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41. 发明授权

US06797772B2 Alkenyl polyorganosiloxane, organohydrogensiloxane, organosilicon or silane treated silver particles and Pt catalyst 失效
标题翻译：烯基聚有机硅氧烷，有机氢硅氧烷，有机硅或硅烷处理的银颗粒和Pt催化剂
公开(公告)号：US06797772B2
公开(公告)日：2004-09-28
申请号：US10052760
申请日：2002-01-18
申请人： Kazumi Nakayoshi , Katsutoshi Mine , Rikako Tazawa
发明人： Kazumi Nakayoshi , Katsutoshi Mine , Rikako Tazawa
IPC分类号： C08K906
CPC分类号： H01B1/22 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/08 , C08K9/06 , C08L83/04 , C08L83/00 , C08L2666/54
摘要： A composition comprises the product obtained by homogeneously blending: (A) 100 parts by weight of a polyorganosiloxane containing at least two alkenyl radicals per molecule, (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen atoms per molecule in a quantity sufficient to provide from 0.5 to 3 silicon-bonded hydrogen atoms per alkenyl radical of (A), (C) from 50-2000 parts by weight of silver particles pre-treated with an organosilicon compound selected from the group consisting of (i) alkoxy group(s)-containing silanes and (ii) organosiloxanes, (D) a platinum catalyst, (E) up to 20 weight percent based on the weight of (A) of an organosilicon compound containing at least one silicon-bonded alkoxy group per molecule, and (F) from 0.001 to 5 parts by weight per 100 parts by weight of (A) of a cure inhibitor.
摘要翻译：组合物包括通过均匀共混获得的产物：（A）每分子100重量份含有至少两个烯基的聚有机硅氧烷，（B）每分子含有至少两个与硅键合的氢原子的有机氢硅氧烷，其量足够对（A），（C）的每个烯基基团提供0.5至3个硅键合的氢原子，从50-2000重量份的预先用有机硅化合物处理的银粒子，所述有机硅化合物选自（i）烷氧基（ s）的硅烷和（ii）有机硅氧烷，（D）铂催化剂，（E）至多20重量％，基于每分子含有至少一个与硅键合的烷氧基的有机硅化合物的重量比（A）和（F）0.001至5重量份/ 100重量份的（A）固化抑制剂。

42. 发明授权

US06764718B2 Method for forming thin film from electrically insulating resin composition 失效
标题翻译：从电绝缘树脂组合物形成薄膜的方法
公开(公告)号：US06764718B2
公开(公告)日：2004-07-20
申请号：US10315337
申请日：2002-12-09
申请人： Takashi Nakamura , Kiyotaka Sawa , Akihiko Kobayashi , Katsutoshi Mine
发明人： Takashi Nakamura , Kiyotaka Sawa , Akihiko Kobayashi , Katsutoshi Mine
IPC分类号： B05D302
CPC分类号： H01L21/02134 , H01B3/46 , H01L21/02282 , H01L21/3121 , H01L21/3122 , H01L21/3124 , Y10T428/31663
摘要： A method for forming an electrically insulating thin film coating the surface of an electronic device with an electrically insulating thin-film-forming resin composition and crosslinking the composition by a method selected from the group consisting of heating and irradiation with high-energy rays.
摘要翻译：一种用电绝缘薄膜形成树脂组合物涂覆电子器件表面的电绝缘薄膜的方法，并通过选自加热和高能射线照射的方法交联该组合物。

43. 发明授权

US06447846B2 Electrically insulating thin-film-forming resin composition and method for forming thin film therefrom 失效
标题翻译：电绝缘性薄膜形成用树脂组合物及其薄膜形成方法
公开(公告)号：US06447846B2
公开(公告)日：2002-09-10
申请号：US09765204
申请日：2001-01-18
申请人： Takashi Nakamura , Kiyotaka Sawa , Akihiko Kobayashi , Katsutoshi Mine
发明人： Takashi Nakamura , Kiyotaka Sawa , Akihiko Kobayashi , Katsutoshi Mine
IPC分类号： B05D302
CPC分类号： H01L21/3124 , C09D183/04 , H01L21/02134 , H01L21/02282 , H01L21/02351 , Y10T428/31663 , Y10T428/31855 , C08L83/00 , C08L2666/04 , C08L2666/14
摘要： An electrically insulating thin-film-forming resin composition comprising (A) a hydrogen silsesquioxane resin, (B) a solvent-soluble polymer, and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.
摘要翻译：一种电绝缘薄膜形成树脂组合物，其包含（A）氢倍半硅氧烷树脂，（B）溶剂可溶性聚合物和（C）溶剂; 以及从其形成电绝缘薄膜的方法。

