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41. 发明申请

US20080036069A1 Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device 失效
标题翻译：树脂成形用半导体装置的制造装置，树脂成形用半导体装置的制造方法以及树脂成形用半导体装置
公开(公告)号：US20080036069A1
公开(公告)日：2008-02-14
申请号：US11812154
申请日：2007-06-15
申请人： Tetsuo Ito , Takayuki Yoshida , Toshiyuki Fukuda , Takao Ochi
发明人： Tetsuo Ito , Takayuki Yoshida , Toshiyuki Fukuda , Takao Ochi
IPC分类号： H01L23/48 , B29C45/00 , H01L21/56
CPC分类号： H01L21/565 , B29C45/14655 , B29C45/2708 , B29C45/34 , H01L21/561 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： A production equipment includes a substrate 2 placed inside and having a plurality of semiconductor elements 3 mounted thereon, and a resin molding mold 20 having a cavity 21. The mold 20 has resin injection ports 29a and air release ports 30a. Each of the resin injection ports 29a is formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element 3. Each of the air release ports 30a is formed around each of the resin injection ports 29a.
摘要翻译：生产设备包括放置在内部并具有安装在其上的多个半导体元件3的基板2和具有空腔21的树脂模制件20。模具20具有树脂注入口29a和空气释放口30a。每个树脂注入口29a与相应的半导体元件3相关联地形成在模具中的空腔的顶表面部分中。每个空气释放口30a形成在每个树脂注入口29a周围。

42. 发明申请

US20070227302A1 Magnetic metal powder suitable for use in magnetic recording media and method of manufacturing the powder 有权
标题翻译：适用于磁记录介质的磁性金属粉末及其制造方法
公开(公告)号：US20070227302A1
公开(公告)日：2007-10-04
申请号：US11727482
申请日：2007-03-27
申请人： Takayuki Yoshida , Masatoshi Nakayama , Ryota Igarashi
发明人： Takayuki Yoshida , Masatoshi Nakayama , Ryota Igarashi
IPC分类号： B22F9/18
CPC分类号： H01F1/065 , G11B5/70615 , G11B5/70621 , G11B5/714 , H01F1/0054 , H01F1/061 , H01F1/09 , Y10T428/2991
摘要： A metal magnetic powder for a magnetic recording medium is provided whose particles have a metal magnetic phase, composed mainly of Fe or Fe plus Co, and an oxide layer, wherein the average major axis length of the powder particles is 10-50 nm, the average particle volume including the oxide layer is 5,000 nm3 or less, the atomic ratio (R+Al+Si)/(Fe+Co) calculated using the content values (at. %) of the elements contained in the powder particles is 20% or less, where R is rare earth element (Y being treated as a rare earth element). The metal magnetic powder is obtained by using a complexing agent and a reducing agent to elute nonmagnetic constituents after firing. The metal magnetic powder exhibits a large saturation magnetization σs for its particle volume while maintaining weatherability comparable to the conventional level and is suitable for a coated-type magnetic recording medium.
摘要翻译：提供一种用于磁记录介质的金属磁粉，其颗粒具有主要由Fe或Fe + Co组成的金属磁性相和氧化物层，其中粉末颗粒的平均长轴长度为10-50nm，包括氧化物层的平均粒子体积为5000nm 3以下，使用元素的含量值（at。％）计算的原子比（R + Al + Si）/（Fe + Co）粉末颗粒中的含量为20％以下，其中R为稀土元素（Y为稀土元素处理）。通过使用络合剂和还原剂在烧制后洗脱非磁性成分得到金属磁性粉末。金属磁性粉末对于其颗粒体积显示出大的饱和磁化强度，同时保持与常规水平相当的耐候性，并且适用于涂覆型磁记录介质。

43. 发明申请

US20070119158A1 EXHAUST MANIFOLD 有权
标题翻译：排气歧管
公开(公告)号：US20070119158A1
公开(公告)日：2007-05-31
申请号：US11564389
申请日：2006-11-29
申请人： Takayuki Yoshida , Fuyuki Ito
发明人： Takayuki Yoshida , Fuyuki Ito
IPC分类号： F01N7/06 , F01N7/10 , F01N3/02
CPC分类号： F01N13/10
摘要： An exhaust manifold is provided with a plurality of branch pipe parts and a collecting pipe part. The plurality of branch pipe parts are respectively connected to a plurality of exhaust ports of a multicylinder internal combustion engine, The collecting pipe part is formed by merging the plurality of branch pipe parts. The plurality of branch pipe parts and the collecting pipe part are formed by an upper shell member and a lower shell member superposed on each other. A partition plate is attached to at least one of the upper shell member and the lower shell member, The partition plate separates between exhaust gases flowing into the collecting pipe part from two of the branch pipe parts respectively connected to adjacent two of the plurality of exhaust ports.
摘要翻译：排气歧管设有多个支管部分和收集管部分。多个分支管部分分别连接到多缸内燃机的多个排气口。收集管部分通过使多个分支管部分合并而形成。多个分支管部和收集管部由彼此重叠的上壳部件和下壳部件形成。分隔板附接到上壳体构件和下壳体构件中的至少一个上。分隔板从分别连接到多个排气口中的相邻两个的排气管中的两个分支管部分分离入到收集管部分中的废气之间港口。

