专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US5568063A Signal transmitting device, circuit block and integrated circuit suited to fast signal transmission 失效
标题翻译：信号发送装置，电路块和适合快速信号传输的集成电路
公开(公告)号：US5568063A
公开(公告)日：1996-10-22
申请号：US476576
申请日：1995-06-07
申请人： Toshitsugu Takekuma , Ryoichi Kurihara , Akira Yamagiwa
发明人： Toshitsugu Takekuma , Ryoichi Kurihara , Akira Yamagiwa
IPC分类号： G06F3/00 , G06F12/00 , G06F13/16 , G06F13/40 , G11C11/401 , H03K19/0175 , H04B3/02 , H04L25/02 , H05K1/02 , H05K1/14 , H03K17/16
CPC分类号： H04L25/0298 , G06F13/4072 , G06F13/4086 , H04B3/02 , H04L25/0278 , H04L25/028 , H04L25/0292 , H05K1/0216 , H05K1/0237 , H05K1/14
摘要： A signal transmitting circuit includes one or more circuit blocks having a driving circuit and an intra-block transmission line for transmitting a signal produced by the driving circuit, one or more circuit blocks having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between both of the driving and receiving circuit blocks. Inter-block transmission line is terminated at one or two ends by one or two resistors having substantially the same impedance as the interblock transmission line itself. Each of the intra-block transmission line is provided with a resistance element having a resistance equal to or close to a value derived by subtracting a half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.
摘要翻译：信号发送电路包括一个或多个具有驱动电路和块内传输线的电路块，用于发送由驱动电路产生的信号，一个或多个电路块具有接收电路和块内传输线，用于发送信号到所述接收电路，以及主块间传输线，用于在两个驱动和接收电路块之间传播信号。块间传输线在一或两端由一个或两个具有与块间传输线本身基本上相同的阻抗的电阻终止。块内传输线路中的每一个被提供有电阻元件，其电阻等于或接近于通过从块内传输线路的阻抗减去块间传输线路的阻抗的一半导出的值，降低信号幅度并抑制沿着主块间传输线的分支点处的信号的反射，从而实现高速信号传送。

42. 发明授权

US5504924A Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards 失效
标题翻译：使用与板上的半导体器件接触的柔性部件的电子计算机的冷却系统
公开(公告)号：US5504924A
公开(公告)日：1996-04-02
申请号：US317621
申请日：1994-09-26
申请人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
发明人： Shingeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Toshio Hatada , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20 , G06F9/00
CPC分类号： H05K7/208 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F1/206 , H05K7/20809 , G06F2200/201
摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.
摘要翻译：一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

43. 发明授权

US5452436A System for connecting plurality of electronic units to data and clock buses wherein transmitting and receiving data in synchronization with transmitting and receiving clock signals 失效
标题翻译：用于将多个电子单元连接到与发送和接收时钟信号同步地发送和接收数据的数据和时钟总线的系统
公开(公告)号：US5452436A
公开(公告)日：1995-09-19
申请号：US367927
申请日：1995-01-03
申请人： Kiyokazu Arai , Akira Yamagiwa , Toshihiro Okabe
发明人： Kiyokazu Arai , Akira Yamagiwa , Toshihiro Okabe
IPC分类号： G06F13/42 , G06F1/10 , G06F13/00 , H04L7/00 , H04L12/40 , G06F1/04
CPC分类号： G06F1/10 , H04L7/0008
摘要： A data processing apparatus, including a number of electronic circuit units, in which high-speed data can be transmitted among the electronic circuit units. When data is transmitted from one electronic circuit unit to another electronic circuit unit, a clock signal to fetch the data in the sink side electronic circuit unit is transmitted from the source side electronic circuit unit via a clock signal line having the same signal propagation delay characteristics as those of the data signal line.
摘要翻译：一种数据处理装置，包括多个电子电路单元，其中可以在电子电路单元之间传输高速数据。当从一个电子电路单元发送数据到另一个电子电路单元时，通过具有相同信号传播延迟特性的时钟信号线从源极侧电子单元发送用于取出接收侧电子电路单元中的数据的时钟信号作为数据信号线的那些。

44. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

45. 发明授权

US5361188A Cooling apparatus of electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5361188A
公开(公告)日：1994-11-01
申请号：US115669
申请日：1993-09-02
申请人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
发明人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20 , H01L23/467
CPC分类号： H01L23/467 , H05K7/20563 , H01L2224/32 , H01L2224/73253 , Y10S165/908
摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.
摘要翻译：在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

46. 发明授权

US5315482A Semiconductor apparatus of module installing type 失效
标题翻译：模块安装型半导体装置
公开(公告)号：US5315482A
公开(公告)日：1994-05-24
申请号：US961394
申请日：1992-10-15
申请人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
发明人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
IPC分类号： H01L23/36 , H01L23/367 , H01L25/10 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/20
CPC分类号： H05K1/021 , H01L23/367 , H01L25/105 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , H05K1/141 , H05K1/182 , H05K2203/049 , H05K3/0061 , H05K3/366
摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.
摘要翻译：半导体装置包括热扩散板和表面安装印刷板。在散热板上安装有高发热的半导体装置。表面安装封装和芯片部件安装在印刷电路板的两个表面上。在印刷电路板的中心形成通孔，使得半导体器件位于中心。已经安装了半导体器件的散热板和表面安装印刷板连接并整合。

47. 发明授权

US5145800A Method of wiring for power supply to large-scale integrated circuit 失效
标题翻译：大规模集成电路供电方式
公开(公告)号：US5145800A
公开(公告)日：1992-09-08
申请号：US731616
申请日：1991-07-17
申请人： Kiyokazu Arai , Masatoshi Kawashima , Akira Yamagiwa , Toshihiro Okabe
发明人： Kiyokazu Arai , Masatoshi Kawashima , Akira Yamagiwa , Toshihiro Okabe
IPC分类号： H01L21/822 , H01L21/82 , H01L23/528 , H01L27/04 , H01L27/118
CPC分类号： H01L23/5286 , H01L2924/0002
摘要： A method for wiring a power supply for a large-scale integrated circuit. The power supply wires define a power supply grid surrounding lattice openings with fixed longitudinal and transverse lattice dimensions. The wire width is determined based on the integrated circuit chip size, the number of function circuits to be on the integrated circuit, the electrical power requirements of the function circuits, and the fixed longitudinal and transverse lattice dimensions. Longitudinal and transverse locations of the power supply wires chips are determined based on the determined wire width and the fixed longitudinal and transverse dimensions of the lattice openings. Alternatively, the wire width may be fixed and the dimensions of the lattice openings determined based on the integrated circuit chip size, the number of function circuits, the electrical power requirements of the function circuits and that wire width. When the electrical power requirement of a function circuit is significantly larger than that of another function circuit, the wire width may be increased in the vicinity of the one function circuit. When the function circuits include a large-scale function block, a wire width around a region of the integrated circuit chip in which the large-scale block is to be disposed may be selected which results in a wire area equal to the wire area of the power supply wire that would occupy the particular region for usual function circuits.
摘要翻译：一种用于大规模集成电路的电源接线的方法。电源线定义了围绕具有固定的纵向和横向晶格尺寸的格栅开口的电源网格。线宽是基于集成电路芯片尺寸，集成电路上的功能电路的数量，功能电路的电功率要求以及固定的纵向和横向晶格尺寸来确定的。电源线芯片的纵向和横向位置基于确定的线宽度和格子孔的固定纵向和横向尺寸来确定。或者，线宽可以是固定的，并且基于集成电路芯片尺寸，功能电路的数量，功能电路的电功率要求和线宽度确定的格子孔的尺寸。当功能电路的电力需求明显大于另一个功能电路的电力需求时，可以在一个功能电路附近增加导线宽度。当功能电路包括大规模功能块时，可以选择其中要布置大规模块的集成电路芯片的区域周围的导线宽度，这导致导线面积等于将占用特定区域用于通常功能电路的电源线。

