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41. 发明申请

US20120028476A1 METHOD OF FORMING SEMICONDUCTOR STRUCTURES WITH CONTACT HOLES 有权
标题翻译：形成具有接触角的半导体结构的方法
公开(公告)号：US20120028476A1
公开(公告)日：2012-02-02
申请号：US12846020
申请日：2010-07-29
申请人： Wai-Kin Li , Wu-Song Huang , Joy Cheng , Kuang-Jung Chen
发明人： Wai-Kin Li , Wu-Song Huang , Joy Cheng , Kuang-Jung Chen
IPC分类号： H01L21/312
CPC分类号： H01L21/0337 , H01L21/0338
摘要： Embodiments of the present invention provide a method of forming a semiconductor structure. The method includes forming a set of shapes on top of a substrate; applying a layer of copolymer covering the substrate; causing the copolymer to form a plurality of cylindrical blocks both inside and outside the shapes; forming a pattern of contact holes from the plurality of cylindrical blocks; and transferring the pattern of contact holes to the substrate to form the semiconductor structure. In one embodiment, the shapes are rings and forming the set of shapes includes forming a set of rings that are equally and squarely spaced. In another embodiment, causing the copolymer to form the plurality of cylindrical blocks includes forming only one cylindrical block inside each of the rings and only one cylindrical block outside every four (4) squarely neighboring rings.
摘要翻译：本发明的实施例提供一种形成半导体结构的方法。该方法包括在衬底的顶部上形成一组形状; 涂覆覆盖基材的共聚物层; 使共聚物在形状内部和外部形成多个圆柱形块; 从所述多个圆柱形块形成接触孔的图案; 并将接触孔的图案转移到衬底以形成半导体结构。在一个实施例中，形状是环，并且形成一组形状包括形成均匀且平直间隔的一组环。在另一个实施方案中，使共聚物形成多个圆柱形块包括仅在每个环内形成一个圆柱形块，并且在每四（4）个正方形相邻的环周围仅形成一个圆柱形块。

42. 发明申请

US20120024722A1 PACKAGE OF ENVIRONMENTAL SENSITIVE ELEMENT AND ENCAPSULATION METHOD OF THE SAME 有权
标题翻译：环境敏感元件的包装及其封装方法
公开(公告)号：US20120024722A1
公开(公告)日：2012-02-02
申请号：US12944691
申请日：2010-11-11
申请人： Kuang-Jung Chen
发明人： Kuang-Jung Chen
IPC分类号： B65D81/26 , B05D5/12
CPC分类号： H01L21/56 , H01L23/26 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： An encapsulation method of an environmental sensitive element is provided. An environmental sensitive element and a first rib are formed on a first substrate. The first rib surrounds the environmentally sensitive element. A getter layer is formed on the environmental sensitive element. A first encapsulation layer is formed to encapsulate the getter layer and the first rib. The first barrier layer is formed to encapsulate the first encapsulation layer located on the first rib. The first rib, a portion of the first encapsulation layer located on the first rib and the first barrier layer form a barrier structure. A second substrate is provided on the first substrate and a filling layer is formed between the first substrate and the second substrate. The second substrate is bonded to the first substrate by the filling layer. The filling layer encapsulates the environmental sensitive element, the first encapsulation layer and the barrier structure.
摘要翻译：提供了一种环境敏感元件的封装方法。在第一基板上形成环境敏感元件和第一肋条。第一个肋围绕环境敏感元件。在环境敏感元件上形成吸气剂层。形成第一封装层以封装吸气剂层和第一肋。形成第一阻挡层以封装位于第一肋上的第一封装层。第一肋，位于第一肋上的第一包封层的一部分和第一阻挡层形成阻挡结构。在第一基板上设置第二基板，在第一基板和第二基板之间形成填充层。第二基板通过填充层与第一基板结合。填充层封装环境敏感元件，第一封装层和屏障结构。

