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41. 发明授权

US06560090B2 Solid electrolytic capacitor and method of manufacturing same 有权
公开(公告)号：US06560090B2
公开(公告)日：2003-05-06
申请号：US09983024
申请日：2001-10-22
申请人： Yoshitsugu Uenishi , Tsuneshi Nakamura , Minoru Omori , Masashi Kadoya , Yoshihiro Higuchi , Tsuyoshi Yoshino
发明人： Yoshitsugu Uenishi , Tsuneshi Nakamura , Minoru Omori , Masashi Kadoya , Yoshihiro Higuchi , Tsuyoshi Yoshino
IPC分类号： H01G9045
CPC分类号： H01G9/012
摘要： A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.

42. 发明授权

US06400556B1 Solid electrolytic capacitor and method of fabricating the same 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US06400556B1
公开(公告)日：2002-06-04
申请号：US09658666
申请日：2000-09-08
申请人： Yoji Masuda , Tsuyoshi Yoshino
发明人： Yoji Masuda , Tsuyoshi Yoshino
IPC分类号： H01G900
CPC分类号： H01G9/15
摘要： A solid electrolytic capacitor minimized in both equivalent serial resistance (ESR) and equivalent serial inductance (ESI) by eliminating redundant space created by its electrode is presented. The solid electrolytic capacitor includes a capacitor element including mainly of a positive electrode body, having a positive electrode lead embedded therein, and made of any form of a valve metal, such as a net, a sheet, a foil, and modifications thereof with a rough surface; a positive electrode terminal connected to the positive electrode lead; a negative electrode terminal connected to a negative electrode layer; and a housing resin coated by molding. This improves the installation efficiency of the capacitor element, and contributes to the small, thin structure of the solid electrolytic capacitor.
摘要翻译：介绍了通过消除其电极产生的冗余空间，使等效串联电阻（ESR）和等效串联电感（ESI）最小化的固体电解电容器。固体电解电容器包括主要包括正电极体的电容器元件，其具有嵌入其中的正电极引线，并且由任何形式的阀金属制成，例如网，片，箔，及其变型，其具有粗糙的表面; 与正极引线连接的正极端子; 连接到负极层的负极端子; 和通过模制涂覆的外壳树脂。这提高了电容元件的安装效率，有助于固体电解电容器的薄型结构。

43. 发明授权

US06236561B1 Chip type solid electrolytic capacitor and its manufacturing method 失效
标题翻译：片式固体电解电容器及其制造方法
公开(公告)号：US06236561B1
公开(公告)日：2001-05-22
申请号：US09334771
申请日：1999-06-16
申请人： Masakuni Ogino , Masahiro Yabushita , Koji Ueoka , Takashi Iwakiri , Tsuyoshi Yoshino
发明人： Masakuni Ogino , Masahiro Yabushita , Koji Ueoka , Takashi Iwakiri , Tsuyoshi Yoshino
IPC分类号： H01G900
CPC分类号： H01G9/012
摘要： A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.
摘要翻译：本发明的芯片式固体电解电容器具有在与电容器元件连接的阴极引线框上逐步形成的部分。电容器元件的阳极引线被电阻焊接到通过将阳极引线框架的一部分折叠成半部而形成的反向V字形结构的顶部。此外，对于本发明的芯片型固体电解电容器，将阴极和阳极引线框架的一部分暴露在外部，使其与树脂封装的周边齐平，从而各自用作端子。因此，由于端子引起的空间问题已被消除，并且可以使阳极引线短，从而允许增加使用的电容器元件的体积。结果，具有外形尺寸大的芯片型固体电解电容器保持与现有技术的电容器相同。

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