44. 发明授权

US06623879B2 Soft-magnetic hexagonal ferrite composite particles, and green sheet using the same and soft-magnetic hexagonal ferrite sintered ceramics 有权
标题翻译：软磁六方铁素体复合颗粒，以及使用相同的软磁六边形铁氧体烧结陶瓷
公开(公告)号：US06623879B2
公开(公告)日：2003-09-23
申请号：US10116110
申请日：2002-04-05
申请人： Yoji Okano , Takayuki Yoshida , Norio Sugita
发明人： Yoji Okano , Takayuki Yoshida , Norio Sugita
IPC分类号： B32B1500
CPC分类号： C04B35/632 , C01G49/009 , C01G51/006 , C01G53/006 , C01P2002/32 , C01P2002/74 , C01P2004/51 , C01P2004/61 , C01P2004/62 , C01P2006/10 , C01P2006/11 , C01P2006/12 , C01P2006/40 , C01P2006/42 , C04B35/2633 , C04B35/63472 , H01F1/348 , H01F1/36 , Y10S428/90 , Y10T428/29 , Y10T428/2982
摘要： Soft-magnetic hexagonal ferrite composite particles composed of 100 parts by weight of soft-magnetic hexagonal ferrite particles containing a Z-type ferrite, Y-type ferrite or W-type ferrite as a main phase, 0.3 to 10 parts by weight of barium carbonate particles, strontium carbonate particles or their mixture and 0.1 to 5 parts by weight of silicon dioxide particles.
摘要翻译：由100重量份含有Z型铁氧体，Y型铁氧体或W型铁氧体作为主相的软磁性六角铁氧体颗粒组成的软磁六边形铁素体复合颗粒，0.3〜10重量份的碳酸钡颗粒，碳酸锶颗粒或其混合物和0.1至5重量份的二氧化硅颗粒。

45. 发明授权

US6166436A High frequency semiconductor device 失效
标题翻译：高频半导体器件
公开(公告)号：US6166436A
公开(公告)日：2000-12-26
申请号：US60600
申请日：1998-04-15
申请人： Masahiro Maeda , Morio Nakamura , Takayuki Yoshida , Masazumi Yamazaki
发明人： Masahiro Maeda , Morio Nakamura , Takayuki Yoshida , Masazumi Yamazaki
IPC分类号： H01L21/56 , H01L23/482 , H01L23/66 , H01L21/44 , H01L21/60
CPC分类号： H01L23/4824 , H01L21/563 , H01L23/66 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/10329 , H01L2924/1306 , H01L2924/13064 , H01L2924/1423 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/01015 , H01L2924/01031 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： A high frequency semiconductor device includes: a substrate having a substantially flat principal surface, with a predetermined circuit pattern including at least an input line, an output line, and a ground electrode provided on the principal surface; and a transistor which has a drain electrode, a source electrode, and a gate electrode and is mounted on the substrate by a flip chip mounting. The source electrode and the ground electrode are connected to each other by a first bump in the flip chip mounting.
摘要翻译：高频半导体器件包括：具有基本上平坦的主表面的基板，具有至少包括设置在主表面上的输入线，输出线和接地电极的预定电路图案; 以及具有漏电极，源电极和栅电极并通过倒装芯片安装而安装在基板上的晶体管。源电极和接地电极通过倒装芯片安装中的第一凸块相互连接。