44. 发明授权

US6039831A Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices 有权
标题翻译：导电硅橡胶组合物，半导体器件的制造方法和半导体器件
公开(公告)号：US6039831A
公开(公告)日：2000-03-21
申请号：US231949
申请日：1999-01-15
申请人： Katsutoshi Mine , Osamu Mitani , Kazumi Nakayoshi , Rikako Tazawa
发明人： Katsutoshi Mine , Osamu Mitani , Kazumi Nakayoshi , Rikako Tazawa
IPC分类号： C08J3/24 , C08K3/08 , C08L83/04 , C08L83/06 , C08L83/07 , C09J183/04 , C09J183/06 , C09J183/07 , B32B31/28
CPC分类号： C08L83/04 , C08L83/06 , C09J183/04 , C09J183/06 , C08G77/12 , C08G77/20 , H01L2224/48091 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/3025
摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the compositon, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.
摘要翻译：含有含有有机聚硅氧烷的丙烯酸官能团的氢化硅烷化固化型导电硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基底上，然后用高能量束照射组合物时，组合物的暴露外围固化成在水解反应之前和期间，来自组合物的低分子量硅氧烷物质的迁移的程度最小化。一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。通过该方法制造的具有提高的可靠性的半导体器件。

45. 发明授权

US5872170A Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices 失效
标题翻译：导电硅橡胶组合物，半导体器件的制造方法和半导体器件
公开(公告)号：US5872170A
公开(公告)日：1999-02-16
申请号：US840475
申请日：1997-04-21
申请人： Katsutoshi Mine , Osamu Mitani , Kazumi Nakayoshi , Rikako Tazawa
发明人： Katsutoshi Mine , Osamu Mitani , Kazumi Nakayoshi , Rikako Tazawa
IPC分类号： C08K3/08 , C08F299/08 , C08K5/00 , C08L83/04 , C08L83/05 , C08L83/06 , C08L83/07 , C09J183/04 , C09J183/06 , C09J183/07 , H01L21/52
CPC分类号： C09J183/04 , C08L83/04 , C08L83/06 , C09J183/06 , C08G77/12 , C08G77/20 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/12044 , H01L2924/1301 , H01L2924/15747 , H01L2924/19105 , H01L2924/3025
摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.
摘要翻译：含有含丙烯酸官能团的有机聚硅氧烷的氢化硅烷化固化型导电性硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基材上，然后用高能量束照射组合物时，组合物的暴露的周边固化在低分子量硅氧烷物质从组合物的迁移之前和期间在水解反应中都被最小化的程度。一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。通过该方法制造的具有提高的可靠性的半导体器件。

46. 发明授权

US5416190A Method for the molecular weight fractionation of polyhydrogen silsesquioxane 失效
$Method for the molecular weight fractionation of polyhydrogen silsesquioxane$
标题翻译：聚氢倍半硅氧烷的分子量分馏方法
公开(公告)号：US5416190A
公开(公告)日：1995-05-16
申请号：US145923
申请日：1993-10-29
申请人： Katsutoshi Mine , Takashi Nakamura , Motoshi Sasaki
发明人： Katsutoshi Mine , Takashi Nakamura , Motoshi Sasaki
IPC分类号： C08G77/32 , C08G77/12 , C08G77/36 , C08F6/12
CPC分类号： C08G77/12 , C08G77/36
摘要： Disclosed is a highly reproducible method for the molecular weight fractionation of polyhydrogen silsesquioxane that gives a very storage-stable polyhydrogen silsesquioxane having a freely selectable molecular weight. The method involves dissolving polyhydrogen silsesquioxane in active-hydrogen-free nonpolar solvent; adding an active-hydrogen-free polar solvent to the resulting solution in order to precipitate polyhydrogen silsesquioxane; and collecting the desired molecular weight fraction of polyhydrogen silsesquioxane.
摘要翻译：公开了一种高度可重复的聚氢倍半硅氧烷分子量分级方法，其提供了具有可自由选择的分子量的非常储存稳定的聚氢倍半硅氧烷。该方法包括将聚氢倍半硅氧烷溶解在无活性氢的非极性溶剂中; 向所得溶液中加入无活性氢的极性溶剂，以沉淀聚氢倍半硅氧烷; 并收集所需的聚氢倍半硅氧烷的分子量分数。

