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41. 发明授权

US07148077B2 Micromechanical structural element having a diaphragm and method for producing such a structural element 有权
标题翻译：具有隔膜的微机械结构元件及其制造方法
公开(公告)号：US07148077B2
公开(公告)日：2006-12-12
申请号：US10970069
申请日：2004-10-19
申请人： Matthias Fuertsch , Stefan Pinter , Heribert Weber , Frank Fischer , Lars Metzger , Christoph Schelling , Frieder Sundermeier
发明人： Matthias Fuertsch , Stefan Pinter , Heribert Weber , Frank Fischer , Lars Metzger , Christoph Schelling , Frieder Sundermeier
IPC分类号： H01L21/00
CPC分类号： B81B3/007 , B81B2201/0264 , B81B2203/0127 , B81C2201/0167
摘要： A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.
摘要翻译：具有非常稳定的隔膜的微机械结构元件以纯正的前工艺和基底上的层结构实现。该层结构包括至少一个牺牲层和牺牲层上方的一个隔膜层，其被构造用于铺设隔膜并在隔膜上产生稳定元件，为隔膜的稳定元件产生至少一个凹槽。然后在牺牲层中产生的结构至少被表面封闭，其中至少一个材料层沉积在结构化牺牲层的上方，该材料层形成隔膜层的至少一部分并被构造成产生至少一个蚀刻孔蚀刻从蚀刻孔下方的区域去除的牺牲层，隔膜和至少一个稳定元件被裸露，在隔膜下面形成空腔。

42. 发明申请

US20060057755A1 Micromechanical component and suitable method for its manufacture 失效
标题翻译：微机械部件及其制造方法
公开(公告)号：US20060057755A1
公开(公告)日：2006-03-16
申请号：US11221520
申请日：2005-09-07
申请人： Heribert Weber
发明人： Heribert Weber
IPC分类号： H01L21/00
CPC分类号： B81C1/00158 , B81B2201/0278 , B81B2203/0315
摘要： A micromechanical component having a silicon substrate; a cavity provided in the substrate; and a diaphragm, provided on the surface of the substrate, which closes the cavity; the diaphragm featuring a silicon-oxide layer having an opening that is formed by silicon-oxide wedges pointing to each other; and the diaphragm having at least one closing layer which closes the opening. Also, a suitable manufacturing method.
摘要翻译：具有硅衬底的微机械部件; 设置在所述基板中的空腔; 以及设置在所述基板的表面上的隔膜，其关闭所述空腔; 所述隔膜的特征在于具有通过彼此指向的氧化硅楔形成的开口的氧化硅层; 并且所述隔膜具有封闭所述开口的至少一个封闭层。另外，合适的制造方法。

43. 发明申请

US20050199041A1 Sensor assembly for measuring a gas concentration 审中-公开
标题翻译：用于测量气体浓度的传感器组件
公开(公告)号：US20050199041A1
公开(公告)日：2005-09-15
申请号：US10514211
申请日：2002-11-14
申请人： Heribert Weber , Christian Krummel
发明人： Heribert Weber , Christian Krummel
IPC分类号： G01N27/02 , G01N27/12 , G01N27/22
CPC分类号： G01N27/128
摘要： The invention relates to a sensor assembly for measuring a gas concentration, in particular CO, H2, NOx and/or hydrocarbons. The aim of the invention is to permit an accurate measurement by relatively simple means, ii particular at low cost. To achieve this, the sensor assembly is provided with an insulation material that is applied to the substrate (2) and comprises one or more insulation layers (4, 6, 8, 10), at least one first electrode structure (12, 13) that is provided in or on the insulation material, at least one second electrode structure (14, 15) that is provided in or on the insulation material and is placed at a vertical distance from the first electrode structure, a gas-sensitive layer (16), which borders the first electrode structure (12, 13) and the second electrode structure (14, 15) and a heating conductor structure (7) that is located in the insulation material (4, 6, 8, 10).
摘要翻译：本发明涉及一种用于测量气体浓度的传感器组件，特别是CO，H 2 O，NO x和/或烃。本发明的目的是允许通过相对简单的手段进行精确的测量，特别是以低成本。为了实现这一点，传感器组件设置有施加到基板（2）并且包括一个或多个绝缘层（4,6,8,10），至少一个第一电极结构（12,13）的绝缘材料，设置在所述绝缘材料中或绝缘材料上的至少一个第二电极结构（14,15），其设置在所述绝缘材料中或绝缘材料上并且与所述第一电极结构垂直距离放置，气敏层（16,15）），其与第一电极结构（12,13）和第二电极结构（14,15）接合，并且位于绝缘材料（4,6,8,10）中的加热导体结构（7）。