46. 发明授权

US5970939A Intake manifold for engine 失效
标题翻译：发动机进气歧管
公开(公告)号：US5970939A
公开(公告)日：1999-10-26
申请号：US129807
申请日：1998-08-06
申请人： Masato Motosugi , Takayuki Yoshida , Satoshi Takaki
发明人： Masato Motosugi , Takayuki Yoshida , Satoshi Takaki
IPC分类号： F02M35/104 , F02M35/10 , F02M69/04 , F02M35/00
CPC分类号： F02M35/112 , F02M35/10144 , F02M35/10216 , F02M35/10327 , F02M35/10347 , F02M35/10354 , F05C2225/08 , Y10T29/49398
摘要： The intake manifold includes a mounting flange formed as a forged or cast member and having a fuel injection valve-mounting portion provided on the mounting flange. Branch pipes are formed from iron series-containing pipe members, and are joined to the mounting flange. A plurality of mounting bosses can also be formed on the mounting flange to support a stiffener connected to a surge tank.
摘要翻译：进气歧管包括形成为锻造或铸造构件并具有设置在安装凸缘上的燃料喷射阀安装部分的安装凸缘。分支管由含铁系列管构件形成，并且与安装凸缘接合。多个安装凸台也可以形成在安装凸缘上，以支撑连接到缓冲罐的加强件。

47. 发明授权

US5767009A Structure of chip on chip mounting preventing from crosstalk noise 失效
标题翻译：片上芯片安装结构防止串扰噪声
公开(公告)号：US5767009A
公开(公告)日：1998-06-16
申请号：US798471
申请日：1997-02-10
申请人： Takayuki Yoshida , Takashi Otsuka , Hiroaki Fujimoto , Tadaaki Mimura , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga
发明人： Takayuki Yoshida , Takashi Otsuka , Hiroaki Fujimoto , Tadaaki Mimura , Ichiro Yamane , Takio Yamashita , Toshio Matsuki , Yoshiaki Kasuga
IPC分类号： H01L21/56 , H01L23/552 , H01L25/065 , H01L25/18 , H01L21/44
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/552 , H01L24/29 , H01L25/18 , H01L2224/1147 , H01L2224/16145 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2225/06513 , H01L2225/06527 , H01L2225/06572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/14 , H01L2924/30105 , H01L2924/30107
摘要： The present invention reduces crosstalk noise, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip (1) having a first electrode pad (2) and a first wiring layer (9), and a second semiconductor chip (5) having a second electrode pad (6) and a second wiring layer (10). A bump (4) is provided for electrically coupling the first electrode pad (2) and the second electrode pad (6). An insulation layer 8 is disposed between confronting surfaces of the first semiconductor chip (1) and the second semiconductor chip (5). An electro-conductive layer (7) is disposed between the confronting surfaces of the first semiconductor chip and the second semiconductor chip.
摘要翻译：本发明减少串扰噪声，其是由于在第一半导体芯片的各个布线层的每一个中运行的信号与以小间隙堆叠在一起的第二半导体芯片之间的干扰而发生的。半导体器件包括具有第一电极焊盘（2）和第一布线层（9）的第一半导体芯片（1）和具有第二电极焊盘（6）和第二布线层 10）。提供凸起（4）用于电耦合第一电极焊盘（2）和第二电极焊盘（6）。绝缘层8设置在第一半导体芯片（1）和第二半导体芯片（5）的相对表面之间。导电层（7）设置在第一半导体芯片和第二半导体芯片的相对表面之间。

48. 发明授权

US5706887A Air conditioner and heat exchanger used therefor 失效
标题翻译：空调和热交换器用于此
公开(公告)号：US5706887A
公开(公告)日：1998-01-13
申请号：US758084
申请日：1996-11-27
申请人： Michimasa Takeshita , Takayuki Yoshida , Yoshiaki Tanimura , Hitoshi Iijima , Takashi Gotoh , Tsuneo Yumikura
发明人： Michimasa Takeshita , Takayuki Yoshida , Yoshiaki Tanimura , Hitoshi Iijima , Takashi Gotoh , Tsuneo Yumikura
IPC分类号： F24F1/00 , F28F1/12 , F28F1/32 , F28F1/36
CPC分类号： F28F1/122 , F24F1/0007 , F24F2001/0048 , Y10S165/31 , Y10S165/471 , Y10S165/498 , Y10S165/518
摘要： A heat exchanger mounted in an air condition is constructed such that at least one row of heat conduction pipe groups are arranged across an air passage. Each heat conduction pipe group is constructed such that a plurality of heat conduction pipes 22 are arranged in parallel with each other and a fine wire 23 made of a metallic material having excellent heat conductivity is spirally wound around each adjacent heat conduction pipe 22. Thus, the performance of the heat exchanger can be improved without the air conditioner being designed with larger dimensions. In addition, the heat exchanger includes a plurality of heat conduction pipes 39 arranged in the form of at least one row with a constant distance between adjacent pipes, and a plurality of twisted wires 40. The twisted wires 40 are arranged so as to alternately come in contact with one side and opposite side of each heat conduction pipe 39 extending at a right angle relative to the row direction of each heat conduction pipe 39, and moreover, alternately come in contact with one side and opposite other side of each heat conduction pipe 39 extending in the longitudinal direction. With this construction, high heat conductivity can be realized, and an occurrence of clogging with dew droplets can be prevented while maintaining a heat transfer surface area.
摘要翻译：安装在空气状态的热交换器被构造成使得至少一排导热管组跨越空气通道布置。每个导热管组被构造成使得多个导热管22彼此平行地布置，并且由具有优良导热性的金属材料制成的细线23螺旋地卷绕在每个相邻的导热管22周围。因此，无需设计具有更大尺寸的空调器，可以提高热交换器的性能。此外，热交换器包括多个导管39，其布置成相邻管之间具有恒定距离的至少一排的形式，以及多个绞合线40.绞合线40被布置成交替地到达与每个导热管39的相对于每个导热管39的行方向成直角延伸的一个侧面和相对侧接触，并且与每个导热管39的一侧相对的另一侧交替接触 39沿纵向延伸。通过这种结构，可以实现高导热性，并且可以在保持传热表面积的同时防止发生具有露滴的堵塞。

