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41. 发明专利

JP2014012761A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012761A
公开(公告)日：2014-01-23
申请号：JP2012150387
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NOMOTO SHUJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , SAKAI KAZUNAGA , MORITA KOJI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and high adhesiveness and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A prepreg is obtained by immersing, in an organic fiber base material, a thermosetting resin obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule and a thermosetting resin composition containing a compound having at least two or more epoxy groups in one molecule.
摘要翻译：要解决的问题：提供一种表现出低热膨胀和高粘合性的预浸料及其制造方法，以及层压板，覆盖金属箔的层压板和使用该预浸料的布线板。解决方案：预浸料是通过将有机溶剂中的（a）具有羟基的硅氧烷树脂在其末端由下述通式（I）表示的末端与（b）所示的化合物反应得到的热固性树脂，一个分子中的至少两个以上的氰酸酯基和含有一个分子中具有至少两个以上环氧基的化合物的热固性树脂组合物。

42. 发明专利

JP2013080930A Resin composition, prepreg, laminate sheet, and wiring board 有权
标题翻译：树脂组合物，PREPREG，层压板和接线板
公开(公告)号：JP2013080930A
公开(公告)日：2013-05-02
申请号：JP2012233864
申请日：2012-10-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , SAKAI KAZUNAGA , KONDO YUSUKE
IPC分类号： H05K1/03 , B32B27/00 , B32B27/12 , C08G59/22 , C08G59/40 , C08J5/24
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition, prepreg, laminate sheet and wiring board, capable of achieving low thermal expansion at a low cost.SOLUTION: The resin composition, used for manufacture of a laminate sheet, includes insulating resin having an aromatic ring. The molecular mass between crosslinking points of insulating resin, obtained from a shear modulus equal to or higher than Tg of the insulating resin having the aromatic ring, is 300-1,000 in a stage after manufacture of laminate sheet.
摘要翻译：要解决的问题：提供能够以低成本实现低热膨胀的树脂组合物，预浸料，层压片和布线板。解决方案：用于制造层合片的树脂组合物包括具有芳环的绝缘树脂。绝缘树脂的交联点之间的分子质量，由具有芳环的绝缘树脂的Tg以上的剪切模量得到，在层压片的制造阶段之后的分子质量为300〜1000。版权所有（C）2013，JPO＆INPIT

43. 发明专利

JP2002347173A MANUFACTURING METHOD FOR COPPER-CLAD LAMINATED SHEET OF PAPER-BASED PHENOLIC RESIN 失效
公开(公告)号：JP2002347173A
公开(公告)日：2002-12-04
申请号：JP2001157661
申请日：2001-05-25
申请人： HITACHI CHEMICAL CO LTD
发明人： NARABE YOSHIYUKI , SAKAI KAZUNAGA , SATO YOSHINORI
IPC分类号： C08J5/24 , B29C43/18 , B29C43/20 , B29L31/34 , B32B15/08 , B32B15/20 , B32B27/42 , B32B37/10 , H05K1/03 , B32B31/20
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a copper-clad laminated sheet of both-sided paper-based phenolic resin which is low in warp. SOLUTION: In the manufacturing method for the copper-clad laminated sheet of the paper-based phenolic resin wherein a paper-based material is impregnated with phenolic resin varnish and dried to produce prepreg, then both sides of a plurality of prepreg sheets so obtained are superposed by copper foil and formed under heat and pressure, the paper-based material to be used is such one where the ratio of a vertical elastic modulus to a lateral elastic modulus is 1.3 to 1.9, and a square root of a product of the vertical elastic modulus and the lateral elastic modulus is 3.2 to 3.8 kN/mm .

44. 发明专利

JP2002249638A PHENOL RESIN COMPOSITION AND PHENOL RESIN LAMINATED SHEET USING THE SAME 失效
公开(公告)号：JP2002249638A
公开(公告)日：2002-09-06
申请号：JP2001051390
申请日：2001-02-27
申请人： HITACHI CHEMICAL CO LTD
发明人： SATO YOSHINORI , NARABE YOSHIYUKI , SAKAI KAZUNAGA , KUMAKURA YOSHITOSHI
IPC分类号： C08J5/24 , B32B27/42 , C08K5/521 , C08L61/14
摘要： PROBLEM TO BE SOLVED: To prepare a phenol resin laminated sheet which is suitable for applications to printed wiring board, meets 94V0 in the flame retardant standards UL-94 without using a halogenous flame retardant and has good thermostability in soldering, and to obtain a phenol resin composition used to the same. SOLUTION: The phenol resin composition mainly consists of a drying oil- modified resol phenol resin, and is obtained by compounding a phosphate of 20-60 wt.% to solid part of the resin and a novolac phenol resin of 5-30 wt.% to phenols used to the synthesis of the resol phenol resin, when the resin is synthesized.

