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    • 41. 发明授权
    • Method of pitch halving
    • 节距减法的方法
    • US07989355B2
    • 2011-08-02
    • US12370152
    • 2009-02-12
    • Ming-Feng ShiehShinn-Sheng YuAnthony YenMing-Ching ChangJeff J. Xu
    • Ming-Feng ShiehShinn-Sheng YuAnthony YenMing-Ching ChangJeff J. Xu
    • H01L21/302H01L21/461
    • H01L21/3086H01L21/3088H01L21/823828H01L21/823871Y10S438/947
    • The present disclosure provides a method of fabricating a semiconductor device that includes forming a mask layer over a substrate, forming a dummy layer having a first dummy feature and a second dummy feature over the mask layer, forming first and second spacer roofs to cover a top portion of the first and second dummy features, respectively, and forming first and second spacer sleeves to encircle side portions of the first and second dummy features, respectively, removing the first spacer roof and the first dummy feature while protecting the second dummy feature, removing a first end portion and a second end portion of the first spacer sleeve to form spacer fins, and patterning the mask layer using the spacer fins as a first mask element and the second dummy feature as a second mask element.
    • 本公开提供了一种制造半导体器件的方法,该半导体器件包括在衬底上形成掩模层,在掩模层上形成具有第一虚拟特征和第二虚拟特征的虚设层,形成第一和第二间隔物顶部以覆盖顶部 分别形成第一和第二间隔套筒以分别围绕第一和第二虚拟特征的侧面部分,去除第一间隔物顶部和第一虚拟特征,同时保护第二虚拟特征,去除 第一间隔套筒的第一端部和第二端部,以形成间隔件翅片,并且使用间隔件翅片作为第一掩模元件并将第二虚拟特征图案化为掩模层作为第二掩模元件。
    • 43. 发明授权
    • Attenuated rim phase shift mask
    • 衰减边缘相移掩模
    • US06593033B1
    • 2003-07-15
    • US09399840
    • 1999-09-21
    • Zhiliu MaAnthony YenCesar Garza
    • Zhiliu MaAnthony YenCesar Garza
    • G03F900
    • G03F1/32G03F1/29
    • An embodiment of the instant invention is a mask having a pattern which is transferred to a layer overlying a semiconductor wafer, the mask comprising: a transmissive portion (structure 102 of FIG. 1), the transmissive portion allowing energy which impinges upon the transmission portion to substantially pass through the transmissive portion; a substantially non-transmissive portion (structure 106 of FIG. 1); a semi-transmissive portion (structure 104 of FIG. 1) situated between the transmissive portion and the substantially non-transmissive portion, energy passing through the semi-transmissive portion having a phase; and wherein the phase of energy which passes through the semi-transmissive portion is out of phase with the phase of energy which passes through the transmissive portion. Preferably, the phase of the energy which passes through the semi-transmissive portion is around 180 degrees out of phase with energy which passes through the transmissive portion.
    • 本发明的实施例是具有转移到覆盖半导体晶片的层的图案的掩模,掩模包括:透射部分(图1的结构102),透射部分允许撞击透射部分的能量 以基本上穿过透射部分; 基本上非透射部分(图1的结构106); 位于透射部分和基本上不透射部分之间的半透射部分(图1的结构104),穿过具有相位的半透射部分的能量; 并且其中穿过半透射部分的能量相位与通过透射部分的能量相位异相。 优选地,通过半透射部分的能量的相位与通过透射部分的能量相差大约180度。
    • 44. 发明授权
    • Removal of line end shortening in microlithography and mask set for removal
    • 在微光刻和掩模组中去除线端缩短以进行去除
    • US06492073B1
    • 2002-12-10
    • US09839926
    • 2001-04-23
    • Burn Jeng LinRu-Gun LiuShih-Ying ChenShinn-Sheng YuHua-Tai LinAnthony YenYao-Ching Ku
    • Burn Jeng LinRu-Gun LiuShih-Ying ChenShinn-Sheng YuHua-Tai LinAnthony YenYao-Ching Ku
    • G03F900
    • G03F1/36G03F1/70G03F7/70433G03F7/70441
    • A mask set of two masks and a method of using these masks in a double exposure to avoid line shortening due to optical proximity effects is described. A pattern having pattern elements comprising a number of line segments, wherein each of the line segments has one or two free ends which are not connected to other mask pattern elements is to be transferred to a layer of resist. A first mask is formed by adding line extensions to each of the free ends of the line segments. A cutting mask is formed comprising rectangles enclosing each of the line extensions wherein one of the sides of said rectangles is coincident with the corresponding free end of said line segment. The first mask has opaque regions corresponding to the extended line segments. The cutting mask has transparent regions corresponding to the cutting pattern. In another embodiment a pattern having pattern openings comprising a number of line segments. In this embodiment the cutting pattern comprises rectangles having the same width as said line segments and add length to the line segments.