43. 发明申请

US20110063808A1 PACKAGE OF ENVIRONMENTAL SENSITIVE ELEMENT 有权
标题翻译：环境敏感元件的包装
公开(公告)号：US20110063808A1
公开(公告)日：2011-03-17
申请号：US12703155
申请日：2010-02-09
申请人： Kuang-Jung Chen , Shu-Tang Yeh , Jia-Chong Ho
发明人： Kuang-Jung Chen , Shu-Tang Yeh , Jia-Chong Ho
IPC分类号： H05K1/00
CPC分类号： H01L51/0097 , H01L51/5246 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y02E10/549 , Y10T428/239
摘要： A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.
摘要翻译：提供了包括柔性基板，环境敏感元件，柔性牺牲层和封装结构的环境敏感元件的封装。环境敏感元件设置在柔性基板上。柔性牺牲层设置在环境敏感元件上，其中环境敏感元件包括多个第一薄膜，并且柔性牺牲层包括多个第二薄膜。两个相邻的第二薄膜之间的结合强度基本上等于或低于两个相邻的第一薄膜之间的结合强度。此外，包装结构覆盖环境敏感元件和柔性牺牲层。

44. 发明申请

US20100265207A1 TOUCH-SENSING DISPLAY APPARATUS AND FABRICATING METHOD THEREOF 有权
标题翻译：触摸感应显示装置及其制作方法
公开(公告)号：US20100265207A1
公开(公告)日：2010-10-21
申请号：US12703163
申请日：2010-02-09
申请人： Kuang-Jung Chen
发明人： Kuang-Jung Chen
IPC分类号： G06F3/041 , G06F3/045 , G06F3/044 , H01J9/00
CPC分类号： G06F3/044 , G06F3/0412 , G06F2203/04111 , H01L27/323
摘要： A touch-sensing display apparatus including a touch panel, an environmentally sensitive electronic device and an adhesive layer is provided. The water/oxygen vapor transmission rate of the touch panel is lower than 10−1 g/m2*day, and the touch panel includes a first substrate, a sensing circuit and at least one water/oxygen barrier layer. The first substrate is a first flexible substrate. The sensing circuit and the water/oxygen barrier layer are disposed on the first substrate. The environmentally sensitive electronic device includes a second substrate and a pixel array. The pixel array is disposed on the second substrate and between the first substrate and the second substrate. The adhesive layer is disposed between the touch panel and the environmentally sensitive electronic device. Moreover, a fabricating method of the above-mentioned touch-sensing display apparatus is also provided.
摘要翻译：提供了包括触摸面板，环境敏感电子设备和粘合剂层的触摸感测显示设备。触摸面板的水/氧气透过率低于10-1g / m2 *天，触控面板包括第一基板，检测电路和至少一个水/氧阻隔层。第一衬底是第一柔性衬底。感测电路和水/氧阻隔层设置在第一基板上。环境敏感的电子设备包括第二基板和像素阵列。像素阵列设置在第二基板上并且在第一基板和第二基板之间。粘合剂层设置在触摸面板和环境敏感的电子设备之间。此外，还提供了上述触摸感测显示装置的制造方法。

45. 发明申请

US20100258346A1 PACKAGE OF ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 有权
标题翻译：环境敏感电子设备的包装及其制造方法
公开(公告)号：US20100258346A1
公开(公告)日：2010-10-14
申请号：US12487658
申请日：2009-06-19
申请人： Kuang-Jung Chen , Jia-Chong Ho , Jing-Yi Yan , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jia-Chong Ho , Jing-Yi Yan , Shu-Tang Yeh
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L23/564 , H01L21/56 , H01L23/293 , H01L23/3121 , H01L51/5243 , H01L51/5246 , H01L51/525 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , Y10T29/49002 , H01L2924/00
摘要： A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10−1 g/m2/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子设备，多个屏障结构和填充物的环境敏感电子设备的封装。第二基板设置在第一基板的上方。环境敏感的电子设备设置在第一基板上并且位于第一基板和第二基板之间。阻挡结构设置在第一基板和第二基板之间，其中阻挡结构围绕环境敏感电子设备，并且阻挡结构的水蒸汽透过率小于10-1g / m 2 /天。填充物设置在第一基板和第二基板之间并且覆盖环境敏感的电子设备和屏障结构。

