专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明申请

US20050062653A1 MEMS fabrication on a laminated substrate 有权
标题翻译：层压基板上的MEMS制造
公开(公告)号：US20050062653A1
公开(公告)日：2005-03-24
申请号：US10751131
申请日：2003-12-31
申请人： Bedri Cetiner , Mark Bachman , Guann-Pyng Li , Jiangyuan Qian , Hung-Pin Chang , Franco De Flaviis
发明人： Bedri Cetiner , Mark Bachman , Guann-Pyng Li , Jiangyuan Qian , Hung-Pin Chang , Franco De Flaviis
IPC分类号： H01Q1/38 , H01Q1/26
CPC分类号： H01Q1/38
摘要： Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
摘要翻译：提供了有助于在层压基板上形成微机械结构和相关系统的系统和方法。更具体地，提供了微机械装置和三维多频天线，其中微机械装置和天线以及附加部件可以在同一叠层基板上同时制造在一起。该制造方法包括一种低温沉积工艺，其允许在低于层合基板的最大工作温度的温度下沉积绝缘体材料，以及允许将聚合物层模制和平坦化的平坦化工艺，形式用于微机械装置。

42. 发明授权

US09443821B2 Pb-free solder bumps with improved mechanical properties 有权
标题翻译：无铅焊料凸块具有改善的机械性能
公开(公告)号：US09443821B2
公开(公告)日：2016-09-13
申请号：US14294932
申请日：2014-06-03
申请人： Mark Bachman , John W. Osenbach
发明人： Mark Bachman , John W. Osenbach
IPC分类号： H01L21/44 , H01L23/00
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/05155 , H01L2224/05572 , H01L2224/05573 , H01L2224/0558 , H01L2224/056 , H01L2224/13099 , H01L2224/131 , H01L2224/81193 , H01L2224/81801 , H01L2924/0001 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A method of forming an electronic device, comprising providing a semiconductor substrate having a first contact and an undoped electroplated lead-free solder bump formed on the first contact. The method also comprises providing a device package substrate having a second contact and a doped lead-free solder layer on the second contact comprising a fourth row transition metal dopant. The method further comprises melting the solder bump and the solder layer while the solder layer and the solder bump are in contact, thereby forming a doped solder bump consisting essentially of Sn, one or both of Ag and Cu, and the fourth row transition metal dopant.
摘要翻译：一种形成电子器件的方法，包括提供形成在第一触点上的具有第一接触和未掺杂电镀的无铅焊料凸块的半导体衬底。该方法还包括提供具有第二接触的器件封装衬底和在包括第四行过渡金属掺杂剂的第二接触上的掺杂的无铅焊料层。该方法还包括在焊料层和焊料凸块接触的同时熔化焊料凸块和焊料层，由此形成基本上由Sn组成的掺杂焊料凸块，其中Ag和Cu中的一个或两个，以及第四行过渡金属掺杂剂。

43. 发明申请

US20140125458A1 MEMS Sensor Enabled RFID System and Method for Operating the Same 审中-公开
标题翻译：使用MEMS传感器的RFID系统及其操作方法
公开(公告)号：US20140125458A1
公开(公告)日：2014-05-08
申请号：US14064027
申请日：2013-10-25
申请人： Mark Bachman , Yang Zhang , Scott McLaughlin
发明人： Mark Bachman , Yang Zhang , Scott McLaughlin
IPC分类号： G06K19/07
CPC分类号： G06K19/0702 , G06K19/0717 , G06K19/07749
摘要： A method for providing environmental monitoring of an item with an electronic system includes the steps of operating the electronic system in a deep-sleep mode at a minimal level of power consumption by disabling operation of nonessential portions of the electronic system; activating the electronic system at a monitoring rate to sense an environmental parameter to which the item is subjected; sensing a value of the environmental parameter to which the item is subjected; comparing the sensed environmental parameter with the value of the environmental parameter just previously sensed to derive a rate of change of the environmental parameter; adjusting the monitoring rate to track the rate of change of the environmental parameter; storing the value of the sensed environmental parameter; and returning the electronic system to the deep-sleep mode.
摘要翻译：一种用电子系统对物品进行环境监测的方法包括以下步骤：通过禁止电子系统的非必要部分的操作，以最小的功耗级别以深度睡眠模式操作电子系统; 以监测速率激活电子系统以感测物品遭受的环境参数; 感测物品受到的环境参数的值; 将感测到的环境参数与刚刚感测到的环境参数的值进行比较以导出环境参数的变化率; 调整监测率跟踪环境参数变化率; 存储感测到的环境参数的值; 并将电子系统返回到深度睡眠模式。

