会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 44. 发明申请
    • MEMORY MODULE
    • 记忆模块
    • US20070140040A1
    • 2007-06-21
    • US11611036
    • 2006-12-14
    • Yurika AokiSeiji FunabaYoji Nishio
    • Yurika AokiSeiji FunabaYoji Nishio
    • G11C5/06G11C8/00
    • G11C5/063G11C5/04
    • A novel memory module with a multiple-rank configuration is provided to solve the problem that high-speed operation is impossible due to the fact that timing of a data strobe signal input to a memory is deviated from timing of a clock signal input thereto. In the memory module, a load capacity is provided at the vicinity of a clock signal input pin of a phase-locked loop circuit where the clock signal is input to match a time constant of a data strobe signal line with a time constant of a clock signal line. The matching of the input timings of the clock signal and the data strobe signal input to the memory enables the memory module to operate at a high speed.
    • 提供了具有多级配置的新型存储器模块,以解决由于输入到存储器的数据选通信号的定时偏离输入到其的时钟信号的定时的事实而无法进行高速操作的问题。 在存储器模块中,在锁存环路电路的时钟信号输入引脚附近提供负载能力,其中输入时钟信号以使数据选通信号线的时间常数与时钟的时间常数相匹配 信号线。 时钟信号的输入定时和输入到存储器的数据选通信号的匹配使得存储器模块能够以高速运行。
    • 45. 发明申请
    • Memory module and memory system
    • 内存模块和内存系统
    • US20070081376A1
    • 2007-04-12
    • US11634405
    • 2006-12-06
    • Seiji FunabaYoji NishioKayoko Shibata
    • Seiji FunabaYoji NishioKayoko Shibata
    • G11C5/06
    • G11C5/04G11C5/063G11C7/1048G11C11/4093G11C2207/105H01L2224/16225H01L2924/15192H01L2924/15311H01L2924/19107
    • A memory module has a plurality of DRAMs (115), which share a bus line, on the front surface and the back surface of a board. The bus line is connected through a via hole (113) from a terminal (111) to one end of a strip line (112), and the other end of the strip line is connected to a strip line in the other layer through a via hole (119) provided for looping back the line. A termination resistor (120), provided near a termination voltage terminal (VTT), is connected to the looped-back strip line in the other layer through a via hole. The DRAM terminals are connected to the strip line each through a via hole. This memory module is mounted on a motherboard, on which a memory controller is provided, through a connector. The effective characteristic impedance of the bus line is matched with the characteristic impedance of the line in the motherboard.
    • 存储器模块具有在板的前表面和后表面上共享总线的多个DRAM(115)。 总线通过通孔(113)从端子(111)连接到带状线(112)的一端,并且带状线的另一端通过通孔(113)连接到另一层中的带状线 孔(119)用于使线路循环。 设置在终端电压端子(VTT)附近的终端电阻器(120)通过通孔连接到另一层中的环形带状线。 DRAM端子通过通孔连接到带状线。 该存储器模块通过连接器安装在其上提供存储器控制器的母板上。 母线的有效特性阻抗与母板线路特性阻抗匹配。
    • 46. 发明授权
    • Memory module and memory system suitable for high speed operation
    • 内存模块和内存系统适合高速运行
    • US07016212B2
    • 2006-03-21
    • US10630457
    • 2003-07-29
    • Kayoko ShibataYoji NishioSeiji Funaba
    • Kayoko ShibataYoji NishioSeiji Funaba
    • G11C5/06
    • H05K1/0246H05K2201/10022H05K2201/10159
    • A memory module comprises a stab resistor between a pin and one end of a bus. A plurality of memory chips is connected to the bus between both ends thereof. A terminating resistor is connected to the other end of the bus. Stab resistance Rs of the stab resistor and terminating resistance Rterm of the terminating resistor are given by: Rs=(N−1)×Zeffdimm/N, and Rterm=Zeffdimm where N represents the number of the memory modules in a memory system; and Zeffdimm, effective impedance of a memory chip arrangement portion consisting of the bus and the memory chips. In the memory system, the memory modules are connected to a memory controller on a motherboard in a stab connection style. Wiring impedance Zmb of the motherboard is given by: Zmb=(2N−1)×Zeffdimm/N2.
