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41. 发明授权

US09221147B2 Endpointing with selective spectral monitoring 有权
标题翻译：以选择性光谱监测为终点
公开(公告)号：US09221147B2
公开(公告)日：2015-12-29
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： G06F19/00 , B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。

42. 发明授权

US07621798B1 Reducing polishing pad deformation 有权
标题翻译：减少抛光垫变形
公开(公告)号：US07621798B1
公开(公告)日：2009-11-24
申请号：US11683392
申请日：2007-03-07
申请人： Doyle E. Bennett , Boguslaw A. Swedek , David J. Lischka
发明人： Doyle E. Bennett , Boguslaw A. Swedek , David J. Lischka
IPC分类号： B24B49/12
CPC分类号： B24B37/205
摘要： A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.
摘要翻译：描述了化学机械抛光垫。化学机械抛光垫具有包括抛光表面的外层，由垫的底表面上的凹部限定的第一变薄区域，围绕第一稀化区域的第一厚区域，围绕第一厚区域的第二变薄区域以及围绕第二变薄区域的第二厚区域。第一厚区域不是可垂直延伸的。第二变薄区域限定一个或多个弯曲机构，其被配置为使得第一变薄区域和第一厚区域能够在平行于或基本上平行于抛光表面的方向上相对于第二厚区域移动。

43. 发明授权

US08187977B2 Automatic gain control 有权
标题翻译：自动增益控制
公开(公告)号：US08187977B2
公开(公告)日：2012-05-29
申请号：US12390979
申请日：2009-02-23
申请人： Boguslaw A. Swedek , Doyle E. Bennett
发明人： Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B49/00 , B24B51/00 , B24B55/00
摘要： Methods and apparatus for automatic gain control. A film on a substrate is polished by a chemical mechanical polisher that includes a polishing pad and an in-situ monitoring system. The polishing pad includes a first portion, and the in-situ monitoring system includes a light source and a light detector. The light source emits light, and light emitted from the light source is directed through the first portion and to a surface of the film being polished. Light reflecting from the surface of the film being polished and passing through the first portion is received at the light detector. An electronic signal is generated based on the light received at the light detector. When the electronic signal is evaluated not to satisfy one or more constraints, a gain for the light detector is adjusted so that the electronic signal would satisfy the one or more constraints.
摘要翻译：自动增益控制的方法和装置。通过包括抛光垫和原位监测系统的化学机械抛光机抛光衬底上的膜。抛光垫包括第一部分，并且原位监测系统包括光源和光检测器。光源发光，并且从光源发射的光被引导通过第一部分和被抛光的膜的表面。从被抛光并穿过第一部分的膜的表面反射的光被接收在光检测器处。基于在光检测器处接收的光产生电子信号。当评估电子信号不满足一个或多个约束时，调整光检测器的增益，使得电子信号将满足一个或多个约束。

44. 发明授权

US07494929B2 Automatic gain control 有权
标题翻译：自动增益控制
公开(公告)号：US07494929B2
公开(公告)日：2009-02-24
申请号：US11413495
申请日：2006-04-27
申请人： Boguslaw A. Swedek , Doyle E. Bennett
发明人： Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B49/00 , B24B51/00 , B24B55/00
摘要： Methods and apparatus for automatic gain control. A film on a substrate is polished by a chemical mechanical polisher that includes a polishing pad and an in-situ monitoring system. The polishing pad includes a first portion, and the in-situ monitoring system includes a light source and a light detector. The light source emits light, and light emitted from the light source is directed through the first portion and to a surface of the film being polished. Light reflecting from the surface of the film being polished and passing through the first portion is received at the light detector. An electronic signal is generated based on the light received at the light detector. When the electronic signal is evaluated not to satisfy one or more constraints, a gain for the light detector is adjusted so that the electronic signal would satisfy the one or more constraints.
摘要翻译：自动增益控制的方法和装置。通过包括抛光垫和原位监测系统的化学机械抛光机抛光衬底上的膜。抛光垫包括第一部分，并且原位监测系统包括光源和光检测器。光源发光，并且从光源发射的光被引导通过第一部分和被抛光的膜的表面。从被抛光并穿过第一部分的膜的表面反射的光被接收在光检测器处。基于在光检测器处接收的光产生电子信号。当评估电子信号不满足一个或多个约束时，调整光检测器的增益，使得电子信号将满足一个或多个约束。

45. 发明授权

US07247080B1 Feedback controlled polishing processes 有权
标题翻译：反馈控制抛光工艺
公开(公告)号：US07247080B1
公开(公告)日：2007-07-24
申请号：US11397075
申请日：2006-04-03
申请人： Doyle E. Bennett , Boguslaw A. Swedek , Arulkumar Shanmugasundram
发明人： Doyle E. Bennett , Boguslaw A. Swedek , Arulkumar Shanmugasundram
IPC分类号： B24B49/00 , B24B49/12
CPC分类号： G05B19/41875 , G05B2219/45232 , Y02P90/22
摘要： Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishing cycle in which a first polishing process is performed on a substrate that includes a metal layer. The first polishing process clears the metal layer from the substrate during the current polishing cycle. The product includes instructions to calculate a representation of a clearing profile of the first polishing process. The calculation is based on the monitoring information received during the current polishing cycle. The product includes instructions to detect non-uniformity in the representation. The product includes instructions to generate, from the non-uniformity detected, feedback information for improving the uniformity of a clearing profile of the first polishing process for a subsequent polishing cycle.
摘要翻译：用于反馈控制抛光的方法和装置。一种用于产生化学机械抛光反馈的计算机程序产品。该产品包括可操作以使处理器在当前抛光循环期间接收监测信息的指令，其中在包括金属层的基板上执行第一抛光工艺。在当前的抛光循环期间，第一抛光工艺从衬底中清除金属层。该产品包括计算第一次抛光过程的清除轮廓的表示的说明。该计算基于在当前抛光周期期间接收到的监视信息。该产品包括检测表示中不均匀的指令。该产品包括从不均匀性检测到的反馈信息中产生用于改进随后抛光循环的第一抛光处理的清除轮廓的均匀性的指令。

