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41. 发明授权

US07256428B2 Optoelectronic component and method for the production thereof 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US07256428B2
公开(公告)日：2007-08-14
申请号：US10481528
申请日：2002-06-19
申请人： Bert Braune , Patrick Kromotis
发明人： Bert Braune , Patrick Kromotis
IPC分类号： H01L33/00 , H01L29/24
CPC分类号： H01L33/54 , B29D11/00 , G02B3/08 , G02B6/4206 , H01L31/0232 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). This is done by filling a defined quantity of the transparent filling material (3) into the recess (1A) of the carrier body (1) for the purpose of embedding the transmitter or receiver (2), and by subsequently impressing a lens profile (7) onto the surface (3B), averted from the transmitter or receiver, of the transparent filling material (3) by means of a punch (8), before the transparent filling material with the lens profile (7) thus impressed is completely cured.
摘要翻译：为了将诸如透镜的光学元件例如应用于光电子部件，从填充材料（3）的发射器或接收器（2）避开的表面（3B）直接设置有透镜个人资料（7）。这通过将限定量的透明填充材料（3）填充到载体主体（1）的凹部（1A）中以便嵌入发射器或接收器（2），并且随后施加透镜轮廓（7）通过冲头（8）从透明填充材料（3）避开的表面（3B）上，在具有如此印刷的透镜轮廓（7）的透明填充材料之前是完全治愈

42. 发明授权

US6162853A Method for producing a shaped piece suitable for optical purposes 有权
标题翻译：用于制造适合于光学目的的成形件的制造方法
公开(公告)号：US6162853A
公开(公告)日：2000-12-19
申请号：US230358
申请日：1999-01-25
申请人： Bert Braune , Elisabeth Geiter , Herbert Krug , Peter Mueller , Helmut Schmidt
发明人： Bert Braune , Elisabeth Geiter , Herbert Krug , Peter Mueller , Helmut Schmidt
IPC分类号： C08F283/12 , C08F299/08 , C08L51/08 , C08L57/00 , C08L83/05 , C08L83/07 , G02B1/04 , C08K3/10
CPC分类号： C08L51/08 , C08F283/124 , G02B1/041 , C08L51/085
摘要： Described is a process for preparing a molding suitable for optical purposes, which process comprises the conjoint free-radical polymerization of a precondensate (A) which is derived from at least one hydrolytically condensable silane (a) having at least one free-radically polymerizable group X, and of a monomer (B) having at least two free-radically polymerizable groups Y, the numerical ratio of groups X to groups Y being not greater than 5:1. The moldings obtainable by this process are characterized by high transparency and homogeneity, freedom from stress, scratch and abrasion resistance, high mechanical strength, etc.
摘要翻译： PCT No.PCT / EP97 / 04020 Sec。 371日期1999年1月25日 102（e）日期1999年1月25日PCT提交1997年7月24日PCT公布。公开号WO98 / 04604 日期1998年2月5日描述了一种制备适合于光学目的的模制品的方法，该方法包括预缩合物（A）的联合自由基聚合，所述预缩合物（A）衍生自至少一种可水解缩合的硅烷（a），其具有至少一个可自由基聚合的基团X和具有至少两个可自由基聚合的基团Y的单体（B），基团X与基团Y的数值比不大于5:1。通过该方法获得的模制品的特征在于高透明度和均匀性，不受应力，耐划伤和耐磨性，高机械强度等。

43. 发明申请

US20130256737A1 Electronic Component 有权
标题翻译：电子元器件
公开(公告)号：US20130256737A1
公开(公告)日：2013-10-03
申请号：US13825525
申请日：2011-08-19
申请人： Johann Ramchen , Christina Keith , Bert Braune
发明人： Johann Ramchen , Christina Keith , Bert Braune
IPC分类号： H01L33/64
CPC分类号： H01L33/641 , H01L31/0203 , H01L33/56 , H01L33/58 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.
摘要翻译：电子部件具有包括凹部中的半导体芯片的壳体。凹部中的半导体芯片嵌入由具有第一玻璃化转变温度的第一塑料材料制成的铸塑料中。由具有第二玻璃化转变温度的第二塑料材料制成的盖元件设置在凹部上方。第二玻璃化转变温度低于第一玻璃化转变温度。