47. 发明授权

US5380555A Methods for the formation of a silicon oxide film 失效
标题翻译：形成氧化硅膜的方法
公开(公告)号：US5380555A
公开(公告)日：1995-01-10
申请号：US187239
申请日：1994-01-26
申请人： Katsutoshi Mine , Takashi Nakamura , Motoshi Sasaki
发明人： Katsutoshi Mine , Takashi Nakamura , Motoshi Sasaki
IPC分类号： C03C17/23 , C04B41/50 , C04B41/87 , C23C18/12 , H01L21/316 , B05D3/02
CPC分类号： C04B41/87 , C03C17/23 , C04B41/009 , C04B41/5035 , C23C18/1208 , C23C18/1212 , C23C18/1279 , H01L21/316 , C03C2217/213 , C03C2218/17 , C04B2111/00844
摘要： Disclosed is a method for the formation of ceramic silicon oxide films on substrate surfaces wherein said films are thick, free of cracks and pinholes, and insoluble in organic solvents. These films are formed by coating the surface of a substrate with a silicon resin having the general formula(HR.sub.2 SiO.sub.1/2).sub.X (SiO.sub.4/2).sub.1.0wherein R is selected from the set comprising the hydrogen atom, alkyl groups, and aryl groups, and 0.1.ltoreq.X.ltoreq.2.0, and then heating the coated substrate to convert the coating into a ceramic silicon oxide film.
摘要翻译：公开了一种在衬底表面上形成陶瓷氧化硅膜的方法，其中所述膜是厚的，没有裂纹和针孔，并且不溶于有机溶剂。这些膜通过用具有通式（HR2SiO1 / 2）X（SiO4 / 2）1.0的硅树脂涂覆基板的表面而形成，其中R选自包含氢原子，烷基和芳基的组，和0.1≤X≤2.0，然后加热涂覆的基底以将涂层转变成陶瓷氧化硅膜。

48. 发明授权

US5109533A Method and apparatus for cancelling noise in a received signal by signal subtraction 失效
标题翻译：通过信号减法来消除接收信号中的噪声的方法和装置
公开(公告)号：US5109533A
公开(公告)日：1992-04-28
申请号：US421569
申请日：1989-10-11
申请人： Katsutoshi Mine , Yuji Morimoto , Koji Ogawa , Katsuyoshi Wakabayashi , Hiroshi Katsuta
发明人： Katsutoshi Mine , Yuji Morimoto , Koji Ogawa , Katsuyoshi Wakabayashi , Hiroshi Katsuta
IPC分类号： H04B15/00 , H04B1/12
CPC分类号： H04B1/12
摘要： An industrial measuring apparatus comprises first and second sensors having identical measuring characteristics and arranged close to each other and also close to a common subject of measurement, for measuring the same parameter, a transmitting unit having an adder and a first subtracter respectively connected the sensors through amplifiers, and a receiving unit having a second subtracter connected to the adder and the first subtracter through two transmission lines and constituting a noise canceling device in cooperation with the adder and the first subtracter. The second subtracter produces a receiving signal by subtracting the output of the subtracter representing the difference between the outputs of the first and second sensors from the output of the adder representing the sum of the outputs of the two sensors. Noise superposed on the outputs of the adder and subtracter during transmission is canceled out when the receiving signal is produced, whereby a receiving signal exactly corresponding to the sensor signal is easily obtained.
摘要翻译：一种工业测量装置包括具有相同测量特性的第一和第二传感器，彼此靠近并且靠近普通的测量对象，用于测量相同的参数，具有加法器和第一减法器的发送单元分别连接传感器通过放大器和具有通过两条传输线连接到加法器和第一减法器的第二减法器的接收单元，并与加法器和第一减法器协同构成噪声消除装置。第二减法器通过从表示两个传感器的输出之和的加法器的输出中减去表示第一和第二传感器的输出之间的差的减法器的输出来产生接收信号。当产生接收信号时，在发送期间叠加在加法器和减法器的输出上的噪声被抵消，从而容易获得与传感器信号完全相对应的接收信号。

