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41. 发明授权

US07495923B2 Heat dissipation device having fixing bracket 失效
标题翻译：散热装置具有固定支架
公开(公告)号：US07495923B2
公开(公告)日：2009-02-24
申请号：US11781706
申请日：2007-07-23
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4006 , G06F1/20 , H01L23/467 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for an add-on card in a computer enclosure includes a heat sink mounted on the add-on card and a fixing bracket. The fixing bracket includes a connecting portion fixed to the heat sink and a securing portion for being fixed to a panel of the computer enclosure and a mounting plate of the add-on card. The fixing bracket is configured to rest a part of weight of the heat sink on the computer enclosure.
摘要翻译：用于计算机外壳中的附加卡的散热装置包括安装在附加卡上的散热器和固定支架。固定支架包括固定到散热器的连接部分和用于固定到计算机外壳的面板和附加卡的安装板的固定部分。固定支架配置为将散热器的一部分重量放在计算机外壳上。

42. 发明授权

US07443680B1 Heat dissipation apparatus for heat producing device 失效
标题翻译：用于制热装置的散热装置
公开(公告)号：US07443680B1
公开(公告)日：2008-10-28
申请号：US11696682
申请日：2007-04-04
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating apparatus for dissipating heat generated by heat producing device, includes a base, a fin set and an axial fan. The base is secured on the heat producing device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and oriented parallel to each other, and form a plurality of air passages therebetween. The axial fan is installed at a lateral side of the fin set and directs airflow into the fin set through the air passages. The fin set has an inclined area at an end thereof, and the fan is installed on the inclined area of the fin set and oblique to the base.
摘要翻译：用于散发由发热装置产生的热量的散热装置，包括基座，翅片组和轴流风扇。底座固定在发热装置上。翅片组包括布置在基座上的多个翅片; 翅片彼此间隔开并且彼此平行取向，并在它们之间形成多个空气通道。轴流风扇安装在翅片组的侧面，并通过空气通道将气流引导到翅片组中。翅片组在其一端具有倾斜区域，并且风扇安装在翅片组的倾斜区域上并且倾斜于基部。

43. 发明申请

US20070227170A1 COOLING SYSTEM FOR COMPUTER 审中-公开
标题翻译：计算机冷却系统
公开(公告)号：US20070227170A1
公开(公告)日：2007-10-04
申请号：US11308500
申请日：2006-03-30
申请人： Xue-Wen Peng
发明人： Xue-Wen Peng
IPC分类号： F25D23/12
CPC分类号： G06F1/20
摘要： A computer cooling system includes a computer housing, a refrigeration loop and two fans. The housing includes an inner layer and an outer layer and defines an air inlet and an air outlet on opposite sides thereof. The refrigeration loop orderly includes a compressor, a condenser, an expansion valve, an evaporator and pipes connecting the compressor, the condenser, the expansion valve and the evaporator. The compressor and the pipes are located between the inner and outer layers. The fans are respectively located near the air inlet and the air outlet, in order to draw air into the housing and expel the air out of the housing.
摘要翻译：计算机冷却系统包括计算机外壳，制冷回路和两个风扇。壳体包括内层和外层，并且在其相对侧上限定空气入口和空气出口。制冷回路有序地包括压缩机，冷凝器，膨胀阀，蒸发器和连接压缩机，冷凝器，膨胀阀和蒸发器的管道。压缩机和管道位于内层和外层之间。风扇分别位于进气口和空气出口附近，以便将空气吸入壳体并将空气排出壳体。

44. 发明授权

US07277280B2 Heat dissipation device having a dual-fan arrangement 失效
标题翻译：具有双风扇布置的散热装置
公开(公告)号：US07277280B2
公开(公告)日：2007-10-02
申请号：US11164498
申请日：2005-11-25
申请人： Xue-Wen Peng
发明人： Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (22), a first fan (24) disposed on one part of the heat sink, a second fan (26) disposed on another part of the heat sink and a cover (30) disposed to enclose the heat sink, the first fan and the second fan. The second fan draws the air produced by the first fan and flowing through the heat sink to quickly leave the heat sink.
摘要翻译：一种散热装置，包括散热器（22），设置在散热器的一部分上的第一风扇（24），设置在散热器另一部分上的第二风扇（26）和设置成包围散热器，第一风扇和第二风扇。第二扇风扇吸引由第一风扇产生的空气并流过散热器，以快速离开散热器。

45. 发明申请

US20070181288A1 COMBINATION OF A HEAT SINK AND A FAN 审中-公开
标题翻译：散热器和风扇的组合
公开(公告)号：US20070181288A1
公开(公告)日：2007-08-09
申请号：US11307446
申请日：2006-02-08
申请人： Bing Chen , Xue-Wen Peng
发明人： Bing Chen , Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A combination includes an extruded heat sink and a fan secured to the heat sink. The heat sink includes a planar fin and an L-shaped fin. The planar fin and the L-shaped fin commonly define a channel and an entrance to the channel. The fan includes lead wires packed together. The lead wires are allowed to pass through the entrance one by one and to be received in the channel side by side after being turned 90 degrees.
摘要翻译：组合包括挤压散热器和固定到散热器的风扇。散热器包括平面翅片和L形翅片。平面翅片和L形翅片通常定义通道和通道的入口。风扇包括包装在一起的导线。导线允许一个接一个地穿过入口，并在转动90度后并排接收在通道中。