46. 发明申请

US20100248147A1 PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS 审中-公开
标题翻译：多层次光电子系统的多光照组合物和工艺
公开(公告)号：US20100248147A1
公开(公告)日：2010-09-30
申请号：US12813628
申请日：2010-06-11
申请人： Kuang-Jung Chen , Wu-Song Huang , Wai-Kin Li , Pushkara R. Varanasi
发明人： Kuang-Jung Chen , Wu-Song Huang , Wai-Kin Li , Pushkara R. Varanasi
IPC分类号： G03F7/004
CPC分类号： G03F7/0048 , G03F7/0035 , G03F7/0397 , G03F7/40
摘要： A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer.
摘要翻译：光致抗蚀剂组合物和在多次曝光/多层工艺中使用光致抗蚀剂组合物的方法。光致抗蚀剂组合物包括包含具有羟基部分的重复单元的聚合物; 光致酸发生器; 和溶剂。形成在基材上的聚合物在加热至约150℃或更高的温度之后基本上不溶于溶剂。一种方法包括在衬底上形成第一光致抗蚀剂层，图案地暴露第一光致抗蚀剂层，在衬底上形成第二非光致抗蚀剂层并且形成图案化的第一光致抗蚀剂层。另一种方法包括在衬底上形成第一光致抗蚀剂层，以图形方式暴露第一光致抗蚀剂层，在衬底上形成第二光致抗蚀剂层并图案化的第一光致抗蚀剂层和图案地曝光第二光致抗蚀剂层。

47. 发明申请

US20090208865A1 PHOTOLITHOGRAPHY FOCUS IMPROVEMENT BY REDUCTION OF AUTOFOCUS RADIATION TRANSMISSION INTO SUBSTRATE 审中-公开
标题翻译：通过减少自适应辐射传输到基板中的光刻技术改进
公开(公告)号：US20090208865A1
公开(公告)日：2009-08-20
申请号：US12033303
申请日：2008-02-19
申请人： Timothy A. Brunner , Sean D. Burns , Kuang-Jung Chen , Wu-Song Huang , Kafai Lai , Wai-Kin Li , Bernhard R. Liegl
发明人： Timothy A. Brunner , Sean D. Burns , Kuang-Jung Chen , Wu-Song Huang , Kafai Lai , Wai-Kin Li , Bernhard R. Liegl
IPC分类号： G03F7/004 , G03F7/00
CPC分类号： G03F7/091 , G03F7/70216 , Y10S430/127
摘要： An anti-reflective coating material, a microelectronic structure that includes an anti-reflective coating layer formed from the anti-reflective coating material and a related method for exposing a resist layer located over a substrate while using the anti-reflective coating layer provide for attenuation of secondary reflected vertical alignment beam radiation when aligning the substrate including the resist layer located thereover. Such enhanced vertical alignment provides for improved dimensional integrity of a patterned resist layer formed from the resist layer, as well as additional target layers that may be fabricated while using the resist layer as a mask.
摘要翻译：防反射涂层材料，包括由抗反射涂层材料形成的抗反射涂层的微电子结构和用于在使用抗反射涂层的同时使位于基板上的抗蚀剂层曝光的相关方法提供衰减当对准包括位于其上的抗蚀剂层的衬底时，二次反射垂直取向束辐射。这种增强的垂直对准提供了由抗蚀剂层形成的图案化抗蚀剂层的改进的尺寸完整性，以及可以在使用抗蚀剂层作为掩模时制造的附加目标层。

