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    • 42. 发明申请
    • ISOLATION REGION FABRICATION FOR REPLACEMENT GATE PROCESSING
    • 用于替代浇口加工的隔离区制造
    • US20130043535A1
    • 2013-02-21
    • US13213713
    • 2011-08-19
    • Brent A. AndersonEdward J. Nowak
    • Brent A. AndersonEdward J. Nowak
    • H01L21/762H01L27/12
    • H01L29/66545H01L21/28123H01L21/76283H01L21/84
    • A method for isolation region fabrication for replacement gate integrated circuit (IC) processing includes forming a plurality of dummy gates on a substrate; forming a block mask over the plurality of dummy gates, such that the block mask selectively exposes a dummy gate of the plurality of dummy gates; removing the exposed dummy gate to form an isolation region recess corresponding to the removed dummy gate; filling the isolation region recess with an insulating material to form an isolation region; removing the block mask to expose a remaining plurality of dummy gates; and performing replacement gate processing on the remaining plurality of dummy gates to form a plurality of active devices, wherein at least two of the plurality of active devices are electrically isolated from each other by the isolation region.
    • 用于替换栅极集成电路(IC)处理的隔离区域制造的方法包括在衬底上形成多个虚拟栅极; 在所述多个虚拟栅极上形成块掩模,使得所述块掩模选择性地暴露所述多个伪栅极的伪栅极; 去除所暴露的虚拟栅极以形成对应于去除的虚拟栅极的隔离区域凹部; 用绝缘材料填充隔离区域凹部以形成隔离区域; 去除所述块掩模以暴露剩余的多个伪栅极; 以及对剩余的多个伪栅极执行替换栅极处理以形成多个有源器件,其中所述多个有源器件中的至少两个通过所述隔离区域彼此电隔离。
    • 44. 发明申请
    • INTEGRATED CIRCUIT DEVICE WITH SERIES-CONNECTED FIELD EFFECT TRANSISTORS AND INTEGRATED VOLTAGE EQUALIZATION AND METHOD OF FORMING THE DEVICE
    • 具有串联场效应晶体管和集成电压均衡的集成电路装置及其形成方法
    • US20120208329A1
    • 2012-08-16
    • US13455176
    • 2012-04-25
    • Andres BryantEdward J. Nowak
    • Andres BryantEdward J. Nowak
    • H01L21/84H01L21/8234
    • H01L21/845H01L21/84H01L27/1203H01L27/1211
    • Disclosed is an integrated circuit device having series-connected planar or non-planar field effect transistors (FETs) with integrated voltage equalization and a method of forming the device. The series-connected FETs comprise gates positioned along a semiconductor body to define the channel regions for the series-connected FETs. Source/drain regions are located within the semiconductor body on opposing sides of the channel regions such that each portion of the semiconductor body between adjacent gates comprises one source/drain region for one field effect transistor abutting another source/drain region for another field effect transistor. Integrated voltage equalization is achieved through a conformal conductive layer having a desired resistance and positioned over the series-connected FETs such that it is electrically isolated from the gates, but in contact with the source/drain regions within the semiconductor body.
    • 公开了具有集成电压均衡的具有串联的平面或非平面场效应晶体管(FET)的集成电路器件和形成器件的方法。 串联连接的FET包括沿着半导体本体定位的门,以限定用于串联连接的FET的沟道区。 源极/漏极区域位于沟道区域的相对侧上的半导体本体内,使得相邻栅极之间的半导体本体的每个部分包括用于一个场效应晶体管的一个源极/漏极区域,用于与另一个场效应晶体管的另一个源极/漏极区域相邻接 。 集成电压均衡通过具有期望电阻的并行导电层实现,并且位于串联连接的FET上,使得其与栅极电隔离,但与半导体本体内的源极/漏极区域接触。
    • 46. 发明授权
    • Integrated circuit device with series-connected field effect transistors and integrated voltage equalization and method of forming the device
    • 具有串联场效应晶体管和集成电压均衡的集成电路器件及其形成方法
    • US08232627B2
    • 2012-07-31
    • US12563195
    • 2009-09-21
    • Andres BryantEdward J. Nowak
    • Andres BryantEdward J. Nowak
    • H01L29/06
    • H01L21/845H01L21/84H01L27/1203H01L27/1211
    • Disclosed is an integrated circuit device having series-connected planar or non-planar field effect transistors (FETs) with integrated voltage equalization and a method of forming the device. The series-connected FETs comprise gates positioned along a semiconductor body to define the channel regions for the series-connected FETs. Source/drain regions are located within the semiconductor body on opposing sides of the channel regions such that each portion of the semiconductor body between adjacent gates comprises one source/drain region for one field effect transistor abutting another source/drain region for another field effect transistor. Integrated voltage equalization is achieved through a conformal conductive layer having a desired resistance and positioned over the series-connected FETs such that it is electrically isolated from the gates, but in contact with the source/drain regions within the semiconductor body.
