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    • 42. 发明授权
    • Low dielectric constant dielectric layer fabrication method employing hard mask layer delamination
    • 采用硬掩模层分层的低介电常数介质层制造方法
    • US06395631B1
    • 2002-05-28
    • US09366751
    • 1999-08-04
    • Yi XuJian Xun Li
    • Yi XuJian Xun Li
    • H01L214763
    • H01L21/31116H01L21/31138H01L21/31144H01L21/76802H01L21/7688
    • A method for forming, within a low dielectric constant dielectric layer formed upon a substrate employed within a microelectronics fabrication, a conductor pattern employing a hard mask cap layer. There is first provided a substrate having conductor regions formed therein upon which is formed a low dielectric constant dielectric layer. There is then formed over the substrate a silicon containing hard mask cap layer. There is then formed over the hard mask cap layer a patterned photoresist etch mask layer. There is then subtractively etched employing the patterned photoresist etch mask layer and a first subtractive etching environment the pattern into the hard mask layer. There is then subtractively etched employing the patterned hard mask layer and a second etching environment the pattern into the low dielectric constant dielectric layer, simultaneously stripping the photoresist etch mask layer. There is then removed by delamination the hard mask cap layer employing a chemical treatment, leaving a trench pattern in the low dielectric constant dielectric layer. The trench pattern may be filled with a microelectronics material to form a patterned layer around which is a maximized amount of low dielectric constant dielectric material. The order of filling with microelectronics material and delamination of the hard mask layer may be reversed if desired to minimize the amount of patterned microelectronics material remaining above the substrate surface, in which case the method is a lift off method for patterning a microelectronics layer. After filling and patterning, the substrate surface may be planarized for further processing and optional additional microelectronics layers formed thereover.
    • 在形成在微电子制造中使用的衬底上的低介电常数电介质层内形成使用硬掩模帽层的导体图案的方法。 首先,设置有形成有导体区域的基板,在其上形成低介电常数介电层。 然后在衬底上形成含硅的硬掩模帽层。 然后在硬掩模帽层上形成图案化的光致抗蚀剂蚀刻掩模层。 然后使用图案化的光致抗蚀剂蚀刻掩模层进行减法蚀刻,并且将图案的第一减去刻蚀环境刻蚀成硬掩模层。 然后使用图案化的硬掩模层进行减法蚀刻,并且将图案的第二蚀刻环境放置到低介电常数介电层中,同时剥离光致抗蚀剂蚀刻掩模层。 然后通过分层去除采用化学处理的硬掩模帽层,在低介电常数介电层中留下沟槽图案。 沟槽图案可以用微电子材料填充以形成图案化层,围绕其形成最大量的低介电常数电介质材料。 如果需要,微电子材料的填充顺序和硬掩模层的分层可以相反,以使在基板表面之上残留的图案化微电子材料的量最小化,在这种情况下,该方法是用于图案化微电子层的剥离方法。 在填充和图案化之后,衬底表面可以被平坦化以用于进一步处理,并且在其上形成可选的另外的微电子层。
    • 44. 发明授权
    • Method for reducing microloading in an etchback of spin-on-glass or
polymer
    • 减少旋涂玻璃或聚合物回蚀时的微载荷的方法
    • US5930677A
    • 1999-07-27
    • US845252
    • 1997-04-21
    • Jia Zhen ZhengGuo Li Qi MikeYi Xu
    • Jia Zhen ZhengGuo Li Qi MikeYi Xu
    • H01L21/3105H01L21/314H01L21/316H01L21/768
    • H01L21/02164H01L21/02126H01L21/022H01L21/02274H01L21/02282H01L21/31055H01L21/316H01L21/31612H01L21/76819
    • A method for forming a planarized interlevel dielectric layer without degradation due to the microloading effect from spin-on material etchback is described. A patterned first conducting layer is provided over an insulating layer on a semiconductor substrate. An improved interlevel dielectric layer is formed overlying the patterned first conducting layer by the following steps. A first oxide layer is deposited overlying the patterned first conducting layer and the insulating layer. A spin-on material layer is coated overlying the first oxide layer and etched back using O.sub.2 gas added to the CHF.sub.3 /CF.sub.4 chemistry until the first oxide layer is exposed overlying the patterned first conducting layer wherein microloading effects from the etching back of the spin-on material layer are lower than microloading effects in a conventional interlevel dielectric layer. A second oxide layer is deposited to complete the interlevel dielectric layer. A second conducting layer is deposited over the interlevel dielectric layer and patterned to complete the fabrication of the integrated circuit device.
