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41. 发明授权

US5299939A Spring array connector 失效
标题翻译：弹簧阵列连接器
公开(公告)号：US5299939A
公开(公告)日：1994-04-05
申请号：US847970
申请日：1992-03-05
申请人： George F. Walker , Arthur Zingher
发明人： George F. Walker , Arthur Zingher
IPC分类号： H01R13/24 , H01R12/71 , H01R13/33 , H01R24/00 , H01R9/09
CPC分类号： H01R13/33 , H01R12/57 , H01R12/714 , H01R13/24
摘要： A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from the other conducting lines. All of the springs in the spring array are fabricated simultaneously. Spring embodiments include sine, helix, cantilever and buckling beam shapes in sheet and wire forms.
摘要翻译：弹簧阵列连接器包括具有多个导电线，电触头和电端子层的多个弹簧的单一弹性层。阵列的每个弹簧都是可独立弯曲的，并且每条导线与其它导线电隔离。弹簧阵列中的所有弹簧都是同时制造的。弹簧实施例包括片材和线材形式的正弦，螺旋，悬臂和屈曲梁形状。

42. 发明授权

US5283104A Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates 失效
标题翻译：通过糊剂组合物及其在电路化陶瓷衬底中形成导电通孔的用途
公开(公告)号：US5283104A
公开(公告)日：1994-02-01
申请号：US672272
申请日：1991-03-20
申请人： Farid Y. Aoude , Emanuel I. Cooper , Peter R. Duncombe , Shaji Farooq , Edward A. Giess , Young-Ho Kim , Sarah H. Knickerbocker , Friedel Muller-Landau , Mark O. Neisser , Jae M. Park , Robert R. Shaw , Robert A. Rita , Thomas M. Shaw , Rao Vallabhaneni , Jon A. Van Hise , George F. Walker , Jungihl Kim , James M. Brownlow, deceased
发明人： Farid Y. Aoude , Emanuel I. Cooper , Peter R. Duncombe , Shaji Farooq , Edward A. Giess , Young-Ho Kim , Sarah H. Knickerbocker , Friedel Muller-Landau , Mark O. Neisser , Jae M. Park , Robert R. Shaw , Robert A. Rita , Thomas M. Shaw , Rao Vallabhaneni , Jon A. Van Hise , George F. Walker , Jungihl Kim , James M. Brownlow, deceased
IPC分类号： H01B1/16 , H01L21/48 , H01L23/498 , H05K1/03 , H05K1/09 , H05K3/46 , B32B9/00
CPC分类号： H05K1/092 , H01B1/16 , H01L21/486 , H01L21/4867 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4611 , H05K3/4629 , Y10S428/901 , Y10T29/49147 , Y10T29/49165 , Y10T428/12472 , Y10T428/12556 , Y10T428/12604 , Y10T428/12611 , Y10T428/24322 , Y10T428/24802 , Y10T428/25 , Y10T428/251 , Y10T428/252 , Y10T428/2982 , Y10T428/2991
摘要： Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.
摘要翻译：用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的通孔填充组合物，不会破裂和/或失去气密密封。通孔填充组合物包含含有（a）在约0.5和6（my）m之间的基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有最大尺寸或直径在约为陶瓷和/或玻璃球直径的1/3和1/4，和（c）粘合剂载体。形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体陶瓷电路基板。