45. 发明专利

JP2001121566A METHOD FOR MANUFACTURING LAMINATE BOARD AND PRINTED WIRING BOARD 失效
公开(公告)号：JP2001121566A
公开(公告)日：2001-05-08
申请号：JP30750899
申请日：1999-10-28
申请人： HITACHI CHEMICAL CO LTD
发明人： SAKAI KAZUNAGA , NARABE YOSHIYUKI
IPC分类号： H05K1/03 , B29C43/20
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminate board which shows excellent tracking resistance without decreasing punching workability, heat resistance and humidity resistance and to provide a printed wiring board. SOLUTION: A method for manufacturing a laminate board contains a process of heating and pressing a base material impregnated with a thermosetting resin containing a polyfunctional acrylate resin having 2 or more acryloyl or methacryloyl groups in a molecule.

46. 发明专利

JPH0976262A PREPARATION OF PAPER BASE COPPER-CLAD LAMINATE 失效
公开(公告)号：JPH0976262A
公开(公告)日：1997-03-25
申请号：JP23796295
申请日：1995-09-18
申请人： HITACHI CHEMICAL CO LTD
发明人： ISHIHARA HIDEKI , SAKAI KAZUNAGA , AKINAKA NOBORU
IPC分类号： B32B15/08 , B29C43/18 , B29C43/20 , B29K105/20 , B32B27/42 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a paper base copper-clad laminate with excellent migration resistance and resistance to galvanic corrosion. SOLUTION: In a single-sided or a double-sided copper-clad laminate consisting of several sheets of prepregs prepd. by impregnating a paper base with a specified amt. of a resin and a copper foil with an adhesive, a prepreg prepd. by forming a resin layer with a thickness of 5-50/μm on the surface layer of the prepreg to be used is used and a plurality of these sheets are laminated and the copper foil with the adhesive are laminated on the outside and a paper base copper-clad laminate is prepd. by heating and pressing them.

47. 发明专利

JPH07304930A PHENOLIC RESIN COMPOSITION AND PHENOLIC RESIN LAMINATED SHEET 失效
公开(公告)号：JPH07304930A
公开(公告)日：1995-11-21
申请号：JP9828794
申请日：1994-05-12
申请人： HITACHI CHEMICAL CO LTD
发明人： SAKAI KAZUNAGA , NAKAMURA YOSHIHIRO , IKEDA KENICHI , YANO MASABUMI
IPC分类号： C08J5/24 , B32B27/04 , C08L61/04 , C08L61/14 , C08L67/06 , H05K1/03
摘要： PURPOSE:To provide a phenolic resin laminated sheet, using paper as a substrate, having high heat resistance and tracking resistance and, at the same time, high stampability at room temp. and a phenolic resin compsn. for constituting the phenolic resin laminate sheet. CONSTITUTION:An unsatd. polyester resin, particularly an unsatd. polyester resin wherein the glycol component is a glycerol having the beta-hydroxyl group bonded to a higher fatty acid having 6 to 30 carbon atoms through an ester bond and the dibasic acid bonded to the alpha- and gamma-hydroxyl groups of the glycerol is an unsatd. dibasic acid is compounded with a flexibilizer-modified phenolic resin. The phenolic resin is impregnated into a paper substrate, and the impregnated paper substrate is dried to prepare a prepreg, which is then heated under pressure to prepare a laminated sheet.