    • 描述了两个掩模的掩模组和在双重曝光中使用这些掩模以避免由于光学邻近效应引起的线缩短的方法。 具有包括多个线段的图形元素的图案,其中每个线段具有未连接到其它掩模图案元件的一个或两个自由端将被转移到抗蚀剂层。 通过向线段的每个自由端添加线延伸来形成第一掩模。 形成切割掩模,其包括围绕每个线延伸的矩形,其中所述矩形的一个侧面与所述线段的对应的自由端重合。 第一掩模具有对应于延伸线段的不透明区域。 切割掩模具有对应于切割图案的透明区域。 在另一个实施例中,具有包括多个线段的图案开口的图案。 在该实施例中,切割图案包括具有与所述线段相同宽度的矩形,并且对线段增加长度。
    • 45. 发明授权
    • Extreme ultraviolet lithography mask and multilayer deposition method for fabricating same
    • 极紫外光刻掩模及其制造方法
    • US08828625B2
    • 2014-09-09
    • US13567900
    • 2012-08-06
    • Yen-Cheng LuShinn-Sheng YuAnthony Yen
    • Yen-Cheng LuShinn-Sheng YuAnthony Yen
    • G03F7/16G03F1/24
    • G03F1/24G03F1/52
    • A mask, method of fabricating same, and method of using same are disclosed. In an example, a mask includes a substrate and a reflective multilayer coating deposited over the substrate. The reflective multilayer coating is formed by positioning the substrate such that an angle α is formed between a normal line of the substrate and particles landing on the substrate and rotating the substrate about an axis that is parallel with a landing direction of the particles. In an example, reflective multilayer coating includes a first layer and a second layer deposited over the first layer. A phase defect region of the reflective multilayer coating includes a first deformation in the first layer at a first location, and a second deformation in the second layer at a second location, the second location laterally displaced from the first location.
    • 公开了一种掩模,其制造方法及其使用方法。 在一个示例中,掩模包括沉积在衬底上的衬底和反射多层涂层。 反射多层涂层通过定位基板而形成,使得在基板的法线和着陆在基板上的颗粒之间形成角度α,并使基板围绕与颗粒的着陆方向平行的轴线旋转。 在一个实例中,反射多层涂层包括沉积在第一层上的第一层和第二层。 反射多层涂层的相缺陷区域包括在第一位置处的第一层中的第一变形,以及在第二位置处的第二层中的第二变形,第二位置从第一位置横向移位。
    • 50. 发明授权
    • Defocus-invariant exposure for regular patterns
    • 定焦模式的散焦不变曝光
    • US06991895B1
    • 2006-01-31
    • US10224186
    • 2002-08-20
    • Anthony YenShinn-Sheng Yu
    • Anthony YenShinn-Sheng Yu
    • G03F7/00
    • G03F1/30G03F7/70091G03F7/701
    • For a 2-dimensional periodic array of contact holes or islands, a depth-of-focus-enhancement lithographic scheme based on a combination of alternating phase-shifting mask and off-axis illumination is revealed. The scheme is achieved by choosing appropriate off-axis illumination and smaller numerical aperture such that only two diffraction orders, which are of equal distance from the pupil center, are collected in the first exposure. The image of the 2-dimensional periodic array can be formed by superposing a second exposure on the first. In the second exposure, another appropriate off-axis illumination and smaller numerical aperture is chosen such that another two diffraction orders, which are also of equal distance from the pupil center, are collected.
    • 对于接触孔或岛的2维周期性阵列,揭示了基于交替移相掩模和离轴照明的组合的聚焦深度增强光刻方案。 该方案通过选择适当的离轴照明和较小的数值孔径来实现,使得在第一次曝光中仅收集与瞳孔中心相等距离的两个衍射级。 可以通过在第一曝光上叠加第二曝光来形成二维周期性阵列的图像。 在第二曝光中,选择另一适当的离轴照明和较小的数值孔径,以便收集距离瞳孔中心距离相等的另外两个衍射级。