48. 发明授权

US07372292B2 Signal transmitting device suited to fast signal transmission 失效
标题翻译：信号传输设备适合快速信号传输
公开(公告)号：US07372292B2
公开(公告)日：2008-05-13
申请号：US10194310
申请日：2002-07-15
申请人： Toshitsugu Takekuma , Ryoichi Kurihara , Akira Yamagiwa
发明人： Toshitsugu Takekuma , Ryoichi Kurihara , Akira Yamagiwa
IPC分类号： H03K19/003
CPC分类号： H04L25/0298 , G06F13/4072 , G06F13/4086 , H04B3/02 , H04L25/0278 , H04L25/028 , H04L25/0292 , H05K1/0216 , H05K1/0237 , H05K1/14
摘要： A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.
摘要翻译：信号发送电路包括具有用于发送来自驱动电路的信号的驱动电路和块内传输线路的电路块，具有接收电路的电路块和用于将信号发送到所述接收电路的块内传输线路以及用于在驱动和接收电路块之间传播信号的主块间传输线。块间传输线由具有与块间传输线基本上相同阻抗的电阻端接。块内传输线路设置有电阻元件，其电阻基本上等于通过将块间传输线路的阻抗的一半从块内传输线路的阻抗减去一半到更低的信号幅度，抑制沿着主块间传输线的分支点处的信号的反射，从而实现高速信号传送。

49. 发明授权

US06873179B2 Signal transmitting device suited to fast signal transmission 失效
公开(公告)号：US06873179B2
公开(公告)日：2005-03-29
申请号：US10241477
申请日：2002-09-12
申请人： Toshitsuqu Takekuma , Ryoichi Kurihara , Akira Yamagiwa
发明人： Toshitsuqu Takekuma , Ryoichi Kurihara , Akira Yamagiwa
IPC分类号： G06F3/00 , G06F12/00 , G06F13/16 , G06F13/40 , G11C11/401 , H03K19/0175 , H04B3/02 , H04L25/02 , H05K1/02 , H05K1/14 , H03K17/16
CPC分类号： H04L25/0298 , G06F13/4072 , G06F13/4086 , H04B3/02 , H04L25/0278 , H04L25/028 , H04L25/0292 , H05K1/0216 , H05K1/0237 , H05K1/14
摘要： A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

50. 发明授权

US06829574B1 Logic emulation module and logic emulation board 有权
标题翻译：逻辑仿真模块和逻辑仿真板
公开(公告)号：US06829574B1
公开(公告)日：2004-12-07
申请号：US09328800
申请日：1999-06-09
申请人： Hiroshi Ito , Akira Yamagiwa , Nobuaki Ejima , Ryoichi Kurihara , Masakazu Sakaue , Yasuhiro Uemura
发明人： Hiroshi Ito , Akira Yamagiwa , Nobuaki Ejima , Ryoichi Kurihara , Masakazu Sakaue , Yasuhiro Uemura
IPC分类号： G06F9455
CPC分类号： G06F17/5027 , H01L2224/16 , H01L2924/13091 , H01L2924/00
摘要： Disclosed herein is an improved logic module used for logic emulation along with an enhanced logic emulation board subject to logic verification. The logic module has a plurality of programmable LSIs capable of programming logic and a plurality of switching LSIs capable of programming connections, the LSIs being mounted on one or both sides of a board. Peripheral portions of the board carry connectors for electrical connection to the outside. There are two types of data lines: those directly coupling the connectors to the programmable LSIs, and those linking the connectors to the programmable LSIs via the switching LSIs. The programmable and switching LSIs constitute a crossbar connection arrangement. The logic emulation board has connectors for connection to a logic emulation module, and lands for supporting LSIs targeted for development. Pins of the connectors and the lands are interconnected on a one-to-one basis. Also disclosed here is an upgraded module structure permitting a multiple-stage module setup together with an advanced cooling structure for modules.
摘要翻译：这里公开了一种用于逻辑仿真的改进的逻辑模块以及经过逻辑验证的增强型逻辑仿真板。逻辑模块具有能够编程逻辑的多个可编程LSI和能够编程连接的多个开关LSI，LSI安装在板的一侧或两侧。板的外围部分携带用于与外部电连接的连接器。有两种类型的数据线：将连接器直接耦合到可编程LSI的数据线，以及通过开关LSI将连接器连接到可编程LSI的那些。可编程和开关式LSI构成了一种交叉连接装置。逻辑仿真板具有用于连接到逻辑仿真模块的连接器，并且用于支持用于开发的LSI的接地。连接器和焊盘的引脚是以一对一的方式相互连接的。这里还公开了一种升级的模块结构，允许多级模块与模块的先进冷却结构一起设置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式