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41. 发明授权

US5948327A Lens injection-compression-molding method 失效
标题翻译：镜头注射压缩成型法
公开(公告)号：US5948327A
公开(公告)日：1999-09-07
申请号：US832656
申请日：1997-04-04
申请人： Kiyohiro Saito , Hiroshi Asami
发明人： Kiyohiro Saito , Hiroshi Asami
IPC分类号： B29C45/46 , B29C45/56 , B29C45/77 , B29D11/00 , B29L11/00
CPC分类号： B29C45/77 , B29C45/561 , B29D11/00413 , Y10S425/808
摘要： In an injection step, actual injection speed V is closed-controlled so that the actual injection speed V becomes equal to first or second preset speed V.sub.1 or V.sub.2 while comparing the actual injection speed V with the first or second preset speed V.sub.1 or V.sub.2 in the section between S.sub.0 and S.sub.1 from the time when injection of molten resin is started up to the time when the molten resin reaches this side of a gate portion 46 or the section between S.sub.1 and S.sub.2 from the time when the molten resin reaches this side of the gate portion 46 up to the time when the molten resin reaches the inside of a cavity 3. The injection speed V is open- controlled to third preset speed V.sub.3 in the section between S.sub.2 and S.sub.3 from the time when the molten resin reaches the inside of the cavity 3 up to the time when injection of the molten resin is completed. Because a high injection speed can be secured and an injection speed change can be decreased, it is possible to decrease the frequency of a feed history appearing on the surface of a molded product.
摘要翻译：在喷射步骤中，实际喷射速度V被闭合控制，使得实际喷射速度V等于第一或第二预定速度V1或V2，同时将实际喷射速度V与第一或第二预设速度V1或V2进行比较从熔融树脂的注入开始到熔融树脂到达浇口部分46的这一侧或从熔融树脂到达这一侧的时候在S1和S2之间的部分时，S0和S1之间的截面浇口部分46直到熔融树脂到达腔体3的内部时。在熔融树脂到达内部的时候，在S2和S3之间的部分中，喷射速度V被打开控制到第三预设速度V3 直到熔融树脂注入完成时的空腔3。由于可以确保高的注射速度并且可以降低注射速度变化，所以可以降低在模制产品的表面上出现的进料历史的频率。

42. 发明授权

US4141001A Monitor display control method and apparatus for data input unit 失效
标题翻译：监控数据输入单元的显示控制方法和装置
公开(公告)号：US4141001A
公开(公告)日：1979-02-20
申请号：US769688
申请日：1977-02-17
申请人： Koichi Suzuki , Kenji Yoichizono , Tsutomu Matsumoto , Hiroshi Asami
发明人： Koichi Suzuki , Kenji Yoichizono , Tsutomu Matsumoto , Hiroshi Asami
IPC分类号： G06F3/02 , G06F3/023 , G06F3/048 , G06F3/147 , G06F3/153 , G06F9/00 , G06F17/21 , G06Q40/00 , G06Q40/02 , G09G3/28 , G06F3/14
CPC分类号： G06Q40/02 , G06F3/0219 , G06F3/04895 , G09G3/28
摘要： A data input unit has a monitor display unit with a display screen and a manual input device such as a keyboard. Plural transaction items for at least one transaction type are displayed selectively on one portion of the display screen. A second portion of the screen provides for display of manually entered data corresponding to each item. When data which corresponds to a predetermined item displayed on the screen of the monitor display unit is supplied as an input by said manual input devices, said input data is displayed initially in a prearranged common display area comprising a third portion of the screen of the monitor display unit. After an operator confirms the accuracy of the displayed data, and actuation of an item select key causes the data displayed on the common display area to be transferred and displayed on the second portion of the screen in a position directly relating that data to its corresponding transaction item.
摘要翻译：数据输入单元具有具有显示屏的监视器显示单元和诸如键盘的手动输入设备。至少一种交易类型的多个交易项目被选择地显示在显示屏幕的一部分上。屏幕的第二部分提供用于显示对应于每个项目的手动输入的数据。当与由监视器显示单元的屏幕显示的预定项目相对应的数据作为所述手动输入装置的输入提供时，所述输入数据最初被显示在包括监视器屏幕的第三部分的预先设置的公共显示区域中显示单元。在操作者确认所显示的数据的准确性之后，并且启动项目选择键使得显示在公共显示区域上的数据被传送并显示在屏幕的第二部分上，直接将该数据与其对应的交易相关联项目。