46. 发明授权

US08287330B1 Reducing polishing pad deformation 有权
标题翻译：减少抛光垫变形
公开(公告)号：US08287330B1
公开(公告)日：2012-10-16
申请号：US12625412
申请日：2009-11-24
申请人： Doyle E. Bennett , Boguslaw A. Swedek , David J. Lischka
发明人： Doyle E. Bennett , Boguslaw A. Swedek , David J. Lischka
IPC分类号： B24B49/12
CPC分类号： B24B37/205
摘要： A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.
摘要翻译：描述了化学机械抛光垫。化学机械抛光垫具有包括抛光表面的外层，由垫的底表面上的凹部限定的第一变薄区域，围绕第一稀化区域的第一厚区域，围绕第一厚区域的第二变薄区域以及围绕第二变薄区域的第二厚区域。第一厚区域不是可垂直延伸的。第二变薄区域限定一个或多个弯曲机构，其被配置为使得第一变薄区域和第一厚区域能够在平行于或基本上平行于抛光表面的方向上相对于第二厚区域移动。

47. 发明申请

US20110256818A1 Molding Windows in Thin Pads 有权
标题翻译：在薄垫成型Windows
公开(公告)号：US20110256818A1
公开(公告)日：2011-10-20
申请号：US12762175
申请日：2010-04-16
申请人： Boguslaw A. Swedek , Doyle E. Bennett , Dominic J. Benvegnu
发明人： Boguslaw A. Swedek , Doyle E. Bennett , Dominic J. Benvegnu
IPC分类号： B24B19/00 , B24D11/02
CPC分类号： B24B37/205
摘要： A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
摘要翻译：抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

48. 发明申请

US20090156098A1 Automatic Gain Control 有权
标题翻译：自动增益控制
公开(公告)号：US20090156098A1
公开(公告)日：2009-06-18
申请号：US12390979
申请日：2009-02-23
申请人： Boguslaw A. Swedek , Doyle E. Bennett
发明人： Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： B24B49/04 , B24B49/10 , B24B49/12
CPC分类号： B24B37/013 , B24B49/00 , B24B51/00 , B24B55/00
摘要： Methods and apparatus for automatic gain control. A film on a substrate is polished by a chemical mechanical polisher that includes a polishing pad and an in-situ monitoring system. The polishing pad includes a first portion, and the in-situ monitoring system includes a light source and a light detector. The light source emits light, and light emitted from the light source is directed through the first portion and to a surface of the film being polished. Light reflecting from the surface of the film being polished and passing through the first portion is received at the light detector. An electronic signal is generated based on the light received at the light detector. When the electronic signal is evaluated not to satisfy one or more constraints, a gain for the light detector is adjusted so that the electronic signal would satisfy the one or more constraints.
摘要翻译：自动增益控制的方法和装置。通过包括抛光垫和原位监测系统的化学机械抛光机抛光衬底上的膜。抛光垫包括第一部分，并且原位监测系统包括光源和光检测器。光源发光，并且从光源发射的光被引导通过第一部分和被抛光的膜的表面。从被抛光并穿过第一部分的膜的表面反射的光被接收在光检测器处。基于在光检测器处接收的光产生电子信号。当评估电子信号不满足一个或多个约束时，调整光检测器的增益，使得电子信号将满足一个或多个约束。

49. 发明授权

US08989890B2 GST film thickness monitoring 有权
标题翻译： GST膜厚度监测
公开(公告)号：US08989890B2
公开(公告)日：2015-03-24
申请号：US12697177
申请日：2010-01-29
申请人： Kun Xu , Feng Liu , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Wen-Chiang Tu , Laksh Karuppiah
发明人： Kun Xu , Feng Liu , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Wen-Chiang Tu , Laksh Karuppiah
IPC分类号： G06F19/00 , F04D27/02 , F04B19/16 , F04D23/00 , F01D21/00 , F01D21/20 , C01G9/00 , B24B37/005 , B24B37/013 , B24B49/12 , G01B11/06 , H01L45/00
CPC分类号： H01L22/26 , B24B37/005 , B24B37/013 , B24B49/12 , C01G9/00 , G01B11/0625 , G01B11/0683 , H01L21/30625 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.
摘要翻译：在抛光具有设置在下面的层上的GST层的衬底时，在抛光期间，非偏振光束被引导到GST层上。非偏振光束从第一衬底反射以产生具有红外分量的反射光束。产生反射光束的红外分量的强度测量序列，并且在处理器中确定测量序列呈现预定特征的时间。

50. 发明授权

US08628376B2 In-line wafer thickness sensing 有权
标题翻译：在线晶片厚度检测
公开(公告)号：US08628376B2
公开(公告)日：2014-01-14
申请号：US12610979
申请日：2009-11-02
申请人： Garrett H. Sin , Sanjeev Jain , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Garrett H. Sin , Sanjeev Jain , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/02 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.
摘要翻译：描述形成裸硅衬底的方法。测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。由信号指示的信号或厚度被传送到控制器。确定根据由信号指示的信号或厚度的调整的抛光参数。在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。

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