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    • 41. 发明授权
    • Re-driving CAwD and rD signal lines
    • 重新启动CAwD和rD信号线
    • US07414917B2
    • 2008-08-19
    • US11192335
    • 2005-07-29
    • Hermann RuckerbauerSimon MuffChristian WeissPeter Gregorius
    • Hermann RuckerbauerSimon MuffChristian WeissPeter Gregorius
    • G11C8/00
    • G11C5/04G11C5/06H05K1/142
    • Semiconductor memory modules and semiconductor memory systems using the same are described herein. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input lines and the rD signal output lines in a respective point-to-point fashion.
    • 本文描述了使用其的半导体存储器模块和半导体存储器系统。 这些模块将常规DIMM分成一系列独立的较小内存模块。 每个存储器模块包括布置在衬底上的至少一个半导体存储器芯片; CAwD信号输入线,以第一预定行号排列在基板上,并将半导体存储器芯片之一连接到基板上的CAwD输入信号引脚; 和rD信号输出线,以第二预定行号排列在基板上,并将一个或最后一个半导体存储器连接到基板的第二数量的rD输出信号引脚。 在包括半导体存储器模块的半导体存储器系统中,每个存储器模块通过CAwD信号输入线和rD信号输出线分别以点对点的方式连接到存储器控制器。
    • 46. 发明申请
    • Semiconductor memory system and memory module
    • 半导体存储器系统和存储器模块
    • US20070079057A1
    • 2007-04-05
    • US11239829
    • 2005-09-30
    • Hermann RuckerbauerPeter Gregorius
    • Hermann RuckerbauerPeter Gregorius
    • G06F12/00G06F13/00
    • G06F13/1673G06F13/1684
    • A semiconductor memory system is disclosed. In one embodiment, the semiconductor memory system and memory module of the present invention provides a buffer, wherein at least one write buffer chip on the memory module is only buffering and registering write data, command and address signals written from a memory controller to the memory chips. As read data are written back from each memory chip directly to the memory controller through unidirectional point-to-point read data lines the present semiconductor memory system achieves a low latency as compared with a fully buffered DIMM concept. As read data are only unidirectional a high transmission bandwidth can be achieved.
    • 公开了半导体存储器系统。 在一个实施例中,本发明的半导体存储器系统和存储器模块提供了缓冲器,其中存储器模块上的至少一个写入缓冲器芯片仅缓冲并将从存储器控制器写入的写数据,命令和地址信号注册到存储器 筹码 由于读取数据通过单向点对点读取数据线直接从每个存储器芯片写回存储器控制器,与全缓冲DIMM概念相比,本半导体存储器系统实现了低延迟。 由于读取数据只是单向的,所以可以实现高传输带宽。
    • 47. 发明申请
    • Memory system and method of accessing memory chips of a memory system
    • 存储器系统和访问存储器系统的存储器芯片的方法
    • US20060291263A1
    • 2006-12-28
    • US11128789
    • 2005-05-13
    • Paul WallnerRalf SchledzPeter GregoriusHermann Ruckerbauer
    • Paul WallnerRalf SchledzPeter GregoriusHermann Ruckerbauer
    • G11C5/06
    • G11C5/063
    • A memory system and method is disclosed. In one embodiment, the memory system includes a memory controller and at least one memory module on which a certain number of semiconductor memory chips and connecting lines are arranged in a respectively specified topology. The connecting lines include first connecting lines forming transfer channels for a protocol based transfer of data and command signal streams from the memory controller to at least one of the memory chips on the memory module and from there to the memory controller, respectively. Second connecting lines are routed separately from the memory controller directly to at least one of the memory chips on the memory module for transferring select information to the at least one memory chip separately from the data and command signal streams.
    • 公开了一种存储器系统和方法。 在一个实施例中,存储器系统包括存储器控制器和至少一个存储器模块,其中一定数量的半导体存储器芯片和连接线被布置在分别指定的拓扑中。 连接线包括形成传输通道的第一连接线,用于基于协议的数据传输和命令信号流从存储器控制器分别存储到存储器模块上的存储器芯片和存储器控制器中的至少一个。 将第二连接线从存储器控制器直接路由到存储器模块上的至少一个存储器芯片,用于将选择信息与数据和命令信号流分离地传送到至少一个存储器芯片。