48. 发明申请

US20080102401A1 Si-CONTAINING POLYMERS FOR NANO-PATTERN DEVICE FABRICATION 失效
标题翻译：用于纳米图案器件制造的含Si聚合物
公开(公告)号：US20080102401A1
公开(公告)日：2008-05-01
申请号：US11554877
申请日：2006-10-31
申请人： Kuang-Jung Chen , Wu-Song Huang , Wai-Kin Li , Yi-Hsiung S. Lin
发明人： Kuang-Jung Chen , Wu-Song Huang , Wai-Kin Li , Yi-Hsiung S. Lin
IPC分类号： G03C1/00
CPC分类号： G03F7/0758 , G03F7/0045
摘要： A resist polymer that has nano-scale patterns located therein that are in the form of sub lithographic hollow pores (or openings) that are oriented in a direction that is substantially perpendicular with that of its major surfaces (top and bottom) is provided. Such a resist polymer having the nano-scale patterns is used as an etch mask transferring nano-scale patterns to an underlying substrate such as, for example, dielectric material. After the transferring of the nano-scale patterns into the substrate, nano-scale voids (or openings) having a width of less than 50 nm are created in the substrate. The presence of the nano-scale voids in a dielectric material lowers the dielectric constant, k, of the original dielectric material. In accordance with an aspect of the present invention, the inventive resist polymer comprises a copolymer that includes a first monomer unit (A) that contains a Si-containing component, and a second monomer unit (B) that contains an organic component, wherein said two monomer units (A and B) have different etch rates.
摘要翻译：提供具有位于其中的纳米级图案的抗蚀剂聚合物，其为沿与其主表面（顶部和底部）基本垂直的方向取向的亚光刻中空孔（或开口）的形式。具有纳米尺度图案的这种抗蚀剂聚合物被用作将纳米尺度图案转移到诸如介电材料的下层基底的蚀刻掩模。在将纳米尺度图案转移到基底中之后，在基底中产生宽度小于50nm的纳米级空隙（或开口）。电介质材料中纳米尺度空隙的存在降低了原始电介质材料的介电常数k。根据本发明的一个方面，本发明的抗蚀剂聚合物包括包含含有含Si组分的第一单体单元（A）和含有有机组分的第二单体单元（B）的共聚物，其中所述两个单体单元（A和B）具有不同的蚀刻速率。

49. 发明申请

US20050259049A1 Organic electroluminescent display structure 审中-公开
标题翻译：有机电致发光显示结构
公开(公告)号：US20050259049A1
公开(公告)日：2005-11-24
申请号：US11105530
申请日：2005-04-14
申请人： Kuang-Jung Chen
发明人： Kuang-Jung Chen
IPC分类号： G09F9/00 , G09G3/30 , G09G5/00 , H01L27/32 , H05B33/10
CPC分类号： H01L27/322 , H01L27/3244 , H01L2251/5315
摘要： An organic electroluminescent display (OEL) structure is utilized the UV light as a light source. The light is converted into three original colors of red, green, and blue lights through the fluorescent color conversion layer, so as to be able to eliminate the additional color filtering layer and raise light conversion efficiency. As such, an active substrate, a fluorescent color conversion layer, a UV light emission layer and a encapsulation layer are combined to form the full color active organic electroluminescent display structure, which can be mass produced by utilizing the existing manufacturing process and equipment, thus achieving the purpose of reducing the production cost.
摘要翻译：利用UV光作为光源的有机电致发光显示（OEL）结构。通过荧光颜色转换层将光转换成红色，绿色和蓝色三种原始颜色，以便能够消除附加的滤色层并提高光转换效率。因此，活性基板，荧光颜色转换层，UV发光层和封装层组合形成全色活性有机电致发光显示结构，其可以通过利用现有的制造工艺和设备大量生产，因此达到降低生产成本的目的。

50. 发明申请

US20050244675A1 Light-emitting material, electroluminescent device containing the same and method for poducing the same 审中-公开
标题翻译：发光材料，含有该发光材料的电致发光器件及其制造方法
公开(公告)号：US20050244675A1
公开(公告)日：2005-11-03
申请号：US11117915
申请日：2005-04-29
申请人： Kuang-Jung Chen
发明人： Kuang-Jung Chen
IPC分类号： B32B19/00 , C08G61/02 , C09K11/06 , H01L51/00 , H01L51/50 , H05B33/14
CPC分类号： C09K11/06 , C08G61/02 , C09K2211/1011 , C09K2211/1033 , C09K2211/1037 , C09K2211/1088 , C09K2211/1416 , H01L51/0039 , H01L51/0052 , H01L51/0062 , H01L51/0064 , H01L51/5012 , H05B33/14
摘要： A light-emitting material includes a polymeric skeleton and a dye moiety. The dye moiety links to the polymeric skeleton by chemical bonding, and has an energy gap lower than that of the polymeric skeleton. As such, energy is transferred from the polymeric skeleton to the dye moiety when the light-emitting material is excited, thereby emitting light.
摘要翻译：发光材料包括聚合物骨架和染料部分。染料部分通过化学键合连接到聚合物骨架，并且具有低于聚合物骨架的能隙。因此，当发光材料被激发时，能量从聚合物骨架转移到染料部分，从而发光。

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