43. 发明授权

US4065374A Method and apparatus for plating under constant current density 失效
标题翻译：电流密度恒定的电镀方法及装置
公开(公告)号：US4065374A
公开(公告)日：1977-12-27
申请号：US782417
申请日：1977-03-29
申请人： Hiroshi Asami , Masao Kaji
发明人： Hiroshi Asami , Masao Kaji
IPC分类号： C25D5/16 , C25D21/12 , H01L21/288 , H01L21/60 , C25B15/02
CPC分类号： C25D21/12 , Y10S204/07
摘要： In the present plating apparatus the bath contains an electrolyte solution having a uniform ion concentration. A common electrode, a plating electrode and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode. A further, constant, direct current source is connected between the common electrode and the standard electrode. A potentiometer device is arranged for detecting resistance changes between these electrodes due to variations in the ion concentration and in the mobility of the electrolyte solution between the electrodes. A control is responsive to the potentiometer device for regulating the plating current supplied by the direct current source as a function of the potential difference detected by the potentiometer device, whereby a constant plating current density is achieved.
摘要翻译：在本电镀装置中，浴含有具有均匀离子浓度的电解液。浴中配置有公共电极，电镀电极和标准电极。在公共电极和电镀电极之间连接有直流电源。在公共电极和标准电极之间连接另外恒定的直流电源。布置电位器装置，用于检测电极之间的电离变化，这是由于离子浓度的变化和电极间的电解质溶液的迁移率。控制器响应于电位器装置，用于调节由直流电源提供的电镀电流作为由电位计装置检测的电位差的函数，从而实现恒定的电镀电流密度。

44. 发明授权

US08987899B2 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device 有权
标题翻译：电路基板，半导体元件，半导体装置，电路基板的制造方法，半导体元件的制造方法以及半导体装置的制造方法
公开(公告)号：US08987899B2
公开(公告)日：2015-03-24
申请号：US13357046
申请日：2012-01-24
申请人： Hiroshi Asami
发明人： Hiroshi Asami
IPC分类号： H01L23/48 , H01L23/498 , H01L21/48 , H01L21/56 , H01L23/31 , H05K1/11 , H05K3/34 , H05K3/28 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/563 , H01L23/3142 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16237 , H01L2224/73204 , H01L2224/81024 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/8191 , H01L2924/00013 , H01L2924/12042 , H05K1/111 , H05K3/28 , H05K3/3436 , H05K3/3484 , H05K2201/099 , H05K2203/0315 , H05K2203/043 , Y02P70/611 , Y02P70/613 , Y10T29/49155 , H01L2224/11 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00
摘要： A circuit board includes: an electrode portion which has a copper layer, a copper oxide layer formed thereon, and a removal portion formed by partially removing the copper oxide layer so as to partially expose the copper layer from the copper oxide layer; and a solder bump for flip chip mounting formed on the copper layer exposed by the removal portion.
摘要翻译：电路板包括：具有铜层，形成在其上的氧化铜层的电极部分和通过部分去除氧化铜层而形成的去除部分，以从铜氧化物层部分地露出铜层; 以及在由去除部分露出的铜层上形成的用于倒装芯片安装的焊料凸块。