44. 发明授权

US08513682B2 Optoelectronic component and production method for an optoelectronic component 有权
标题翻译：光电子元件的光电元件和生产方法
公开(公告)号：US08513682B2
公开(公告)日：2013-08-20
申请号：US12808953
申请日：2008-12-11
申请人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
发明人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
IPC分类号： H01L33/00
CPC分类号： H01L51/52 , H01L24/24 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/60 , H01L51/5253 , H01L51/5284 , H01L2224/73267 , H01L2924/01029 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.
摘要翻译：光电子部件包括载体元件。至少两个元件以相邻方式布置在载体元件的第一侧上。每个元件具有用于产生电磁辐射的至少一个光学活性区域。光电子部件具有至少部分地布置在与第一侧相对的至少两个相邻元件的表面上的电绝缘保护层。至少在布置在所述至少两个相邻元件之间的第一区域中的保护层至少主要地防止由光学活性区域产生的电磁辐射的透射。

45. 发明申请

US20130189447A1 METHOD AND DEVICE FOR PRODUCING A PARYLENE COATING 有权
标题翻译：用于生产PARYLENE涂料的方法和装置
公开(公告)号：US20130189447A1
公开(公告)日：2013-07-25
申请号：US13583755
申请日：2011-03-08
申请人： Bert Braune , Christina Keith , Ivan Galesic
发明人： Bert Braune , Christina Keith , Ivan Galesic
IPC分类号： B05D1/00
CPC分类号： B05D1/60 , B05D1/62 , B05D3/142 , H01L51/5253
摘要： A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.
摘要翻译：在至少一种组分的至少一个表面上生产聚对二甲苯涂层的方法包括提供含有聚对二甲苯单体的第一气体，并通过将含有聚对二甲苯单体的第一气体通过第一喷嘴到所述至少一个表面，其中所述部件设置在大气压的环境中。

46. 发明授权

US08368101B2 Arrangement for generating mixed light and method for producing such an arrangement 有权
标题翻译：用于产生混合光的布置及其制造方法
公开(公告)号：US08368101B2
公开(公告)日：2013-02-05
申请号：US12523487
申请日：2008-01-23
申请人： Bert Braune , Gertrud Kraeuter
发明人： Bert Braune , Gertrud Kraeuter
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/507 , H01L33/483 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.
摘要翻译：用于制造这种布置的布置和方法用于产生混合光。在这种情况下，发射电磁一次辐射的半导体芯片在一次辐射的光束路径中具有发光转换元件。此外，该装置包括连接元件和载体元件，其中载体元件承载和成形发光转换元件和连接元件。

47. 发明申请

US20090026474A1 RADIATION-EMITTING ELEMENT AND METHOD FOR PRODUCING A RADIATION-EMITTING ELEMENT 审中-公开
标题翻译：辐射发射元件和生产辐射元件的方法
公开(公告)号：US20090026474A1
公开(公告)日：2009-01-29
申请号：US12067834
申请日：2006-09-08
申请人： Simon Blumel , Bert Braune
发明人： Simon Blumel , Bert Braune
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting component comprises an optical element and a housing body that has a fastening device that engages with or wraps around the optical element, wherein the fastening device is bent or is provided with projections in such a way that the optical element is irreversibly fixed on the housing body.
摘要翻译：辐射发射部件包括光学元件和壳体，其具有与光学元件接合或缠绕的紧固装置，其中紧固装置弯曲或设置有突起，使得光学元件不可逆地固定在房屋体上。

48. 发明授权

US07429758B2 Optoelectronic component and method for producing it 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US07429758B2
公开(公告)日：2008-09-30
申请号：US11141721
申请日：2005-05-31
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.
摘要翻译：一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

49. 发明申请

US20060022215A1 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
标题翻译：发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座
公开(公告)号：US20060022215A1
公开(公告)日：2006-02-02
申请号：US11179028
申请日：2005-07-18
申请人： Karlheinz Arndt , Georg Bogner , Bert Braune , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Bert Braune , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.
摘要翻译：公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。还公开了相应的壳体基体。

50. 发明申请

US20050218531A1 Optoelectronic component and method for producing it 有权
公开(公告)号：US20050218531A1
公开(公告)日：2005-10-06
申请号：US11141721
申请日：2005-05-31
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , George Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , George Bogner
IPC分类号： H01L23/02 , H01L31/0203 , H01L33/48 , H01L33/60 , H01L23/29
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

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