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41. 发明授权

US08469162B2 Shock absorber 有权
标题翻译：减震器
公开(公告)号：US08469162B2
公开(公告)日：2013-06-25
申请号：US13246262
申请日：2011-09-27
申请人： Makoto Nishimura , Jin Yamasaki , Shinichi Kagawa , Tetsuo Yoshida
发明人： Makoto Nishimura , Jin Yamasaki , Shinichi Kagawa , Tetsuo Yoshida
IPC分类号： F16F9/32
CPC分类号： B60G13/06 , F16B2200/10 , F16F9/325 , Y10T137/5987 , Y10T137/7833 , Y10T137/7836 , Y10T403/4641 , Y10T403/4642
摘要： A piston with a piston rod coupled thereto is inserted in a cylinder, which sealingly contains oil. An oil flow generated by movement of the piston is controlled by a damping force generation mechanism, thereby generating a damping force. A separator tube is disposed around the cylinder, and the oil is transmitted to the damping force generation mechanism through a branch tube integrally formed on a cylindrical sidewall of the separator tube. The branch tube is tapered at the outer circumferential portion thereof with the outer diameter thereof reducing toward the distal end of the branch tube.
摘要翻译：具有与其连接的活塞杆的活塞插入密封地容纳油的气缸中。由活塞的运动产生的油流由阻尼力产生机构控制，从而产生阻尼力。分隔管设置在气缸周围，并且油通过一体地形成在分离管的圆柱形侧壁上的分支管传递到阻尼力产生机构。支管在其外圆周部分处是锥形的，其外径减小到分支管的远端。

42. 发明授权

US08418272B2 Toilet seat apparatus 有权
标题翻译：马桶座椅装置
公开(公告)号：US08418272B2
公开(公告)日：2013-04-16
申请号：US12530678
申请日：2008-03-11
申请人： Makoto Nishimura , Shigeru Shirai , Hideki Ohno , Yoshiharu Shimada , Tomoko Ishida , Yuji Yamamoto , Shinji Fujii , Yoshiko Kurimoto , Kazuya Kondoh , Masahiro Inoue , Toru Ueno
发明人： Makoto Nishimura , Shigeru Shirai , Hideki Ohno , Yoshiharu Shimada , Tomoko Ishida , Yuji Yamamoto , Shinji Fujii , Yoshiko Kurimoto , Kazuya Kondoh , Masahiro Inoue , Toru Ueno
IPC分类号： A47K13/00
CPC分类号： A47K13/24 , A47K13/305 , H05B3/26 , H05B3/267 , H05B3/56 , H05B2203/014 , H05B2203/017 , H05B2203/029
摘要： A linear heater is formed of an enamel wire composed of a heating wire and an enamel layer. The heating wire is made of a copper alloy containing silver, for example. The enamel layer is made of polyester imide (PEI), polyimide (PI) or polyamide imide (PAI), for example. The enamel layer is coated with an insulating coating layer. The insulating coating layer is made of fluororesin such as perfluoroalkoxy mixture (PFA), polyimide (PI), or polyamide imide (PAI). The linear heater is bonded to the lower surface of an upper toilet seat casing such that it is sandwiched between a metal foil and a metal foil made of aluminum, for example.
摘要翻译：线状加热器由由加热线和搪瓷层组成的搪瓷线形成。例如，加热线由含有银的铜合金构成。搪瓷层例如由聚酰亚胺（PEI），聚酰亚胺（PI）或聚酰胺酰亚胺（PAI）制成。搪瓷层涂有绝缘涂层。绝缘涂层由全氟烷氧基混合物（PFA），聚酰亚胺（PI）或聚酰胺酰亚胺（PAI）等氟树脂制成。线状加热器例如被接合到上座便器壳体的下表面，使得其被夹在金属箔和铝制金属箔之间。

43. 发明申请

US20120280379A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120280379A1
公开(公告)日：2012-11-08
申请号：US13464257
申请日：2012-05-04
申请人： JUNICHI ARITA , Kazuko Hanawa , Makoto Nishimura
发明人： JUNICHI ARITA , Kazuko Hanawa , Makoto Nishimura
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/05554 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32014 , H01L2224/32055 , H01L2224/32057 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/05599
摘要： A semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and leads so as to surround the die pad, members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate. A semiconductor chip larger than the die pad is mounted over the die pad and the members. Top surfaces of the die pad and the members in opposition to the back surface of the chip are bonded to the back surface of the chip with silver paste. Heat is conducted from the back surface of the chip to the heat dissipating plate via the silver paste, the die pad, and the members, and dissipated to the outside of the semiconductor device via the leads.
摘要翻译：半导体器件具有管芯焊盘，布置在管芯焊盘和引线之间的框架形式的散热板，以围绕管芯焊盘，连接管芯焊盘和散热板的内边缘的部件，以及连接到散热板的外延伸部的悬挂引线。大于管芯焊盘的半导体芯片安装在管芯焊盘和部件上。芯片的顶表面和与芯片的背面相对的构件的顶面用银浆粘合到芯片的背面。通过银膏，芯片焊盘和部件从芯片的背面向散热板传导热量，并通过引线消散到半导体器件的外部。