    • 描述了由于旋涂材料回蚀引起的微加载效应而形成平坦化层间电介质层而不降解的方法。 图案化的第一导电层设置在半导体衬底上的绝缘层上。 通过以下步骤形成覆盖图案化的第一导电层的改进的层间介电层。 沉积在图案化的第一导电层和绝缘层上的第一氧化物层。 将旋涂材料层涂覆在第一氧化物层上,并使用添加到CHF 3 / CF 4化学物质的O 2气体进行回蚀,直到第一氧化物层暴露在图案化的第一导电层上,其中来自旋转 - 材料层在常规层间介质层中低于微载荷效应。 沉积第二氧化物层以完成层间电介质层。 第二导电层沉积在层间电介质层上并被图案化以完成集成电路器件的制造。
    • 48. 发明申请
    • Prokaryotic collage-like proteins and uses thereof
    • 原核拼贴样蛋白及其用途
    • US20100184085A1
    • 2010-07-22
    • US12660596
    • 2010-03-02
    • Magnus HöökSlawomir LukomskiYi Xu
    • Magnus HöökSlawomir LukomskiYi Xu
    • G01N33/53C07K16/00C12N15/63C12N1/21C12P21/06
    • C07K14/78
    • The present invention provides recombinant triple helical proteins or collagen-like proteins comprising a prokaryotic protein or one or more domains of a prokaryotic protein comprising a collagen-like peptide sequence of repeated Gly-Xaa-Yaa triplets and, optionally, one or more domains from a mammalian collagen. Also provided are expression vectors and host cells containing the expression vectors to produce these recombinant proteins and methods of producing the same. Additionally, antibodies are provided that are directed against a recombinant collagen-like protein that, preferably, binds an integrin. Furthermore, a method of screening for potential therapeutic compounds that inhibit the integrin-binding or integrin-interacting activities of recombinant collagen-like proteins.
    • 本发明提供重组三螺旋蛋白或胶原样蛋白,其包含原核蛋白或原核蛋白的一个或多个结构域,其包含重复Gly-Xaa-Yaa三联体的胶原样肽序列和任选的一个或多个结构域 哺乳动物胶原蛋白。 还提供了含有表达载体以产生这些重组蛋白的表达载体和宿主细胞及其生产方法。 此外,提供针对重组胶原样蛋白的抗体,其优选结合整联蛋白。 此外,筛选抑制重组胶原样蛋白的整联蛋白结合或整联蛋白相互作用活性的潜在治疗化合物的方法。
    • 49. 发明授权
    • Prokaryotic collagen-like proteins and uses thereof
    • 原核胶原蛋白及其用途
    • US07700731B2
    • 2010-04-20
    • US12455840
    • 2009-06-08
    • Magnus HöökSlawomir LukomskiYi Xu
    • Magnus HöökSlawomir LukomskiYi Xu
    • A61K38/17C07K14/00
    • C07K14/78
    • The present invention provides recombinant triple helical proteins or collagen-like proteins comprising a prokaryotic protein or one or more domains of a prokaryotic protein comprising a collagen-like peptide sequence of repeated Gly-Xaa-Yaa triplets and, optionally, one or more domains from a mammalian collagen. Also provided are expression vectors and host cells containing the expression vectors to produce these recombinant proteins and methods of producing the same. Additionally, antibodies are provided that are directed against a recombinant collagen-like protein that, preferably, binds an integrin. Furthermore, a method of screening for potential therapeutic compounds that inhibit the integrin-binding or integrin-interacting activities of recombinant collagen-like proteins.
    • 本发明提供重组三螺旋蛋白或胶原样蛋白,其包含原核蛋白或原核蛋白的一个或多个结构域,其包含重复Gly-Xaa-Yaa三联体的胶原样肽序列和任选的一个或多个结构域 哺乳动物胶原蛋白。 还提供了含有表达载体以产生这些重组蛋白的表达载体和宿主细胞及其生产方法。 此外,提供针对重组胶原样蛋白的抗体,其优选结合整联蛋白。 此外,筛选抑制重组胶原样蛋白的整联蛋白结合或整联蛋白相互作用活性的潜在治疗化合物的方法。
    • 50. 发明申请
    • Transparent illustrations imprinted on solar panel
    • 透明插图印在太阳能电池板上
    • US20090284959A1
    • 2009-11-19
    • US12213125
    • 2008-06-16
    • Yi XuYechen Xu
    • Yi XuYechen Xu
    • F21L4/00
    • G09F13/00G09F13/04
    • The present invention relates to solar lighting device, in particular, an illuminating solar display panel comprising display of a transparent illustration on the solar panel. The present invention has dual functional abilities of collecting solar power as a power supply unit and present illuminating illustration as a display unit, whereby an illustration is cutout from the dark coloured material layers of the power supply panel creating a transparent illustration; thereby, light can enter from behind the panel and create an illuminating effect to the illustration. Instead of two separate components, compromise of solar panel(s) and illuminating display unit, the current invention combines two separate units into one independent power efficient illuminating solar display apparatus.
    • 本发明涉及太阳能照明装置,特别涉及一种包括在太阳能电池板上显示透明图示的照明太阳能显示面板。 本发明具有作为电源单元收集太阳能的双功能能力,并且将照明图示为显示单元,从而从电源面板的深色材料层切出图示,从而产生透明的图示; 因此,光可以从面板后面进入,并为该图示产生照明效果。 本发明将两个单独的单元组合成一个独立的功率有效的照明太阳能显示装置,而不是两个单独的部件,妥协太阳能电池板和照明显示单元。