44. 发明申请

US20110223545A1 USE OF PHOTOSENSITIZED EPON EPOXY RESIN 1002F FOR MEMS AND BIOMEMS APPLICATIONS 有权
标题翻译：光敏环氧树脂1002F用于MEMS和生物物质的应用
公开(公告)号：US20110223545A1
公开(公告)日：2011-09-15
申请号：US12670349
申请日：2008-07-25
申请人： Jeng-Hao Pai , Yuli Wang , Christopher E. Sims , Mark Bachman
发明人： Jeng-Hao Pai , Yuli Wang , Christopher E. Sims , Mark Bachman
IPC分类号： G03F7/20
CPC分类号： G03F7/40 , B01L3/502707 , G03F1/50 , G03F7/0037 , G03F7/038 , G03F7/095
摘要： Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.
摘要翻译：针对使用1002F构建微型设备和生物医学设备的系统和方法。通过添加光敏剂，Epon环氧树脂1002F可以在UV光的存在下连接，使其可用作光致抗蚀剂或作为微图案化的结构材料。一个实施方案包括将1002F单体树脂与溶剂和光引发剂组合，将单体溶液置于表面上，通过掩模将单体溶液暴露于UV光以引发连接，并将未连接的聚合物剥离。在另一个实施方案中，使用两层或更多层敏化单体膜来构建3-D结构，每层具有不同的光敏感性，以及使用含有不透明区域和半不透明区域的掩模。

45. 发明申请

US20110163850A1 MEMS Sensor Enabled RFID System and Method for Operating the Same 有权
标题翻译：使用MEMS传感器的RFID系统及其操作方法
公开(公告)号：US20110163850A1
公开(公告)日：2011-07-07
申请号：US12984451
申请日：2011-01-04
申请人： Mark Bachman , Yang Zhang , Scott McLaughlin
发明人： Mark Bachman , Yang Zhang , Scott McLaughlin
IPC分类号： G06K7/01
CPC分类号： G06K19/0702 , G06K19/0717 , G06K19/07749
摘要： An apparatus provides environmental monitoring of an item and includes an RFID tag, and a passive switch for sensing an environmental parameter to which the item is subjected, and coupled to the RFID tag so that a measurement of the sensed environmental parameter can be stored, the RFID tag for providing remote readout of the sensed environmental parameter. A method provides environmental monitoring of an item and includes the steps of sensing an environmental parameter to which the item is subjected with activation of a passive switch, storing a measurement of the sensed environmental parameter upon the event of activation of the passive switch, and providing remote readout of the measurement of the sensed environmental parameter with an RFID tag.
摘要翻译：一种装置提供物品的环境监测，并且包括RFID标签和用于感测物品受到的环境参数的无源开关，并耦合到RFID标签，以便可以存储感测的环境参数的测量值， RFID标签用于提供所感测的环境参数的远程读出。一种方法提供对物品的环境监测，并且包括以下步骤：通过激活无源开关来感测物品遭受的环境参数，在被动开关的激活事件存储感测到的环境参数的测量值，并且提供使用RFID标签远程读出感测到的环境参数的测量值。