44. 发明授权

US07848678B2 Image forming apparatus and process cartridge 有权
标题翻译：成像设备和处理盒
公开(公告)号：US07848678B2
公开(公告)日：2010-12-07
申请号：US12052376
申请日：2008-03-20
申请人： Junichi Shibata , Makoto Nishimura , Takahiro Suzuki
发明人： Junichi Shibata , Makoto Nishimura , Takahiro Suzuki
IPC分类号： G03G15/02 , G03G15/00
CPC分类号： G03G21/08 , G03G2215/00957
摘要： An image forming apparatus comprising an image holding member that is rotationally driven, the image holding member comprising, on a substrate, a subbing layer and a photosensitive layer, a volume resistance value of the subbing layer decreasing in a rotation axis direction of the image holding member, from one end portion of a light source side of the image holding member towards another end portion of the image holding member, a charging unit, a latent image formation unit, a developing unit, a transfer unit, and a charge removal unit comprising a light source that, after transfer of the toner image, irradiates the surface of the image holding member from one side thereof, in a rotation axis direction of the image holding member, with charge removing light, to remove the charge from the surface of the image holding member.
摘要翻译：一种图像形成装置，包括被旋转地驱动的图像保持构件，所述图像保持构件在基板上包括底层和感光层，所述底层的体积电阻值在图像保持的旋转轴线方向上减小构件，从图像保持构件的光源侧的一个端部朝向图像保持构件的另一端部，充电单元，潜像形成单元，显影单元，转印单元和电荷去除单元，包括在调色剂图像转印之后，从图像保持部件的表面沿图像保持部件的旋转轴方向照射图像保持部件的表面的光源，利用电荷去除光，图像保持构件。

45. 发明申请

US20100244214A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100244214A1
公开(公告)日：2010-09-30
申请号：US12731201
申请日：2010-03-25
申请人： Junichi ARITA , Kazuko Hanawa , Makoto Nishimura
发明人： Junichi ARITA , Kazuko Hanawa , Makoto Nishimura
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49503 , H01L23/3107 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/05554 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32014 , H01L2224/32055 , H01L2224/32057 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48108 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/05599
摘要： To improve the heat dissipation characteristics of a semiconductor device.The semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and a plurality of leads so as to surround the die pad, a plurality of members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate, wherein a semiconductor chip the outer shape of which is larger than the die pad is mounted over the die pad and the members. The top surface of the die pad and the top surface of the members at the part in opposition to the back surface of the semiconductor chip are bonded to the back surface of the semiconductor chip in their entire surfaces with a silver paste. Heat in the semiconductor chip is conducted from the back surface of the semiconductor chip to the heat dissipating plate via the silver paste, the die pad, and the member, and dissipated to the outside of the semiconductor device therefrom via the lead.
摘要翻译：提高半导体器件的散热特性。半导体器件具有管芯焊盘，散热板，其形式为布置在管芯焊盘和多个引线之间的框架形式，以围绕管芯焊盘;多个构件，其将管芯焊盘和内部边缘连接散热板和连接到散热板的外部延伸部的悬挂引线，其中外部形状大于管芯焊盘的半导体芯片安装在管芯焊盘和部件上。芯片焊盘的顶表面和与半导体芯片的背面相对的部分的部件的顶表面在银浆的整个表面上与半导体芯片的背面接合。半导体芯片中的热量通过银膏，芯片焊盘和部件从半导体芯片的背面传导到散热板，并通过引线从其散发到半导体器件的外部。