    • 存储器模块包括在引脚和总线的一端之间的尖端电阻器。 多个存储器芯片在其两端之间连接到总线。 终端电阻连接到总线的另一端。 尖端电阻的阻抗Rs和终端电阻的终端电阻Rterm由下式给出:<?in-line-formula description =“In-line Formulas”end =“lead”?> Rs =(N-1)xZeffdimm / N和<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?> Rterm = Zeffdimm <?in-line-formula description =“在线公式”end =“tail”?>其中N表示存储器系统中的存储器模块的数量; 和Zeffdimm,由总线和存储器芯片组成的存储芯片布置部分的有效阻抗。 在存储器系统中,存储器模块以连接方式连接到主板上的存储器控​​制器。 主板的接线阻抗Zmb由下式给出:<?in-line-formula description =“In-line formula”end =“lead”?> Zmb =(2N-1)xZeffdimm / N < 。<?in-line-formula description =“In-line Formulas”end =“tail”?>
    • 48. 发明授权
    • Signal transmitting system
    • 信号传输系统
    • US06985009B2
    • 2006-01-10
    • US10816187
    • 2004-04-02
    • Yoji NishioSeiji Funaba
    • Yoji NishioSeiji Funaba
    • H03K17/16
    • H04L5/16G11C7/1006H04L25/0278
    • Semiconductor integrated circuit devices that operate under different power supply voltages are directly interconnected by a bidirectional bus which is a transmission line. A driver is of a push-pull type and a reception side is CTT-terminated. If a terminating resistor is in conformity with the characteristic impedance of the transmission line, the on resistance of the driver is equal to or lower than the characteristic impedance. If the on resistance of the driver is in conformity with the characteristic impedance of the transmission line, the value of the terminating resistor is equal to or lower than the characteristic impedance of the transmission line. If the reception side is VTT-terminated, the value of the VTT is ½ of a lower one of power supply voltages that are supplied to the respective semiconductor integrated circuit devices. The value of the terminating resistor is in conformity with the characteristic impedance of the transmission line. The semiconductor integrated circuit devices use a common reference voltage for determining the signal voltage.
    • 在不同电源电压下工作的半导体集成电路器件通过作为传输线的双向总线直接互连。 驱动器是推挽式的,接收端是CTT端接的。 如果终端电阻符合传输线的特性阻抗,则驱动器的导通电阻等于或低于特性阻抗。 如果驱动器的导通电阻与传输线的特性阻抗一致,则终端电阻的值等于或低于传输线的特性阻抗。 如果接收侧是VTT终止的,则VTT的值是提供给各个半导体集成电路器件的电源电压中的较低一个的1/2。 终端电阻的值与传输线的特性阻抗一致。 半导体集成电路器件使用公共参考电压来确定信号电压。
    • 49. 发明授权
    • Memory device
    • 内存设备
    • US06970369B2
    • 2005-11-29
    • US10234261
    • 2002-09-04
    • Seiji FunabaYoji Nishio
    • Seiji FunabaYoji Nishio
    • G06F3/00G06F12/00G06F13/16G11C5/06G11C7/00G11C7/10G11C11/401G11C11/4093H03K19/0175D11C5/06
    • G11C7/1048G11C5/063G11C7/10G11C11/4093
    • In a memory device having a controller and multiple memory modules both of which are mounted together on a motherboard, a high-speed operation is executed by suppressing waveform distortion caused by signal reflection. Since signal reflection occurs when a controller performs the writing/reading of data relative to memory units on memory modules, active terminator units are included in the controller and the memory units. These active terminator units are provided for a data bus and/or a clock bus in order to terminate these buses in memory units. The active terminator units provided for the controller and the memory units may be put into an inactive state when data is to be received.
    • 在具有控制器和多个存储器模块的存储器件中,两者都被安装在母板上,通过抑制由信号反射引起的波形失真来执行高速操作。 由于当控制器执行相对于存储器模块上的存储器单元的数据的写入/读取时发生信号反射,因此主动终端单元包括在控制器和存储器单元中。 这些有源终端单元被提供用于数据总线和/或时钟总线,以便在存储器单元中终止这些总线。 当要接收数据时,为控制器和存储单元提供的有效终端单元可能会处于非活动状态。