46. 发明申请

US20070063352A1 ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER 有权
标题翻译：用于替代互连层的BOND PAD路由器
公开(公告)号：US20070063352A1
公开(公告)日：2007-03-22
申请号：US11469960
申请日：2006-09-05
申请人： Vance Archer , Michael Ayukawa , Mark Bachman , Daniel Chesire , Seung Kang , Taeho Kook , Sailesh Merchant , Kurt Steiner
发明人： Vance Archer , Michael Ayukawa , Mark Bachman , Daniel Chesire , Seung Kang , Taeho Kook , Sailesh Merchant , Kurt Steiner
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05556 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/13007 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/0001 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2224/05552 , H01L2924/013
摘要： The present invention provides a solder bump structure. In one aspect, the solder bump structure is utilized in a semiconductor device, such as an integrated circuit. The semiconductor device comprises active devices located over a semiconductor substrate, interconnect layers comprising copper formed over the active devices, and an outermost metallization layer positioned over the interconnect layers. The outermost metallization layer comprises aluminum and includes at least one bond pad and at least one interconnect runner each electrically connected to an interconnect layer. An under bump metallization layer (UBM) is located over the bond pad, and a solder bump is located over the UBM.
摘要翻译：本发明提供一种焊料凸块结构。在一个方面，焊料凸块结构用于诸如集成电路的半导体器件中。半导体器件包括位于半导体衬底之上的有源器件，包括形成在有源器件上的铜的互连层以及位于互连层上的最外层金属化层。最外面的金属化层包括铝，并且包括至少一个接合焊盘和至少一个互连转子，每一个电连接到互连层。凹凸金属化层（UBM）位于接合焊盘上方，焊料凸块位于UBM上方。

47. 发明申请

US20050067709A1 Methods and system for reinforcing a bond pad 有权
标题翻译：用于加固粘结垫的方法和系统
公开(公告)号：US20050067709A1
公开(公告)日：2005-03-31
申请号：US10675260
申请日：2003-09-30
申请人： Mark Bachman , Daniel Chesire , Sailesh Merchant , John Osenbach , Kurt Steiner
发明人： Mark Bachman , Daniel Chesire , Sailesh Merchant , John Osenbach , Kurt Steiner
IPC分类号： H01L21/60 , H01L23/00 , H01L23/485 , H01L23/48
CPC分类号： H01L24/05 , H01L21/768 , H01L23/562 , H01L24/03 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05082 , H01L2224/05093 , H01L2224/05558 , H01L2224/05567 , H01L2224/05624 , H01L2224/05647 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2224/05552
摘要： Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.
摘要翻译：本文公开了一种用于加强集成电路的接触焊盘的增强系统和方法。具体示出的是包括插入在顶部接触垫层和下面的金属层之间的加强结构的系统和方法。

48. 发明授权

US08885860B2 Direct drive micro hearing device 有权
标题翻译：直接驱动微型听力装置
公开(公告)号：US08885860B2
公开(公告)日：2014-11-11
申请号：US13487597
申请日：2012-06-04
申请人： Hamid R. Djalilian , Mark Bachman , Mark Merlo , Peyton Paulick
发明人： Hamid R. Djalilian , Mark Bachman , Mark Merlo , Peyton Paulick
IPC分类号： H04R25/00
CPC分类号： H04R5/00 , H04R1/1058 , H04R3/00 , H04R25/00 , H04R25/407 , H04R25/453 , H04R25/456 , H04R25/554 , H04R25/606 , H04R25/652 , H04R25/658 , H04R2225/025 , H04R2225/31 , H04R2225/61 , H04R2430/21 , H04R2460/17
摘要： A device and methods are provided for a hearing device. In one embodiment, a hearing device includes a microphone to receive sound, an interactive tip and actuator. The actuator can include an actuator element and preload force element to place the interactive tip in contact with a portion of an ear. The hearing device includes circuitry coupled to the microphone and actuator, the circuitry configured to process sound received by the microphone and drive the actuator based on processed sound, wherein the actuator drives the interactive tip relative to a portion of the ear based on one or more signals received from the circuitry.
摘要翻译：为听力装置提供了一种装置和方法。在一个实施例中，听力设备包括用于接收声音的麦克风，交互式尖端和致动器。致动器可以包括致动器元件和预加载力元件，以将交互式尖端放置成与耳朵的一部分接触。听力装置包括耦合到麦克风和致动器的电路，该电路经配置以处理由麦克风接收的声音并基于经处理的声音来驱动致动器，其中致动器基于一个或多个相对于耳朵的一部分驱动交互式尖端从电路接收的信号。