49. 发明授权

US5008733A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5008733A
公开(公告)日：1991-04-16
申请号：US161164
申请日：1988-02-26
申请人： Katsutoshi Mine , Yoshitsugu Morita , Satoshi Miyamae
发明人： Katsutoshi Mine , Yoshitsugu Morita , Satoshi Miyamae
IPC分类号： H01L23/29 , H01L21/60 , H01L23/057 , H01L23/31 , H01L23/28 , H01L23/30
CPC分类号： H01L23/057 , H01L23/3135 , H01L23/3171 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/8592 , H01L2924/00011 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/12036 , H01L2924/1301 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/20752 , H01L2924/3025
摘要： A semiconductor device (1) in which a heat-bondable cured silicone (7) is applied and heat-bonded to the surface of only a predetermined principal portion of the semiconductor device so as not to contact bonding wires (3), flip chip solder portions (8) or beam leads, in order to protect the surface of the principal portion, and a seal layer (6) or (10) is provided after the heat bonding of the cured silicone. The cured silicone (7) is preferably in the form of a film, and a heat-resistant base material (12) may be laminated to one side of the cured silicone. Breaking of bonding wires (3), cracking of solder portions (8) and separation of beam leads do not occur because only the portion to be protected can be protected by coating with the cured silicone (7) and the portion not to be protected is not so coated. Moreover, sisnce there is no contamination caused by a silicone exhalation, the occurrence of a defective bonding and the separation of a sealing resin can be prevented. The seal layers (6 ) and (10) are each constituted by a hermetic seal or a resin seal.
摘要翻译：一种半导体器件（1），其中加热粘合的固化的硅氧烷（7）被热粘合到仅半导体器件的预定主要部分的表面，以便不接触接合线（3），倒装焊料为了保护主要部分的表面，在固化的硅氧烷的热粘结之后提供了部分（8）或光束引线，以及密封层（6）或（10）。固化的硅氧烷（7）优选为膜的形式，并且耐热基材（12）可以层压在固化的硅酮的一面上。不会发生接合线（3）的断裂，焊料部分（8）的破裂和引线的分离，因为只有被固化的硅氧烷（7）涂覆才能保护被保护的部分，而不受保护的部分是没有涂层此外，由于没有由有机硅呼气引起的污染，可以防止发生不良接合和密封树脂的分离。密封层（6）和（10）各自由气密密封或树脂密封构成。

50. 发明授权

US4268452A Noncurable sealing materials 失效
标题翻译：不可密封的密封材料
公开(公告)号：US4268452A
公开(公告)日：1981-05-19
申请号：US128604
申请日：1980-03-10
申请人： Katsutoshi Mine , Yoshitaka Kubota , Tsuneo Maruyama
发明人： Katsutoshi Mine , Yoshitaka Kubota , Tsuneo Maruyama
IPC分类号： C08L83/04
CPC分类号： C08K5/54 , C08K3/0033 , C08G77/16
摘要： A noncurable sealing material from a hydroxyl end-blocked polydiorganosiloxane, a filler and a silane or siloxane with two hydrolyzable groups having silicon-nitrogen bonds or silicon-oxygen-nitrogen bonds. The material when mixed and stored under substantially anhydrous conditions remains fluid but when exposed to the moisture in air increases in viscosity to form a sealing material which is uncured.
摘要翻译：来自羟基封端的聚二有机硅氧烷，填料和硅烷或硅氧烷的不可固化的密封材料具有两个具有硅 - 氮键或硅 - 氧 - 氮键的可水解基团。当在基本上无水的条件下混合并储存时的材料保持流体，但当暴露于空气中的水分时，粘度增加，形成未固化的密封材料。

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