Kim , Ege Engin , Madhavan Swaminathan
发明人： Tae Hong Kim , Ege Engin , Madhavan Swaminathan
IPC分类号： G06F15/18 , G06N3/00 , G06N3/12
CPC分类号： G06F17/5068
摘要： The present invention describes methods and apparatus for electromagnetic band gap structure synthesis. An exemplary embodiment of the present invention provides a method of electromagnetic band gap structure synthesis, which includes the step of providing a set of desired characteristics for an electromagnetic band gap structure. Furthermore, the method includes generating populations of patch shape members with a genetic algorithm routine and solving one or more of patch shape members of the populations with an electrodynamics modeling technique. Thereafter, the method includes the step of converting the output of the electrodynamics modeling technique into a set of response data for one or more of the patch shape members and calculating a fitness level for one or more of the sets of response data in comparison to the set of desired characteristics for the electromagnetic band gap structure. Next, the method includes the step of determining whether the fitness level of one of the patch shape members is within a predetermined tolerance. Subsequently, if none of the patch shape members provides a fitness level within the predetermined tolerance, then the steps of generating, solving, converting, calculating, and determining are repeated.
摘要翻译：本发明描述了用于电磁带隙结构合成的方法和装置。本发明的一个示例性实施例提供了一种电磁带隙结构合成方法，其包括为电磁带隙结构提供一组所需特性的步骤。此外，该方法包括使用遗传算法程序生成斑块形状成员的群体，并用电动力学建模技术解决群体中的一个或多个斑块形状成员。此后，该方法包括以下步骤：将电动力学建模技术的输出转换成用于一个或多个补片形状构件的一组响应数据，并计算一组或多组响应数据的适应度水平，与设置电磁带隙结构的所需特性。接下来，该方法包括以下步骤：确定一个贴片形状构件的适合度是否在预定的容限内。随后，如果贴片形状构件中没有一个在预定公差内提供适合度，则重复生成，求解，转换，计算和确定的步骤。

46. 发明申请

US20110222224A1 CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE 有权
标题翻译：具有最小化焊盘电容的无线多层电路基板
公开(公告)号：US20110222224A1
公开(公告)日：2011-09-15
申请号：US12720386
申请日：2010-03-09
申请人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
发明人： Kevin Bills , Mahesh Bohra , Jinwoo Choi , Tae Hong Kim , Rohan Mandrekar
IPC分类号： G06F1/16 , H05K1/11 , H05K1/00 , H05K7/00
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L2224/16 , H01L2224/16235 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H05K1/0231 , H05K1/024 , H05K1/0251 , H05K1/113 , H05K1/144 , H05K2201/0187 , H05K2201/041 , H05K2201/09481 , H05K2201/09718 , H05K2201/10734 , Y10T29/49124 , Y10T29/49151 , H01L2924/00
摘要： A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
摘要翻译：多层互连衬底具有至少两个间隔开的金属层，每个金属层上具有导电焊盘。在金属层之间放置两种不同类型的绝缘层。这种放置使得两种不同类型的绝缘层中的一种被放置在导电焊盘之间，另一种类型的绝缘层被放置在两个间隔开的金属层之间。

47. 发明申请

US20110108948A1 INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTRATE VIAS 有权
标题翻译：采用导电穿透基板VIAS的集成式解除电容器
公开(公告)号：US20110108948A1
公开(公告)日：2011-05-12
申请号：US12614883
申请日：2009-11-09
申请人： Tae Hong Kim , Edmund J. Sprogis , Michael F. McAllister , Michael J. Shapiro
发明人： Tae Hong Kim , Edmund J. Sprogis , Michael F. McAllister , Michael J. Shapiro
IPC分类号： H01L29/92 , H01L21/02 , H01L21/768
CPC分类号： H01L28/40 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/642 , H01L24/16 , H01L25/0657 , H01L2224/13025 , H01L2225/06513 , H01L2225/06541 , H01L2924/01078 , H01L2924/10253 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.
摘要翻译：半导体衬底中的电容器采用导电贯穿衬底通孔（TSV）作为内部电极和柱状掺杂半导体区域作为外部电极。电容器在小面积上提供大的去耦电容，并且不影响电路密度或Si3D结构设计。可以在半导体衬底中提供附加的导电TSV，以提供用于电源和通过其的信号传输的电连接。电容器具有比具有相当电容的传统电容器阵列更低的电感，从而能够降低层叠半导体芯片的电源系统中的高频噪声。