44. 发明申请

US20050006235A1 Sensor element 审中-公开
标题翻译：传感器元件
公开(公告)号：US20050006235A1
公开(公告)日：2005-01-13
申请号：US10885196
申请日：2004-07-06
申请人： Matthias Fuertsch , Heribert Weber , Christoph Schelling
发明人： Matthias Fuertsch , Heribert Weber , Christoph Schelling
IPC分类号： G01P5/12 , G01F1/684 , G01F1/692 , G01F1/696 , G01N27/26 , G01P15/00 , H05B1/02
CPC分类号： G01P15/008 , G01F1/684 , G01F1/6845 , G01F1/696
摘要： A sensor element has at least one heater structure, at least one first circuit trace being provided via which current is injected into the heater structure; at least one second circuit trace being provided via which the current is coupled out of the heater structure, and an arrangement for detecting the resistances of individual sections of the heater structure. According to the present invention, the arrangement for detecting the resistances includes additional, high-resistance measuring lines by which the voltage is tapped directly at the individual segments of the heater structure.
摘要翻译：传感器元件具有至少一个加热器结构，提供至少一个第一电路迹线，电流被注入到加热器结构中; 提供至少一个第二电路迹线，电流被耦合到加热器结构之外，以及用于检测加热器结构的各个部分的电阻的装置。根据本发明，用于检测电阻的装置包括附加的高电阻测量线，通过该测量线直接在加热器结构的各个部分上被窃听。

45. 发明授权

US5109890A Loom sley drive 失效
标题翻译： LOOM SLEY DRIVE
公开(公告)号：US5109890A
公开(公告)日：1992-05-05
申请号：US667958
申请日：1991-03-12
申请人： Angelo Stacher , Heribert Weber
发明人： Angelo Stacher , Heribert Weber
IPC分类号： D03D49/60
CPC分类号： D03D49/60 , Y10T74/20582
摘要： A sley drive for a loom has a shaft which is eccentric to an axis of rotation in order to provide partial weight balancing for the pivoting movement of the sley. Sley levers are mounted on the sley shaft with each having a clip-shaped part for clamping about the shaft by a screw which passes through legs of the sley levers on the side of the reed relative to the axis of the rotation. Intermediate bearings may also be secured to the sley shaft in the same manner as the sley levers.
摘要翻译：用于织机的筘座具有对旋转轴线偏心的轴，以便为筘座的枢转运动提供部分重量平衡。筘座安装在筘座轴上，每个都具有夹形部分，用于通过相对于旋转轴线穿过筘座侧面的筘座的腿部的螺钉来围绕轴夹紧。中间轴承也可以与筘座相同的方式固定到筘座轴上。

46. 发明授权

US09593011B2 Micromechanical component and method for producing a micromechanical component 有权
标题翻译：微机械部件及其制造方法
公开(公告)号：US09593011B2
公开(公告)日：2017-03-14
申请号：US13318435
申请日：2010-04-07
申请人： Julian Gonska , Heribert Weber
发明人： Julian Gonska , Heribert Weber
IPC分类号： B81B1/00 , B81C1/00 , B81B7/00
CPC分类号： B81C1/00269 , B81B7/0029 , B81C2203/0118 , B81C2203/019 , B81C2203/035 , Y10T428/24802
摘要： A method is described for producing a micromechanical component. The method includes providing a first substrate, providing a second substrate, developing a projecting patterned element on the second substrate, and connecting the first and the second substrate via the projecting patterned element. The method provides that the connecting of the first and the second substrate includes eutectic bonding. Also described is a micromechanical component, in which a first and a second substrate are connected to each other.
摘要翻译：描述了用于制造微机械部件的方法。该方法包括提供第一衬底，提供第二衬底，在第二衬底上显影突出的图案化元件，以及经由突出图案化元件连接第一和第二衬底。该方法提供了第一和第二基板的连接包括共晶接合。还描述了一种微机械部件，其中第一和第二基板彼此连接。

47. 发明申请

US20140117472A1 MICROMECHANICAL COMPONENT 有权
标题翻译：微生物组分
公开(公告)号：US20140117472A1
公开(公告)日：2014-05-01
申请号：US14061887
申请日：2013-10-24
申请人： Julian Gonska , Jochen Reinmuth , Kathrin Gutsche , Jens Frey , Heribert Weber
发明人： Julian Gonska , Jochen Reinmuth , Kathrin Gutsche , Jens Frey , Heribert Weber
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C2203/0118 , B81C2203/035
摘要： A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.
摘要翻译：微机械部件包括第一传感器所在的第一空间和第二传感器所在的第二空间，在第一和第二空间中存在不同的压力，两个空间中的一个通过第三空间延伸到第一格子结构位于组件的边缘区域中，并且基本上被气密地密封。