43. 发明授权

US08878259B2 Super lattice/quantum well nanowires 有权
标题翻译：超晶格/量子阱纳米线
公开(公告)号：US08878259B2
公开(公告)日：2014-11-04
申请号：US13555383
申请日：2012-07-23
申请人： Harold J. Hovel , Qiang Huang , Xiaoyan Shao , James Vichiconti , George F. Walker
发明人： Harold J. Hovel , Qiang Huang , Xiaoyan Shao , James Vichiconti , George F. Walker
IPC分类号： H01L29/94 , H01L29/76 , H01L31/119 , H01L31/113 , H01L31/062 , H01L31/18 , B82Y10/00 , B82Y30/00 , C30B29/02 , C30B29/06 , C30B29/40 , C30B29/52 , C30B29/60 , C30B33/10 , H01L21/306 , H01L29/06 , H01L29/12 , H01L31/0352 , H01L33/20
CPC分类号： H01L31/18 , B82Y10/00 , B82Y30/00 , C30B29/02 , C30B29/06 , C30B29/40 , C30B29/52 , C30B29/60 , C30B29/605 , C30B33/10 , H01L21/30604 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/125 , H01L31/0352 , H01L33/20
摘要： Segmented semiconductor nanowires are manufactured by removal of material from a layered structure of two or more semiconductor materials in the absence of a template. The removal takes place at some locations on the surface of the layered structure and continues preferentially along the direction of a crystallographic axis, such that nanowires with a segmented structure remain at locations where little or no removal occurs. The interface between different segments can be perpendicular to or at angle with the longitudinal direction of the nanowire.
摘要翻译：在没有模板的情况下通过从两种或更多种半导体材料的层状结构中去除材料来制造分段半导体纳米线。去除在层状结构的表面上的某些位置处发生，并且优选地沿着结晶轴的方向延伸，使得具有分段结构的纳米线保持在很少或不发生去除的位置。不同片段之间的界面可以垂直于纳米线的纵向方向或与之相垂直。

44. 发明授权

US08641879B2 Charged entities as locomotive to control motion of polymers through a nanochannel 有权
公开(公告)号：US08641879B2
公开(公告)日：2014-02-04
申请号：US13611662
申请日：2012-09-12
申请人： Stefan Harrer , Binquan Luan , Glenn J. Martyna , Hongbo Peng , Stanislav Polonsky , Stephen M. Rossnagel , Ajay K. Royyuru , Gustavo A. Stolovitzky , George F. Walker
发明人： Stefan Harrer , Binquan Luan , Glenn J. Martyna , Hongbo Peng , Stanislav Polonsky , Stephen M. Rossnagel , Ajay K. Royyuru , Gustavo A. Stolovitzky , George F. Walker
IPC分类号： G01N27/26
CPC分类号： B82Y15/00 , C12Q1/6869 , C12Q2565/631
摘要： A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.

45. 发明授权

US07355271B2 Flexible assembly of stacked chips 有权
标题翻译：堆叠芯片的灵活组装
公开(公告)号：US07355271B2
公开(公告)日：2008-04-08
申请号：US10573561
申请日：2003-09-30
申请人： Richard P. Volant , Kevin S. Petrarca , George F. Walker
发明人： Richard P. Volant , Kevin S. Petrarca , George F. Walker
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L21/568 , H01L21/6835 , H01L23/5387 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/50 , H01L2221/68359 , H01L2221/68372 , H01L2224/04042 , H01L2224/04105 , H01L2224/05554 , H01L2224/18 , H01L2224/24137 , H01L2224/48091 , H01L2224/48227 , H01L2224/49431 , H01L2224/49433 , H01L2224/73209 , H01L2224/73259 , H01L2224/73267 , H01L2224/82005 , H01L2224/9222 , H01L2225/06524 , H01L2225/06527 , H01L2225/06579 , H01L2225/06589 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A three-dimensional package consisting of a plurality of folded integrated circuit chips (100, 110, 120) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip (130) is provided with additional interconnect wiring to a substrate (500), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board.
摘要翻译：描述了由多个折叠集成电路芯片（100,110,120）组成的三维封装，其中至少一个芯片提供用于与堆叠的附加芯片的电连接的互连路径，并且至少一个芯片（130）是提供与衬底（500），封装或印刷电路板的附加互连布线。进一步描述的是提供互连芯片的柔性布置的方法，其被折叠成三维布置以在安装在基板，二级封装或印刷电路板上时消耗较少的空中空间。

46. 发明授权

US07115996B2 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权
公开(公告)号：US07115996B2
公开(公告)日：2006-10-03
申请号：US10852142
申请日：2004-05-25
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.