    • 公开了具有集成电压均衡的具有串联的平面或非平面场效应晶体管(FET)的集成电路器件和形成器件的方法。 串联连接的FET包括沿着半导体本体定位的门,以限定用于串联连接的FET的沟道区。 源极/漏极区域位于沟道区域的相对侧上的半导体本体内,使得相邻栅极之间的半导体本体的每个部分包括用于一个场效应晶体管的一个源极/漏极区域,用于与另一个场效应晶体管的另一个源极/漏极区域相邻接 。 集成电压均衡通过具有期望电阻的并行导电层实现,并且位于串联连接的FET上,使得其与栅极电隔离,但与半导体本体内的源极/漏极区域接触。
    • 49. 发明申请
    • MULTI-GATE NON-PLANAR FIELD EFFECT TRANSISTOR STRUCTURE AND METHOD OF FORMING THE STRUCTURE USING A DOPANT IMPLANT PROCESS TO TUNE DEVICE DRIVE CURRENT
    • 多栅极非平面场效应晶体管结构和使用DOPANT IMPLANT工艺形成结构以调节器件驱动电流的方法
    • US20120156838A1
    • 2012-06-21
    • US13406652
    • 2012-02-28
    • Brent A. AndersonEdward J. Nowak
    • Brent A. AndersonEdward J. Nowak
    • H01L21/8238
    • H01L27/1211H01L21/845H01L29/66545H01L29/66795H01L29/785
    • Disclosed are embodiments of a semiconductor structure that includes one or more multi-gate field effect transistors (MUGFETs), each MUGFET having one or more semiconductor fins. In the embodiments, dopant implant region is incorporated into the upper portion of the channel region of a semiconductor fin in order to selectively modify (i.e., decrease or increase) the threshold voltage within that upper portion relative to the threshold voltage in the lower portion and, thereby to selectively modify (i.e., decrease or increase) device drive current. In the case of a multiple semiconductor fins, the use of implant regions, the dopant conductivity type in the implant regions and/or the sizes of the implant regions can be varied from fin to fin within a multi-fin MUGFET or between different single and/or multi-fin MUGFETs so that individual device drive current can be optimized. Also disclosed herein are embodiments of a method of forming the semiconductor structure.
    • 公开了包括一个或多个多栅极场效应晶体管(MUGFET)的半导体结构的实施例,每个MUGFET具有一个或多个半导体鳍片。 在实施例中,掺杂剂注入区域被并入到半导体鳍片的沟道区域的上部,以便相对于下部的阈值电压选择性地修改(即,降低或增加)该上部内的阈值电压) ,从而选择性地修改(即,减小或增加)器件驱动电流。 在多个半导体鳍片的情况下,注入区域,植入区域中的掺杂剂导电类型和/或植入区域的尺寸的使用可以在多翅片MUGFET内的翅片或鳍片之间或者在不同的单个和 /或多鳍MUGFET,使得可以优化单个设备驱动电流。 本文还公开了形成半导体结构的方法的实施例。
    • 50. 发明申请
    • SIMULTANEOUS FORMATION OF FINFET AND MUGFET
    • 同时形成FINFET和MUGFET
    • US20120098066A1
    • 2012-04-26
    • US12909917
    • 2010-10-22
    • Brent A. AndersonEdward J. NowakJed H. Rankin
    • Brent A. AndersonEdward J. NowakJed H. Rankin
    • H01L29/786H01L21/336H01L21/311
    • H01L29/7855H01L21/3081H01L29/66795H01L29/785
    • A method and structure comprise a field effect transistor structure that includes a first rectangular fin structure position on a substrate. The first rectangular fin structure has a bottom contacting the substrate, a top opposite the bottom, and sides between the top and the bottom. The structure additionally includes a second rectangular fin structure position on the substrate. Similarly, the second rectangular fin structure also has a bottom contacting the substrate, a top opposite the bottom, and sides between the top and the bottom. The sides of the second rectangular fin structure are parallel to the sides of the first rectangular fin structure. Further, a trench insulator is positioned on the substrate and is positioned between a side of the first rectangular fin structure and a side of the second rectangular fin structure. Additionally, a gate conductor is positioned on the trench insulator, positioned over the sides and the top of the first rectangular fin structure, and positioned over the sides and the top of the second rectangular fin structure. The gate conductor runs perpendicular to the sides of the first rectangular fin structure and the sides of the second rectangular fin structure. Also, a gate insulator is positioned between the gate conductor and the first rectangular fin structure and between the gate conductor and the second rectangular fin structure. The structure further includes a first cap on the top of the first rectangular fin structure. The first cap separates the gate conductor from the first rectangular fin structure.
    • 一种方法和结构包括场效应晶体管结构,其包括在衬底上的第一矩形鳍结构位置。 第一矩形翅片结构具有接触基底的底部,与底部相对的顶部以及顶部和底部之间的边。 该结构还包括在基底上的第二矩形翅片结构位置。 类似地,第二矩形翅片结构还具有接触基底的底部,与底部相对的顶部以及顶部和底部之间的边。 第二矩形翅片结构的侧面平行于第一矩形翅片结构的侧面。 此外,沟槽绝缘体位于衬底上并且位于第一矩形翅片结构的侧面和第二矩形鳍结构的侧面之间。 此外,栅极导体位于沟槽绝缘体上,位于第一矩形翅片结构的侧面和顶部之上,并且位于第二矩形鳍结构的侧面和顶部之上。 栅极导体垂直于第一矩形翅片结构的侧面和第二矩形翅片结构的侧面延伸。 此外,栅极绝缘体位于栅极导体和第一矩形翅片结构之间以及栅极导体和第二矩形鳍结构之间。 该结构还包括在第一矩形翅片结构的顶部上的第一盖。 第一盖将栅极导体与第一矩形鳍结构分开。