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41. 发明授权

US07273812B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07273812B2
公开(公告)日：2007-09-25
申请号：US11178145
申请日：2005-07-07
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
IPC分类号： H01L21/44
CPC分类号： C25D1/003 , G01R3/00 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

42. 发明授权

US07241689B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07241689B2
公开(公告)日：2007-07-10
申请号：US11029169
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
IPC分类号： H01L21/44
CPC分类号： H01R13/187 , H01L24/72 , H01L2924/15747 , H01L2924/00
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

43. 发明申请

US20060109016A1 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US20060109016A1
公开(公告)日：2006-05-25
申请号：US11244817
申请日：2005-10-06
申请人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel Kruglick , Richard Chen , Kieun Kim
发明人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel Kruglick , Richard Chen , Kieun Kim
IPC分类号： G01R31/02
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要翻译：多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如，当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在方向垂直于IC的表面的平面。在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

44. 发明申请

US20060053625A1 Microprobe tips and methods for making 审中-公开
标题翻译：微型笔尖和制作方法
公开(公告)号：US20060053625A1
公开(公告)日：2006-03-16
申请号：US11177798
申请日：2005-07-07
申请人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
发明人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
IPC分类号： H01R43/16 , H01R43/00
CPC分类号： G01R3/00 , C25D1/003 , G01R1/073 , Y10T29/49204 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

45. 发明申请

US20060006888A1 Electrochemically fabricated microprobes 审中-公开
标题翻译：电化学制造的微型纺织品
公开(公告)号：US20060006888A1
公开(公告)日：2006-01-12
申请号：US10949738
申请日：2004-09-24
申请人： Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Dennis Smalley , Kieun Kim , Richard Chen , Gang Zhang
发明人： Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Dennis Smalley , Kieun Kim , Richard Chen , Gang Zhang
IPC分类号： G01R31/02
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06733 , G01R1/06744 , G01R1/07357 , G01R31/2886
摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
摘要翻译：用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。在一些实施例中，提供了多个探针的阵列。

46. 发明申请

US20050126916A1 Three-dimensional structures having feature sizes smaller than a minimum feature size and methods for fabricating 有权
标题翻译：特征尺寸小于最小特征尺寸的三维结构和制造方法
公开(公告)号：US20050126916A1
公开(公告)日：2005-06-16
申请号：US10949744
申请日：2004-09-24
申请人： Michael Lockard , Adam Cohen , Vacit Arat , Dennis Smalley
发明人： Michael Lockard , Adam Cohen , Vacit Arat , Dennis Smalley
IPC分类号： C25D1/00 , C25D1/08 , C25D5/02 , C25D5/10 , C25D7/00 , H01M4/02
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
摘要翻译：多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙）用于形成结构。在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于最小特征尺寸。

47. 发明申请

US20130047268A1 Methods for Using Biometric Authentication Methods for Securing Files and for Providing Secure Access to Such Files by Originators and/or Authorized Others 审中-公开
标题翻译：使用生物识别认证方法来保护文件并为发起者和/或授权的其他人提供对这些文件的安全访问的方法
公开(公告)号：US20130047268A1
公开(公告)日：2013-02-21
申请号：US13558300
申请日：2012-07-25
申请人： Vacit Arat
发明人： Vacit Arat
IPC分类号： G06F21/00
CPC分类号： G06F21/32 , G06F21/6218
摘要： Embodiments are directed to apparatus, methods and systems for locking data or program files and for allowing access to such files only by individuals given authorization and wherein the identity of locking or accessing individuals is provided by comparison of collected inertial information associated with providing a signature with information stored about the particular individuals. In a first embodiment two primary components work together to provide collection of inertial data (and potentially other data) and then comparing of the collected data to stored data to provide an authentication or identification assessment. The first of these components is a SigzaPen device for acquiring data while the second is a remote Signature Processing Center (“SPC”) wherein these two components are capable of communicating directly or indirectly with each other.
摘要翻译：实施例涉及用于锁定数据或程序文件并且仅允许被授权的个人访问这些文件的装置，方法和系统，并且其中锁定或访问个体的身份通过将与提供签名相关联的所收集的惯性信息与存储关于特定个人的信息。在第一实施例中，两个主要组件一起工作以提供惯性数据（和潜在的其他数据）的收集，然后将收集的数据与存储的数据进行比较以提供认证或识别评估。这些组件中的第一个是用于获取数据的SigzaPen设备，而第二个是远程签名处理中心（SPC），其中这两个组件能够彼此直接或间接地通信。

48. 发明申请

US20120191121A1 CONCENTRIC CUTTING DEVICES FOR USE IN MINIMALLY INVASIVE MEDICAL PROCEDURES 审中-公开
标题翻译：用于微型入侵医疗程序的集中切割装置
公开(公告)号：US20120191121A1
公开(公告)日：2012-07-26
申请号：US13388653
申请日：2010-08-18
申请人： Richard T. Chen , Ming Ting Wu , Arun Veeramani , Vacit Arat , Gregory P. Schmitz
发明人： Richard T. Chen , Ming Ting Wu , Arun Veeramani , Vacit Arat , Gregory P. Schmitz
IPC分类号： A61B17/32
CPC分类号： A61B17/3205 , A61B10/0266 , A61B10/0283 , A61B17/32002 , A61B17/3203 , A61B17/320758 , A61B2017/00345 , A61B2017/00526 , A61B2017/320064 , A61B2017/320775
摘要： Various embodiments of a tissue cutting device are described, such as a device with an elongate tube having a proximal end and a distal end and a central axis extending from the proximal end to the distal end; a first annular element at the distal end of the elongate tube, the first annular element having a flat portion at its distal end perpendicular to the central axis, the flat portion extending from an outer circumference of the first annular element to the central axis; and a second annular element at the distal end of the elongate tube and concentric with the first annular element, the second annular element having a flat portion at its distal end perpendicular to the central axis, at least one of the first or second annular elements rotatable about the central axis, the rotation causing the first annular element and the second annular element to pass each other to shear tissue.
摘要翻译：描述了组织切割装置的各种实施例，例如具有细长管的装置，其具有近端和远端以及从近端延伸到远端的中心轴线; 在所述细长管的远端处的第一环形元件，所述第一环形元件在其远端垂直于所述中心轴线具有平坦部分，所述平坦部分从所述第一环形元件的外周延伸到所述中心轴线; 以及在细长管的远端处与第一环形元件同心的第二环形元件，第二环形元件在其远端垂直于中心轴线具有平坦部分，第一或第二环形元件中的至少一个可旋转围绕中心轴线旋转，导致第一环形元件和第二环形元件彼此通过以剪切组织。

49. 发明申请

US20100134131A1 Electrochemically Fabricated Microprobes 审中-公开
标题翻译：电化学制造的微波
公开(公告)号：US20100134131A1
公开(公告)日：2010-06-03
申请号：US12625505
申请日：2009-11-24
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
IPC分类号： G01R31/02
CPC分类号： A61N1/00 , C25D1/00 , C25D1/003
摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
摘要翻译：用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。在一些实施例中，提供了多个探针的阵列。

50. 发明申请

US20090256583A1 Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes 审中-公开
标题翻译：用于接触电子元件的垂直微孔及其制造方法
公开(公告)号：US20090256583A1
公开(公告)日：2009-10-15
申请号：US12429110
申请日：2009-04-23
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R3/00 , A61N1/00 , C25D1/00 , C25D1/003 , G01R1/06722 , G01R1/06744 , G01R1/06761
摘要： Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
摘要翻译：用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

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