47. 发明授权

US06924185B2 Fuse structure and method to form the same 失效
标题翻译：保险丝结构和方法形成相同
公开(公告)号：US06924185B2
公开(公告)日：2005-08-02
申请号：US10680618
申请日：2003-10-07
申请人： David K. Anderson , Tien-Jen Cheng , Timothy J. Dalton , Christopher V. Jahnes , Andrew Lu , Chandrasekhar Narayan , Kevin S. Petrarca , Richard P. Volant , George F. Walker
发明人： David K. Anderson , Tien-Jen Cheng , Timothy J. Dalton , Christopher V. Jahnes , Andrew Lu , Chandrasekhar Narayan , Kevin S. Petrarca , Richard P. Volant , George F. Walker
IPC分类号： H01L23/525 , H01L21/336
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A method and structure for a fuse structure comprises an insulator layer, a plurality of fuse electrodes extending through the insulator layer to an underlying wiring layer, an electroplated fuse element connected to the electrodes, and an interface wall. The fuse element is positioned external to the insulator, with a gap juxtaposed between the insulator and the fuse element. The interface wall further comprises a first side wall, a second side wall, and an inner wall, wherein the inner wall is disposed within the gap. The fuse electrodes are diametrically opposed to one another, and the fuse element is perpendicularly disposed above the fuse electrodes. The fuse element is either electroplatted, electroless plated, or is an ultra thin fuse.
摘要翻译：用于熔丝结构的方法和结构包括绝缘体层，穿过绝缘体层延伸到下面的布线层的多个熔丝电极，连接到电极的电镀熔丝元件和界面壁。保险丝元件位于绝缘体的外部，并且在绝缘体和保险丝元件之间并置有间隙。界面壁还包括第一侧壁，第二侧壁和内壁，其中内壁设置在间隙内。熔丝电极彼此直径相对，并且熔丝元件垂直地设置在熔丝电极的上方。保险丝元件是电镀，无电镀，或是超薄保险丝。

48. 发明授权

US06784088B2 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权
标题翻译：选择性地与铟或锡青铜和/或其氧化物覆盖互连的方法以及如此封闭的互连
公开(公告)号：US06784088B2
公开(公告)日：2004-08-31
申请号：US10345288
申请日：2003-01-16
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L2144
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.
摘要翻译：一种用Cu / Sn / Au合金选择性地覆盖铜合金BEOL端子焊盘的方法。该方法包括提供一个或多个Cu BEOL端子焊盘并且用焊锡涂覆Sn涂层，然后用Au涂层涂覆Sn。然后将涂覆的焊盘退火以形成Cu / Sn / Au封盖合金。

49. 发明授权

US06362557B1 Ultrasonic method and actuator for inducing motion of an object 有权
标题翻译：用于诱导物体运动的超声波方法和致动器
公开(公告)号：US06362557B1
公开(公告)日：2002-03-26
申请号：US09649486
申请日：2000-08-28
申请人： Peter A. Gruber , Frederic Maurer , George F. Walker
发明人： Peter A. Gruber , Frederic Maurer , George F. Walker
IPC分类号： H01L4108
CPC分类号： H01L41/0906
摘要： An actuator scaled to macroscopic or microscopic sizes, uses ultrasonic energy to induce motion of an object in a desired direction. The actuator includes one or more pair of piezoelectric transducers connected with a transducer tip. Supplying the piezoelectric transducers with alternating current electrical power causes the tip to vibrate at ultrasonic frequencies. Urging the vibrating tip into contact with a surface on the object at a selected angle of inclination induces the object to move in the desired direction at a rate determined by the inclination angle. Multiple actuators can be used to induce a fall range of movements of variously shaped objects. In microscopic form, the actuator can be used to create a MEMS device. The optional application of a compliant material either on the transducer tip or on the object's surface enhances the movement induced by the actuator.
摘要翻译：按照宏观或微观尺寸的致动器，使用超声波能量来诱导物体沿所需方向的运动。致动器包括与换能器尖端连接的一对或多对压电换能器。为具有交流电功率的压电换能器提供使尖端以超声频率振动。将振动尖端以选定的倾斜角度与物体上的表面接触，使得物体以由倾斜角确定的速率在所需方向上移动。可以使用多个致动器来引起各种形状物体的运动的下降范围。在微观形式中，致动器可用于创建MEMS装置。在换能器尖端或物体表面上可选地应用柔性材料增强了由致动器引起的运动。

50. 发明授权

US5569739A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5569739A
公开(公告)日：1996-10-29
申请号：US197941
申请日：1994-02-17
申请人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , C08F8/34
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。接合操作。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物铜界面的铜扩散阻挡层。

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