48. 发明授权

US08530260B2 Method for attaching a first carrier device to a second carrier device and micromechanical components 有权
标题翻译：用于将第一载体装置附接到第二载体装置和微机械部件的方法
公开(公告)号：US08530260B2
公开(公告)日：2013-09-10
申请号：US12798868
申请日：2010-04-12
申请人： Julian Gonska , Axel Grosse , Heribert Weber , Ralf Hausner
发明人： Julian Gonska , Axel Grosse , Heribert Weber , Ralf Hausner
IPC分类号： H01L29/84
CPC分类号： B81C3/001 , B81C2203/019
摘要： A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.
摘要翻译：用于将第一载体装置附接到第二载体装置的方法包括在第一载体装置的第一外部上形成至少一个第一接合层和/或焊料层，部分表面由至少一个第一接合层和 /或焊料层，并且将第一载体装置放置在第二载体装置上，并将第一载体装置固定地接合或焊接到第二载体装置。所述至少一个第一接合层和/或焊料层包括大于第一接触区域的第一覆盖区域。

49. 发明授权

US08485041B2 Sensor system, method for operating a sensor system, and method for manufacturing a sensor system 有权
标题翻译：传感器系统，用于操作传感器系统的方法以及用于制造传感器系统的方法
公开(公告)号：US08485041B2
公开(公告)日：2013-07-16
申请号：US12737966
申请日：2009-07-10
申请人： Marcus Ahles , Hubert Benzel , Heribert Weber
发明人： Marcus Ahles , Hubert Benzel , Heribert Weber
IPC分类号： G01L7/00 , H01L29/84
CPC分类号： G01L9/0045 , G01L13/025
摘要： A sensor system, e.g., a pressure sensor system, includes a substrate having at least one trench on a first side. The trench is provided for forming a first diaphragm region on a second side opposite from the first side. In addition, a second diaphragm region and a cavern are integrated into the material of the first diaphragm region.
摘要翻译：传感器系统，例如压力传感器系统，包括在第一侧具有至少一个沟槽的衬底。沟槽被设置用于在与第一侧相对的第二侧上形成第一膜片区域。此外，第二隔膜区域和洞穴被整合到第一隔膜区域的材料中。

50. 发明申请

US20130161820A1 METHOD FOR BONDING TWO SILICON SUBSTRATES, AND A CORRESPONDEING SYSTEM OF TWO SILICON SUBSTRATES 有权
标题翻译：用于结合两个硅基板的方法以及两个硅基板的相关系统
公开(公告)号：US20130161820A1
公开(公告)日：2013-06-27
申请号：US13719799
申请日：2012-12-19
申请人： Julian GONSKA , Heribert Weber , Jens Frey , Timo Schary , Thomas Mayer
发明人： Julian GONSKA , Heribert Weber , Jens Frey , Timo Schary , Thomas Mayer
IPC分类号： H01L21/50 , H01L23/488
CPC分类号： H01L21/50 , B81B2201/0235 , B81B2201/0264 , B81C1/00269 , B81C2203/0118 , B81C2203/035 , H01L21/185 , H01L21/187 , H01L23/488 , H01L24/94 , H01L2224/83805 , H01L2924/0132 , H01L2924/01322 , H01L2924/10253 , H01L2924/16251 , H01L2924/01013 , H01L2924/01032 , H01L2924/00
摘要： A method for bonding two silicon substrates and a corresponding system of two silicon substrates. The method includes: providing first and second silicon substrates; depositing a first bonding layer of pure aluminum or of aluminum-copper having a copper component between 0.1 and 5% on a first bonding surface of the first silicon substrate; depositing a second bonding layer of germanium above the first bonding surface or above a second bonding surface of the second silicon substrate; subsequently joining the first and second silicon substrates, so that the first and the second bonding surfaces lie opposite each other; and implementing a thermal treatment step to form an eutectic bonding layer of aluminum-germanium or containing aluminum-germanium as the main component, between the first silicon substrate and the second silicon substrate, spikes which contain aluminum as a minimum and extend into the first silicon substrate, forming at least on the first bonding surface.
摘要翻译：一种用于接合两个硅衬底和两个硅衬底的对应系统的方法。该方法包括：提供第一和第二硅衬底; 在第一硅衬底的第一接合表面上沉积具有0.1至5％铜含量的纯铝或铝 - 铜的第一接合层; 在所述第一接合表面上方或第二硅衬底的第二接合表面上方沉积锗的第二接合层; 随后接合第一和第二硅衬底，使得第一和第二接合表面彼此相对; 并且在第一硅衬底和第二硅衬底之间实现热处理步骤以形成铝锗或含有铝 - 锗的共晶结合层作为主要组分，最小含有铝并延伸到第一硅中的尖峰衬底，至少形成在第一结合表面上。

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