46. 发明申请

US20090324895A1 NONWOVEN FABRIC FOR FILTERS AND METHOD OF PRODUCING THE SAME 有权
标题翻译：用于过滤器的非织造织物及其生产方法
公开(公告)号：US20090324895A1
公开(公告)日：2009-12-31
申请号：US12162575
申请日：2007-01-30
申请人： Nobuyuki Takano , Masashi Ito , Makoto Nishimura
发明人： Nobuyuki Takano , Masashi Ito , Makoto Nishimura
IPC分类号： B32B3/28 , D04H13/00 , B29C47/00 , B29C59/04
CPC分类号： D04H3/16 , B01D39/02 , B01D39/163 , Y10T428/24686 , Y10T442/60
摘要： The present invention provides a nonwoven fabric for filters which is excellent in dust collection efficiency and exhibits low pressure drop and excellent mechanical characteristics and rigidity, and a method of producing the nonwoven fabric. A nonwoven fabric for filters of the present invention is a nonwoven fabric for filters which is a long fiber nonwoven fabric, consisting of thermoplastic continuous filaments and formed by partially thermocompression bonding the thermoplastic continuous filaments, wherein the nonwoven fabric has a QF value (Pa−1) of 0.02 to 0.08 and stiffness of 2 to 80 mN.
摘要翻译：本发明提供一种滤尘器用无纺布，其集尘效率优异，压降低，机械特性和刚性优异，无纺布的制造方法。本发明的滤材用无纺布是由热塑性连续长纤维构成的长纤维无纺布的过滤器用无纺布，其特征在于，将所述热塑性连续长丝进行部分热压接而形成，所述无纺布的QF值（Pa- 1）为0.02〜0.08，硬度为2〜80mN。

47. 发明授权

US07592112B2 Electrophotographic photoreceptor, process cartridge and electrophotographic apparatus 有权
标题翻译：电子照相感光体，处理盒和电子照相设备
公开(公告)号：US07592112B2
公开(公告)日：2009-09-22
申请号：US11083027
申请日：2005-03-18
申请人： Shigeaki Shiino , Makoto Takemoto , Makoto Kusayanagi , Koichi Yasaku , Hirokazu Sakashita , Makoto Nishimura , Yu Qi , Nan-Xing Hu , Ah-Mee Hor
发明人： Shigeaki Shiino , Makoto Takemoto , Makoto Kusayanagi , Koichi Yasaku , Hirokazu Sakashita , Makoto Nishimura , Yu Qi , Nan-Xing Hu , Ah-Mee Hor
IPC分类号： G03G5/14
CPC分类号： G03G5/065 , G03G5/0605 , G03G5/0614 , G03G5/0629 , G03G5/0672 , G03G5/142 , G03G5/144
摘要： A multilayer electrophotographic photoreceptor, comprising an electroconductive substrate, and at least an interlayer and a charge-generating layer formed on the substrate, wherein the interlayer comprises fine metal oxide particles and the interlayer and the charge-generating layer comprise anthraquinone derivative(s), and wherein the interlayer has a volume resistivity in a range of 1.0×108 Ω·cm to 1.0×1013 Ω·cm when an electric field of 106 V/m is applied thereto at 28° C. and 85% relative humidity. A process cartridge and an image forming apparatus using the multilayer electrophotographic photoreceptor are also provided.
摘要翻译：一种多层电子照相感光体，包括导电性基材，至少形成在基材上的中间层和电荷产生层，其中中间层包含金属氧化物微粒，中间层和电荷产生层包含蒽醌衍生物，并且其中当在28℃和85％相对湿度下施加106V / m的电场时，所述中间层的体积电阻率在1.0×10 8Ω·cm至1.0×10 13Ω·cm的范围内。还提供了一种处理盒和使用该多层电子照相感光体的图像形成装置。

48. 发明授权

US07311508B2 Control device for injection molding machine 有权
标题翻译：注塑机控制装置
公开(公告)号：US07311508B2
公开(公告)日：2007-12-25
申请号：US10546196
申请日：2003-12-18
申请人： Koichiro Ueda , Makoto Nishimura
发明人： Koichiro Ueda , Makoto Nishimura
IPC分类号： B29C45/80
CPC分类号： B29C45/84 , B29C45/66 , B29C45/7653 , B29C2045/1792
摘要： A control device includes: a memory 29r for storing, in a process from a mold tool 10 being open until being closed, the value X(t) of a current flowing in a motor 3 at multiple points in time synchronized to the closing command signal; a mean-and-variance calculating for each of the points in time means for calculating a mean value Mx(t) and a variance value Vx(t) that correspond to current values X(t) that have been read from the memory 29r; a threshold calculating means for calculating a current threshold Xf(t) for each of the points in time using the mean value Mx(t) and the variance value Vx(t) from an arbitrary number of times up to (A−1) times, according to the following equation: Xf(t)=Mx(t)+N·{Vx(t)}1/2 where N is a constant and not less than 3; anda foreign object determining unit 29 for comparing the current threshold Xf(t) and the current value X(t) at each of the points in time to determine whether there is an abnormality according to whether the current value X(t) exceeds the current threshold Xf(t) a predetermined number m of times.
摘要翻译：控制装置包括：存储器29r，用于在从模具10打开到关闭的过程中存储在与闭合命令同步的多个时间点在电动机3中流动的电流的值X（t）信号; 对于每个时间点的均值和方差计算装置，用于计算与从存储器29 r读取的当前值X（t）相对应的平均值Mx（t）和方差值Vx（t） ; 阈值计算装置，用于使用平均值Mx（t）和从任意次数达到（A-1）倍的方差值Vx（t）来计算每个时间点的每个时间点的当前阈值Xf（t），其中N是常数且不小于3; Xf（t）= Mx（t）+ N。{Vx（t0-2 / 2）其中N是常数并且不小于3;以及异物确定单元 29，用于根据当前值X（t）是否超过当前阈值Xf（t）来比较每个时间点处的当前阈值Xf（t）和当前值X（t）以确定是否存在异常，预定数量的次数。

