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    • 42. 发明授权
    • Single poly UV-erasable programmable read only memory
    • 单个聚UV可擦除可编程只读存储器
    • US06882574B2
    • 2005-04-19
    • US10605235
    • 2003-09-17
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • G11C16/04
    • G11C16/0408G11C16/0433G11C2216/10G11C2216/18H01L27/11521H01L27/11558
    • An erasable programmable read only memory includes two serially connected P-type metal-oxide semiconductor (MOS) transistors, wherein a first P-type MOS transistor acts as select transistor, a gate of the first P-type MOS transistor is coupled to select gate voltage, a first node of the first P-type MOS transistor connected to source line voltage, a second node of the first P-type MOS transistor connected to a first node of a second P-type MOS transistor, wherein a second node of the second P-type MOS transistor is connected to bit line voltage, wherein a gate of the second P-type MOS transistor serves as a floating gate, wherein the erasable programmable read only memory does not need to bias a certain voltage on a control gate for programming and thereby injecting hot carriers onto the floating gate, and wherein the erasable programmable read only memory is capped by dielectric materials which are transparent to ultraviolet (UV) light.
    • 可擦除可编程只读存储器包括两个串联的P型金属氧化物半导体(MOS)晶体管,其中第一P型MOS晶体管用作选择晶体管,第一P型MOS晶体管的栅极耦合到选择栅极 电压,连接到源极线电压的第一P型MOS晶体管的第一节点,与第二P型MOS晶体管的第一节点连接的第一P型MOS晶体管的第二节点,其中, 第二P型MOS晶体管连接到位线电压,其中第二P型MOS晶体管的栅极用作浮置栅极,其中可擦除可编程只读存储器不需要在控制栅极上偏置一定电压, 编程,从而将热载体注入到浮动栅极上,并且其中可擦除可编程只读存储器被对紫外线(UV)光透明的电介质材料封盖。
    • 44. 发明授权
    • Nonvolatile semiconductor memory capable of random programming
    • 非易失性半导体存储器,能够进行随机编程
    • US06504763B1
    • 2003-01-07
    • US09683845
    • 2002-02-21
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • Ching-Sung YangShih-Jye ShenChing-Hsiang Hsu
    • G11C1604
    • H01L27/11521G11C16/0483G11C16/12H01L27/115H01L27/11524
    • A nonvolatile semiconductor memory capable of random programming has a semiconductor substrate of a first conductivity type having a memory region, a deep ion well of a second conductivity type located in the semiconductor substrate within the memory region, a shallow ion well of the first conductivity type isolated by an STI layer within the deep ion well, at least one NAND cell block located on the semiconductor substrate within the shallow ion well, and a bit line located over the semiconductor substrate used to provide a first predetermined voltage for the shallow ion well during a data program mode via a conductive plug which electrically connects to the bit line and extends downward to the shallow ion well. Consequently, during a programming operation, only a selected word line is required to have an appropriate voltage applied to it. Thus, the power needed is reduced and access time is shortened.
    • 能够进行随机编程的非易失性半导体存储器具有具有存储区域的第一导电类型的半导体衬底,位于存储区域内的半导体衬底中的第二导电类型的深离子阱,第一导电类型的浅离子阱 通过深离子阱内的STI层隔离,位于浅离子阱内的半导体衬底上的至少一个NAND单元块,以及位于半导体衬底上方的位线,用于为浅离子阱提供第一预定电压 通过电连接到位线并向下延伸到浅离子阱的导电插头的数据程序模式。 因此,在编程操作期间,仅需要选择的字线来施加适当的电压。 因此,所需的功率减少,并且访问时间缩短。
    • 46. 发明授权
    • Non-volatile memory with a stable threshold voltage on SOI substrate
    • 在SOI衬底上具有稳定阈值电压的非易失性存储器
    • US07960792B2
    • 2011-06-14
    • US12943945
    • 2010-11-11
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • H01L29/786H01L29/792
    • H01L27/115
    • A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the first conductive type silicon body layer beneath the gate.
    • 设置在SOI衬底中的非易失性存储器。 非易失性存储器包括存储单元和第一导电类型掺杂区域。 存储单元包括栅极,电荷存储结构,底部电介质层,第二导电类型漏极区域和第二导电型源极区域。 栅极设置在SOI衬底上。 电荷存储结构设置在栅极和SOI衬底之间。 底部电介质层设置在电荷存储层和SOI衬底之间。 第二导电型漏极区域和第二导电型源极区域设置在栅极的两侧旁边的第一导电型硅体层中。 第一导电型掺杂区域设置在第一导电型硅体层中,并且与栅极下方的第一导电型硅体层电连接。