48. 发明专利

JPH05220741A MANUFACTURE OF PREPREG 失效
公开(公告)号：JPH05220741A
公开(公告)日：1993-08-31
申请号：JP2557192
申请日：1992-02-13
申请人： HITACHI CHEMICAL CO LTD
发明人： YANO MASABUMI , NAKAMURA YOSHIHIRO , SAKAI KAZUNAGA
IPC分类号： B29B11/16 , B29B15/10 , B29K61/04 , B29K105/06 , B29L31/34 , H05K1/03
摘要： PURPOSE:To reduce the splash quantity of phenol in a drying process at the time of manufacturing prepreg by the use of phenol resin varnish blended with polymeric solid phenolic resin. CONSTITUTION:To resol phenolic resin of about 35% tung oil modification quantity, about 20 pts. of polymeric solid phenolic resin (Bellpearl) of 2000 or more and 15000 or less weight average molecular weight is added at solid weight ratio, and then it is adjusted to be about 60% methanol resin for making varnish. After varnish is impregnated and coated on a paper foundation material, it is dried to obtain prepreg. The prepreg and adhesive-coated copper foil are put together, and subsequently subjected to heat, pressurization and lamination for obtaining single-sided copper-clad laminated board. The characteristics as a copper-clad laminated board are equal to those which employ varnish not containing polymeric weight solid phenolic resin therein. Like this, by adding polymeric solid phenol not containing unreacted phenol, since the rate of the unreacted phenol decreases, the splash quantity of phenol is lessened during the coat-drying period.

49. 发明专利

JPH05179106A THERMOSETTING RESIN COMPOSITION AND PRODUCTION OF LAMINATE USING THIS THERMOSETTTNG RESIN COMPOSITION 失效
公开(公告)号：JPH05179106A
公开(公告)日：1993-07-20
申请号：JP1692
申请日：1992-01-06
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKAMURA YOSHIHIRO , YANO MASABUMI , SAKAI KAZUNAGA
IPC分类号： B32B37/00 , B29K86/00 , B29K105/06 , B32B27/04 , C08J5/04 , C08L61/18 , H05K1/03
摘要： PURPOSE:To decrease the escape of a solvent in the drying step of a base material impregnated with a thermosetting resin varnish. CONSTITUTION:A thermosetting resin is dissolved in a toluene resin to prepare a varnish. Usable thermosetting resins include epoxy resins, phenolic resins, melamine resins and unsatd. polyester resins, among which drying-oil-modified phenolic resins are particularly pref. Pieces of a textile base material impregnated with the varnish are laminated on each other and heated under pressure.

50. 发明专利

JP2014012762A Prepreg using organic fiber base material and manufacturing method of the same, and laminated plate, metal foil-clad laminated plate, and wiring board using the prepreg 审中-公开
标题翻译： PREPREG使用有机纤维基材料及其制造方法，以及层压板，金属箔层压板和使用PREPREG的接线板
公开(公告)号：JP2014012762A
公开(公告)日：2014-01-23
申请号：JP2012150388
申请日：2012-07-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： IKEDA YUKI , IZUMI HIROYUKI , ISHIKURA KUMIKO , SAKAI KAZUNAGA , MORITA KOJI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , B32B5/28 , C08G73/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg expressing low thermal expansion and a manufacturing method of the same, and a laminated plate, a metal foil-clad laminated plate, and a wiring board using the prepreg.SOLUTION: A thermosetting resin is obtained by reacting, in an organic solvent, (a) a siloxane resin having hydroxyl groups at its terminals represented by following general formula (I) and (b) a compound having at least two or more cyanate groups in one molecule, and contains 10-70 pts.mass of the siloxane resin (a) and 30-90 pts.mass of the compound (b) based on the sum total 100 pts.mass of the siloxane resin (a) and the compound (b). A prepreg is obtained by immersing, in an organic fiber base material, the thermosetting resin having a reaction rate of the compound (b) of 40-70 mol% and a thermosetting resin composition containing silica. In general formula (I), each Ris independently an alkylene group having 1-5 carbon atoms or an alkyleneoxy group; each Aris independently a single bond, an arylene group, or an alkylene group having 1-5 carbon atoms; and m is an integer of 5-100.
摘要翻译：要解决的问题：提供一种表现出低热膨胀的预浸料及其制造方法，以及层压板，覆盖金属箔的叠层板和使用该预浸料的布线板。溶解性：热固性树脂通过在有机溶剂中，（a）在其末端具有羟基的硅氧烷树脂在下列通式（I）表示的末端和（b）在一分子中具有至少两个以上氰酸酯基的化合物，并含有10-70 硅氧烷树脂（a）的pts.mass和化合物（b）的30-90质量份，基于硅氧烷树脂（a）和化合物（b）的总共100质量份。通过在有机纤维基材中浸渍具有40-70摩尔％的化合物（b）的反应速率的热固性树脂和含有二氧化硅的热固性树脂组合物来获得预浸料。在通式（I）中，各R独立地为具有1-5个碳原子的亚烷基或亚烷基氧基; 每个Aris独立地是单键，亚芳基或具有1-5个碳原子的亚烷基; m为5〜100的整数。

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