46. 发明申请

US20070121289A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070121289A1
公开(公告)日：2007-05-31
申请号：US11164498
申请日：2005-11-25
申请人： Xue-Wen Peng
发明人： Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (22), a first fan (24) disposed on one part of the heat sink, a second fan (26) disposed on another part of the heat sink and a cover (30) disposed to enclose the heat sink, the first fan and the second fan. The second fan draws the air produced by the first fan and flowing through the heat sink to quickly leave the heat sink.
摘要翻译：一种散热装置，包括散热器（22），设置在散热器的一部分上的第一风扇（24），设置在散热器另一部分上的第二风扇（26）和设置成包围散热器，第一风扇和第二风扇。第二扇风扇吸引由第一风扇产生的空气并流过散热器，以快速离开散热器。

47. 发明申请

US20070097646A1 HEAT DISSIPATING APPARATUS FOR COMPUTER ADD-ON CARDS 审中-公开
标题翻译：用于计算机附加卡的散热装置
公开(公告)号：US20070097646A1
公开(公告)日：2007-05-03
申请号：US11163868
申请日：2005-11-02
申请人： Xue-Wen Peng
发明人： Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating apparatus mounted onto an add-on card (20) includes a base (70), a cover (30) mounted on the base, a plurality of fins (60) received between and thermally connecting the cover and the base, a fan (40) positioned on the base to blow air to the fins, and a heat pipe (50) including an evaporating portion (52) and a condensing portion (54). The evaporating portion and condensing portion are sandwiched between the base and the fins. The cover absorbs heat from the fins and dissipates the heat to ambient air. Thus, the heat dissipating area is increased due to the cover, and the heat dissipating apparatus has a better heat dissipating efficiency.
摘要翻译：安装在附加卡（20）上的散热装置包括基座（70），安装在基座上的盖（30），容纳在盖子和基座之间并热连接盖子和基座的多个翅片（60）风扇（40）位于基座上以将空气吹向翅片;以及热管（50），其包括蒸发部分（52）和冷凝部分（54）。蒸发部分和冷凝部分夹在基部和翅片之间。盖子从散热片吸收热量，并将热量散发到环境空气中。因此，散热区域由于盖而增加，散热装置具有更好的散热效率。

48. 发明授权

US07167370B2 Fastener for mounting heat-radiator to electronic device 失效
标题翻译：用于将散热器安装到电子设备的紧固件
公开(公告)号：US07167370B2
公开(公告)日：2007-01-23
申请号：US10950324
申请日：2004-09-23
申请人： Hsieh Kun Lee , Wan-Lin Xia , Xue-Wen Peng , Jin-Song Feng
发明人： Hsieh Kun Lee , Wan-Lin Xia , Xue-Wen Peng , Jin-Song Feng
IPC分类号： H05K7/20 , H01L23/34 , A44B17/00 , F16B13/00
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/306 , H01L2924/00
摘要： A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.
摘要翻译：公开了一种用于将散热器（20）安装到电路板（40）上的电子设备（30）的紧固件（10）。散热器和电路板具有对准的孔（22,44）。紧固件包括具有大直径的上部部分（112）和较小直径的下部（113）的头部（11），围绕头部的下部部分捕获的圆柱形弹簧（14），用于施加弹簧力以及金属线（15），其具有固定在所述头部上的第一端部和弯曲形成接合部分（152）的第二端部。金属丝的接合部压缩地穿过散热器和电路板的对准的孔，并与电路板的下侧接合。

49. 发明申请

US20060291172A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060291172A1
公开(公告)日：2006-12-28
申请号：US11166311
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0275
摘要： A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together. The evaporating segment and the condensing segment of the at least one heat pipe are movably received in the first and second heat dissipation units respectively before the heat dissipation device is installed to the electronic card device and dissipating heat generated therefrom, and are firmly secured in the first and second heat dissipation units respectively after the heat dissipation device is installed to the electronic card device and dissipate heat generated therefrom.
摘要翻译：一种用于安装和冷却电子卡装置（40）的散热装置包括第一和第二散热单元（10,20）和至少一个热管（30）。散热单元各自包括基板（12,22）和与基板接合的翅片板（14,24）。所述至少一个热管包括容纳在所述基板和所述第一散热单元的翅片之间的蒸发段（32），以及容纳在所述基板和所述翅片板之间的第二散热的冷凝段（34）从而将第一和第二散热单元连接在一起。所述至少一个热管的蒸发段和冷凝段分别可移动地容纳在第一和第二散热单元中，然后将散热装置安装到电子卡装置上并散发由其产生的热量，并牢固地固定在第一和第二散热单元分别在散热装置安装到电子卡装置上并散发由其产生的热量之后。

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