45. 发明授权

US08684523B2 Spectacle lens, spectacle lens design method, and design apparatus 有权
标题翻译：眼镜镜片，眼镜镜片设计方法及设计装置
公开(公告)号：US08684523B2
公开(公告)日：2014-04-01
申请号：US13452511
申请日：2012-04-20
申请人： Osamu Wada , Tadashi Kaga , Hiroshi Asami
发明人： Osamu Wada , Tadashi Kaga , Hiroshi Asami
IPC分类号： G02C7/02
CPC分类号： G02C7/024
摘要： A spectacle lens includes a first region which is located in at least part of a portion of a lens where a pivotal angle of an eyeball of a wearer ranges from 20 to 60 degrees and in which correcting astigmatism has priority over correcting average power based on prescribed power, and a second region which is formed inside the first region and in which correcting the average power has priority over correcting the astigmatism.
摘要翻译：眼镜透镜包括第一区域，其位于透镜的至少一部分中，其中佩戴者的眼球的枢转角度在20度至60度之间，其中校正像散优先于基于规定的平均功率的校正平均功率功率，以及第二区域，其形成在第一区域内，并且校正平均功率优先于校正散光。

46. 发明申请

US20110193223A1 SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE 审中-公开
标题翻译：半导体器件，芯片安装结构，制造半导体器件的方法，以及形成芯片安装结构的方法
公开(公告)号：US20110193223A1
公开(公告)日：2011-08-11
申请号：US13018723
申请日：2011-02-01
申请人： Hiroshi Ozaki , Hiroshi Asami
发明人： Hiroshi Ozaki , Hiroshi Asami
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L25/0657 , H01L23/3114 , H01L24/05 , H01L24/11 , H01L24/13 , H01L25/50 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05562 , H01L2224/05647 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11849 , H01L2224/11912 , H01L2224/13023 , H01L2224/131 , H01L2224/13111 , H01L2224/81097 , H01L2225/06513 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/014 , H01L2924/3841 , H01L2924/00014 , H01L2924/01014 , H01L2224/05552
摘要： A semiconductor device includes: a semiconductor chip having a semiconductor substrate; a pad electrode formed on the semiconductor substrate; a base metal layer formed on said pad electrode; and a bump electrode formed on the base metal layer, in which an exposed surface including a side surface of the base metal layer is covered with the solder bump electrode.
摘要翻译：半导体器件包括：具有半导体衬底的半导体芯片; 形成在所述半导体基板上的焊盘电极; 形成在所述焊盘电极上的贱金属层; 以及形成在所述基底金属层上的凸起电极，其中包括所述基底金属层的侧表面的暴露表面被所述焊料凸块电极覆盖。

47. 发明授权

US07691672B2 Substrate treating method and method of manufacturing semiconductor apparatus 有权
标题翻译：基板处理方法及制造半导体装置的方法
公开(公告)号：US07691672B2
公开(公告)日：2010-04-06
申请号：US11799023
申请日：2007-04-30
申请人： Masaki Hatano , Hiroshi Asami
发明人： Masaki Hatano , Hiroshi Asami
IPC分类号： H01L21/00
CPC分类号： H01L21/76898 , H01L21/6835 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68345 , H01L2224/04105 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06582 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/181 , H01L2924/18161 , H01L2924/19043 , H01L2924/3511 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention provides a substrate treating method including the steps of joining a one-side surface of a substrate to be treated to a support substrate, treating the substrate to be treated in the condition where the substrate to be treated is supported by the support substrate, and removing the support substrate from the substrate to be treated. The step of joining the substrate to be treated to the support substrate includes melting a joint bump formed on the substrate to be treated so as to join the substrate to be treated to the support substrate, and the step of removing the support substrate from the substrate to be treated includes polishing the support substrate so as to remove the support substrate.
摘要翻译：本发明提供了一种基板处理方法，包括以下步骤：将待处理基板的单面表面连接到支撑基板上，在被处理基板被支撑基板支撑的状态下处理待处理基板从待处理的基板上除去支撑基板。将待处理基板接合到支撑基板的步骤包括熔化形成在待处理基板上的接合凸起，以将待处理的基板接合到支撑基板，以及从基板移除支撑基板的步骤待处理包括抛光支撑基板以移除支撑基板。