49. 发明授权

US5449583A Method of making decolorizable toner 失效
标题翻译：制造可脱色墨粉的方法
公开(公告)号：US5449583A
公开(公告)日：1995-09-12
申请号：US300860
申请日：1994-09-06
申请人： Katsumi Murofushi , Yoshikazu Hosoda , Yuki Abe , Kiyotaka Yamaguchi , Takayuki Yoshida
发明人： Katsumi Murofushi , Yoshikazu Hosoda , Yuki Abe , Kiyotaka Yamaguchi , Takayuki Yoshida
IPC分类号： G03G9/09 , G03G9/097
CPC分类号： G03G9/09725 , G03G9/0926 , G03G9/09708 , G03G9/09733 , G03G9/09741 , G03G9/0975 , G03G9/09791
摘要： A decolorizable toner including a resin binder, a near infrared ray-absorbing dye, a decolorizing agent and a light fastness stabilizer, and a process for preparing the decolorizable toner, which includes the steps of mixing the near infrared ray-absorbing dye and the light fastness stabilizer with the resin binder, and then mixing the decolorizing agent therewith. The decolorizable toner has excellent light stability during its production or storage and excellent decolorizing property.
摘要翻译：一种可脱色的调色剂，包括树脂粘合剂，近红外线吸收染料，脱色剂和耐光性稳定剂，以及制备可脱色调色剂的方法，其包括将近红外线吸收染料和光坚牢剂与树脂粘合剂，然后将脱色剂混合。可脱色的调色剂在其生产或储存期间具有优异的光稳定性和优异的脱色性能。

50. 发明授权

US5336547A Electronic components mounting/connecting package and its fabrication method 失效
标题翻译：电子元件安装/连接封装及其制造方法
公开(公告)号：US5336547A
公开(公告)日：1994-08-09
申请号：US23106
申请日：1993-02-26
申请人： Tetsuo Kawakita , Takayuki Yoshida , Kenzo Hatada
发明人： Tetsuo Kawakita , Takayuki Yoshida , Kenzo Hatada
IPC分类号： H01L21/56 , H01L21/60 , H01L23/485 , B32B9/00
CPC分类号： H01L24/29 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , Y10T428/12014 , Y10T428/24917 , Y10T428/24926 , Y10T428/249968 , Y10T428/24997 , Y10T428/249986
摘要： The present invention relates to an electronic components mounting/connecting package characterized by using bump electrodes to connect electronic components such as semiconductors and the like with patterning electrodes of a circuit board.In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated with bump electrodes. The composition of bump electrodes disclosed by the present invention is to have resin particles dispersed to high density in the metallic bump electrodes.According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it has become possible to absorb the variations through elasticity presented by the bump electrodes and to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.
摘要翻译：电子元件安装/连接封装技术领域本发明涉及一种电子元件安装/连接封装，其特征在于使用凸块电极将电子元件如半导体等与电路板的图形电极连接。为了防止由于半导体和电路板的变形等引起的连接可靠性的劣化，需要具有凸起电极的一些弹性。本发明公开的凸块电极的组成是在金属凸块电极中具有高密度分散的树脂颗粒。根据该构成，即使在电路板翘曲和凸起电极高度的分布存在一些变化的情况下，也可以通过由凸块电极呈现的弹性吸收变化，并且进行低应变连接，从而提高连接高温可靠性。

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