48. 发明申请

US20100084176A1 PRESERVING STOPBAND CHARACTERISTICS OF ELECTROMAGNETIC BANDGAP STRUCTURES IN CIRCUIT BOARDS 失效
标题翻译：电路板电磁带结构的保护特性
公开(公告)号：US20100084176A1
公开(公告)日：2010-04-08
申请号：US12244854
申请日：2008-10-03
申请人： Tae Hong Kim
发明人： Tae Hong Kim
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , Y10T29/49155
摘要： The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a periodically patterned region having a plurality of spaced-apart patches interconnected by branches. Additional conductive layers may be included within the printed circuit board without neutralizing the bandgap by forming slots in the conductive layers in general alignment with spaces between the patches.
摘要翻译：可以通过在印刷电路板的附加导电层中选择性地形成槽来保留印刷电路板中的电磁带隙结构的阻带特性。例如，电磁带隙结构可以包括具有连续导电区域的层和具有周期性图案化区域的另一层，其具有通过分支互连的多个间隔开的贴片。附加的导电层可以包括在印刷电路板中，而不会通过在导电层中形成与填隙之间的空间对准的槽而中和带隙。

49. 发明申请

US20090011843A1 Constant Velocity Joint of Tripod Type 有权
标题翻译：三脚架类型恒速接头
公开(公告)号：US20090011843A1
公开(公告)日：2009-01-08
申请号：US12210143
申请日：2008-09-12
申请人： Seung Tark Oh , Tae Hong Kim
发明人： Seung Tark Oh , Tae Hong Kim
IPC分类号： F16D3/16
CPC分类号： F16D3/2055 , F16D2003/2026 , Y10S464/905
摘要： A constant velocity joint for a drive system of a vehicle comprises: a spider trunnion for transmitting torque between first and second shaft of the drive system, the spider trunnion including a spherical outer surface; and a roller assembly operatively attached on the spider trunnion, the roller assembly including an inner roller, an outer roller, and a plurality of needle rollers engaged between the inner and outer rollers, wherein the inner roller includes a tapered outer surface with a taper angle (θt), and the outer roller includes a tapered inner surface with the same taper angle (θt). The taper angle (θt) is preferably in a range from about 0.23° and to about 1.17°, and selected in consideration of both accommodating the inner roller to move without jamming in an entire effective movement range under presence of a maximum joint angle of the drive system, and preventing self separation of the roller assembly by jamming stop between the inner, outer and needle rollers due to the tapered structure of the rollers. The inner roller is preferably configured to have a ratio LL/RR1 in a range from about 0.11 to about 0.20, where LL is a distance from the center of the spider trunnion to a starting edge of the chamfer or recessed area of the inner roller at initial or neutral position thereof, and RR1 is a radius of the spherical surface of the spider trunnion.
摘要翻译：一种用于车辆的驱动系统的等速万向节包括：用于在所述驱动系统的第一和第二轴之间传递扭矩的叉形耳轴，所述蜘蛛耳轴包括球形外表面; 以及可操作地附接在所述蜘蛛耳轴上的辊组件，所述辊组件包括内辊，外辊和接合在所述内辊和外辊之间的多个针辊，其中所述内辊包括具有锥角的锥形外表面（tt），外辊包括具有相同锥角（tt）的锥形内表面。锥角（tt）优选在约0.23°至约1.17°的范围内，并且考虑到在存在最大接合角度的情况下，在内部辊容纳移动而不会在整个有效运动范围内卡住驱动系统，并且由于辊的锥形结构，防止辊组件被内，外辊和针辊之间的卡止停止自身分离。内辊优选地被配置为具有从约0.11至约0.20的范围内的LL / RR1的比率，其中LL是从蜘蛛耳轴的中心到内辊的倒角或凹入区域的起始边缘的距离初始或中性位置，RR1是蜘蛛耳轴的球面的半径。

50. 发明申请

US20060127022A1 Planar optical waveguide and method of fabricating the same 失效
标题翻译：平面光波导及其制造方法
公开(公告)号：US20060127022A1
公开(公告)日：2006-06-15
申请号：US11237223
申请日：2005-09-28
申请人： Tae Hong Kim , Jong Jun You , Hee Kyung Sung
发明人： Tae Hong Kim , Jong Jun You , Hee Kyung Sung
IPC分类号： G02B6/10
CPC分类号： G02B6/125 , G02B6/12004 , G02B6/12007
摘要： Provided are a planar optical waveguide and a method of fabricating the same which is adapted to a planar optical component and an optical component for use in a optical communication. The planar optical waveguide includes: a lower cladding layer formed on a substrate, a core formed on the lower cladding layer, a dielectric layer covering the core, and an upper cladding layer formed on the lower cladding layer having the dielectric layer. By forming the dielectric layer having a low refractive index between the core and the clad, a difference of refractive indices between the core and the clad increases so that light is densely focused into the core, thereby forming a single mode having a strong energy to minimize a propagation loss.
摘要翻译：提供一种平面光波导及其制造方法，其适用于用于光通信的平面光学部件和光学部件。平面光波导包括：形成在基板上的下包层，形成在下包层上的芯，覆盖芯的电介质层和形成在具有电介质层的下包层上的上包层。通过在芯和包层之间形成具有低折射率的电介质层，芯和包层之间的折射率差增加，使得光密集地聚焦到芯中，从而形成具有强能量的单模以最小化传播损失。

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