48. 发明申请

US20070102191A1 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate 失效
标题翻译：多层布线基板的制造方法以及多层布线基板
公开(公告)号：US20070102191A1
公开(公告)日：2007-05-10
申请号：US11644143
申请日：2006-12-22
申请人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
发明人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
IPC分类号： H05K1/11
CPC分类号： H05K3/4694 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2924/0002 , H01L2924/09701 , H05K3/0023 , H05K3/205 , H05K3/4617 , H05K3/4623 , H05K2201/0195 , H05K2201/09536 , H05K2201/09881 , H05K2201/09972 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
摘要翻译：本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且多层布线基板。形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。在第二布线基板的层叠之后，最后蚀刻并去除支撑片。第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

49. 发明申请

US20070057022A1 Component mounting method and component-mounted body 审中-公开
标题翻译：组件安装方法和组件安装体
公开(公告)号：US20070057022A1
公开(公告)日：2007-03-15
申请号：US11499358
申请日：2006-08-04
申请人： Keiichi Mogami , Hiroshi Asami
发明人： Keiichi Mogami , Hiroshi Asami
IPC分类号： A47J36/02
CPC分类号： H05K3/3436 , H01G2/065 , H01L21/563 , H01L23/498 , H01L23/49811 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L2224/03505 , H01L2224/0401 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81011 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83856 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15313 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H05K1/111 , H05K3/3489 , H05K3/4007 , H05K2201/0367 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2224/1134
摘要： A component mounting method configured to mount on a wiring board a surface-mount electronic component that has an electrode terminal on a bonding surface, the method including the steps of preparing the electronic component having a solder layer that covers the electrode terminal, and a resin layer that is provided on the solder layer and has a flux function preparing the wiring board having a projection conductor that is formed on a mounting surface and is to be bonded to the electrode terminal and mounting the electronic component on the wiring board, and implementing reflow of the solder layer so that the projection conductor penetrates the resin layer.
摘要翻译：一种部件安装方法，其被配置为在接线板上安装在接合面上具有电极端子的表面安装电子部件，所述方法包括准备具有覆盖所述电极端子的焊料层的电子部件和树脂层，其具有制备布线基板的通量函数，该布线基板具有形成在安装面上并与电极端子接合并将电子部件安装在布线基板上的突起导体，并实现回流焊的焊料层，使得突起导体穿过树脂层。

50. 发明授权

US6156242A Method of injection molding plastic lens 有权
标题翻译：注塑塑料镜片的方法
公开(公告)号：US6156242A
公开(公告)日：2000-12-05
申请号：US284444
申请日：1999-04-14
申请人： Kiyohiro Saito , Hiroshi Asami
发明人： Kiyohiro Saito , Hiroshi Asami
IPC分类号： B29C33/04 , B29C45/56 , B29C45/73 , B29C45/77 , B29C45/78 , B29D11/00 , B29L11/00
CPC分类号： B29C33/048 , B29C45/561 , B29C45/73 , B29D11/00009 , B29D11/00413 , B29C2045/7343 , B29C33/046 , B29C45/7337 , B29L2011/0016
摘要： A cavity 22 in an injection molding assembly includes a lower mold insert 21 for shaping a lens convex surface and an upper mold insert 20 for shaping a lens concave surface. When the heated injection molding assembly is cooled and a lens is ejected after a molten resin is pressurized by the upper mold insert 20, the temperature of the lower mold insert 21 is lowered below the temperature of the upper mold insert 20, which prevents the molded lens from bending at a central portion and enable high transfer precision of insert shapes.
摘要翻译： PCT No.PCT / JP97 / 00874 Sec。 371 1999年4月14日第 102（e）1999年4月14日PCT 1998年3月18日PCT PCT。出版物WO98 / 41379 日期1998年9月24日注射成型组件中的空腔22包括用于成形透镜凸面的下模插入件21和用于成形透镜凹面的上模插入件20。当加热的注塑组件被冷却并且在熔融树脂被上模插件20加压之后喷射透镜时，下模插件21的温度降低到上模插件20的温度以下，这防止了模制透镜在中心部分弯曲并且能够实现插入物形状的高转印精度。

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