49. 发明申请

US20070197116A1 Sheet and interior material 有权
标题翻译：板材和内部材料
公开(公告)号：US20070197116A1
公开(公告)日：2007-08-23
申请号：US11547149
申请日：2005-03-29
申请人： Yoshikazu Yakake , Masaru Ueno , Makoto Nishimura
发明人： Yoshikazu Yakake , Masaru Ueno , Makoto Nishimura
IPC分类号： D04H13/00
CPC分类号： D06N3/0004 , C08G18/44 , D06N3/14 , Y10T442/60 , Y10T442/601 , Y10T442/607 , Y10T442/608 , Y10T442/614 , Y10T442/637 , Y10T442/64
摘要： A sheet comprising a non-woven fabric in which ultra-fine fibers of a single fiber thickness of 0.5 dtex or less are entangled and an elastomeric binder mainly composed of a polyurethane, wherein said polyurethane is a polycarbonate-based polyurethane having a polycarbonate skeleton represented by the following general formulas (1) and (2), and having a gelation point of 2.5 ml or more and less than 6 ml. (In the formula, R1 and R2 are aliphatic hydrocarbon groups with 7 to 11 carbons, and they may be same or different. Furthermore, n and m are positive integers, and when R1 and R2 are different, it is a block copolymer or a random copolymer) (In the formula, R3 and R4 are aliphatic hydrocarbon groups with 3 to 6 carbons, and they may be same or different. Furthermore, x and y are positive integers, and when R3 and R4 are different, it is a block copolymer or a random copolymer)
摘要翻译：一种片材，其包含单丝纤维厚度为0.5dtex以下的超细纤维缠结的无纺布和主要由聚氨酯构成的弹性体粘合剂，其中，所述聚氨酯为具有聚碳酸酯骨架的聚碳酸酯类聚氨酯通过以下通式（1）和（2），凝胶化点为2.5ml以上且小于6ml。（式中，R 1和R 2是具有7〜11个碳的脂肪族烃基，它们可以相同或不同，此外，n和m是正整数，当R 1和R 2不同时，它是嵌段共聚物或无规共聚物）（在该式中，R 3和 R 4是具有3至6个碳的脂族烃基，它们可以相同或不同，此外，x和y是正整数，当R 3和R 3， SUB> 4 不同，它是嵌段共聚物或无规共聚物）

50. 发明授权

US06693263B2 Convection type brazing apparatus for metal workpieces 失效
标题翻译：金属工件对流式钎焊装置
公开(公告)号：US06693263B2
公开(公告)日：2004-02-17
申请号：US10305969
申请日：2002-11-29
申请人： Makoto Nishimura
发明人： Makoto Nishimura
IPC分类号： H05B610
CPC分类号： B23K1/012
摘要： The invention provides a convection type brazing apparatus for metal workpieces such as aluminum, copper, iron and so forth that enables uniform heating of the metal workpieces to prevent deformation of the workpieces and can shorten a heating time to achieve a higher operation efficiency. A heating medium gas heated by a tube heater 36 in a thermal medium gas heating chamber 45 is forwarded by a fan 37 to manifolds 41A and 41B located on both left and right sides, to be blown through a multitude of nozzles 43 toward workpieces W to which a brazing material and flux have been applied in advance. Once the workpieces temperature has reached a predetermined temperature for brazing, a switching valve located in an upper duct 48 is activated so that the heating medium gas is intermittently blown to the workpieces. As a result, a temperature slope of the workpieces is minimized and uniform brazing can be performed.
摘要翻译：本发明提供一种用于金属工件如铝，铜，铁等的对流型钎焊装置，其能够均匀地加热金属工件以防止工件变形，并且可以缩短加热时间以实现更高的操作效率。由热介质气体加热室45中的管加热器36加热的加热介质气体通过风扇37被送到位于左右两侧的歧管41A和41B，以通过多个喷嘴43朝向工件W吹送到预先施加了钎焊材料和焊剂。一旦工件温度达到预定温度以进行钎焊，则位于上管道48中的切换阀被启动，使得加热介质气体间歇地吹送到工件。结果，工件的温度斜率被最小化，可以进行均匀的钎焊。

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