49. 发明授权

US08618914B2 MEMS sensor enabled RFID system and method for operating the same 有权
标题翻译：使用MEMS传感器的RFID系统及其操作方法
公开(公告)号：US08618914B2
公开(公告)日：2013-12-31
申请号：US12984451
申请日：2011-01-04
申请人： Mark Bachman , Yang Zhang , Scott McLaughlin
发明人： Mark Bachman , Yang Zhang , Scott McLaughlin
IPC分类号： H04Q5/22 , G08B17/00 , G08B21/00 , H01C7/00 , G08B13/14
CPC分类号： G06K19/0702 , G06K19/0717 , G06K19/07749
摘要： An apparatus provides environmental monitoring of an item and includes an RFID tag, and a passive switch for sensing an environmental parameter to which the item is subjected, and coupled to the RFID tag so that a measurement of the sensed environmental parameter can be stored, the RFID tag for providing remote readout of the sensed environmental parameter. A method provides environmental monitoring of an item and includes the steps of sensing an environmental parameter to which the item is subjected with activation of a passive switch, storing a measurement of the sensed environmental parameter upon the event of activation of the passive switch, and providing remote readout of the measurement of the sensed environmental parameter with an RFID tag.
摘要翻译：一种装置提供物品的环境监测，并且包括RFID标签和用于感测物品受到的环境参数的无源开关，并耦合到RFID标签，以便可以存储感测的环境参数的测量值， RFID标签用于提供所感测的环境参数的远程读出。一种方法提供对物品的环境监测，并且包括以下步骤：通过激活无源开关来感测物品遭受的环境参数，在被动开关的激活事件存储感测到的环境参数的测量值，并且提供使用RFID标签远程读出感测到的环境参数的测量值。

50. 发明申请

US20130179240A1 METHOD AND SYSTEM FOR SPONSORED ON-LINE FUNDRAISING 审中-公开
标题翻译：支持在线资金的方法和系统
公开(公告)号：US20130179240A1
公开(公告)日：2013-07-11
申请号：US13346005
申请日：2012-01-09
申请人： Nicholas J.W. Lee , Steve Croth , Mark Bachman
发明人： Nicholas J.W. Lee , Steve Croth , Mark Bachman
IPC分类号： G06Q30/02
CPC分类号： G06Q30/0241 , G06Q30/0279
摘要： A method and system for sponsored online fundraising in relation to an offer for purchase provided by a retailer, the fundraising campaign, the fundraising service and the retailer having respective account balances. The method comprises matching retailer offers against the fundraising campaign specifying a plurality of campaign criteria; generating a plurality of offers for purchase from among the retailer offers; selecting at least one offer for purchase from among the generated offers for purchase; publishing a fundraising campaign promoting the at least one offer; selecting and purchasing the offer promoted by the fundraising campaign; generating a voucher specifying the monetary value of the purchased offer; redeeming the voucher via a purchase transaction with the retailer, and allocating, from at least a portion of the monetary value, a first payment to the fundraising campaign account balance and a second payment to the fundraising service account balance.
摘要翻译：关于由零售商，筹款活动，筹款服务和具有各自帐户余额的零售商提供的购买报价的赞助在线筹款的方法和系统。该方法包括将零售商优惠与指定多个活动标准的筹款活动相匹配; 从零售商提供多个要购买的报价; 从生成的购买要约中选择至少一个购买要约; 发布促销至少一个报价的筹款活动; 选择和采购筹款活动提供的优惠; 生成指定购买的报价的货币价值的凭单; 通过与零售商的购买交易来兑换凭单，并从至少一部分货币价值分配第一笔款项到筹款活动账户余额，并将第二笔款项分配给筹款服务账户余额。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式