专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US08968346B2 Miniature shredding tool for use in medical applications and methods for making 有权
标题翻译：用于医疗应用的微型粉碎工具和制造方法
公开(公告)号：US08968346B2
公开(公告)日：2015-03-03
申请号：US12490295
申请日：2009-06-23
申请人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen
发明人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen
IPC分类号： A61B17/14 , A61B17/3205 , A61B17/16 , A61B17/221 , A61B17/32 , A61B17/3207 , A61B10/02 , A61B19/00 , A61B17/00
CPC分类号： A61B17/32002 , A61B10/02 , A61B17/14 , A61B17/1659 , A61B17/1671 , A61B17/221 , A61B17/320725 , A61B17/320758 , A61B90/361 , A61B2017/00261 , A61B2017/003 , A61B2017/00327 , A61B2017/00526 , A61B2017/00539 , A61B2017/00553 , A61B2017/2212 , A61B2017/2215 , A61B2017/320048 , A61B2017/320064 , A61B2017/320775 , B33Y80/00 , F16H55/06 , F16H55/18 , Y10T74/19623
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
摘要翻译：本发明一般涉及微尺度或毫米级装置的领域，以及使用多层多材料电化学制造方法来制造这种装置，具体实施方案涉及粉碎装置，更具体地说涉及用于医疗应用。在一些实施例中，在去除脊髓组织的过程中使用组织去除装置，并且在其他实施例中，类似的装置用于从血管中去除血栓。

42. 发明授权

US08414607B1 Miniature shredding tool for use in medical applications and methods for making 有权
标题翻译：用于医疗应用的微型粉碎工具和制造方法
公开(公告)号：US08414607B1
公开(公告)日：2013-04-09
申请号：US12491220
申请日：2009-06-24
申请人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen , Pierre E. Dupont , Pedro J. Del Nido , Nikolay V. Vasilyev
发明人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen , Pierre E. Dupont , Pedro J. Del Nido , Nikolay V. Vasilyev
IPC分类号： A61B17/32
CPC分类号： A61B17/14 , A61B10/02 , A61B17/1671 , A61B17/221 , A61B17/32002 , A61B17/320725 , A61B17/320758 , A61B90/361 , A61B2017/003 , A61B2017/00327 , A61B2017/00526 , A61B2017/00539 , A61B2017/00553 , A61B2017/2212 , A61B2017/2215 , A61B2017/320048 , A61B2017/320064 , A61B2017/320775
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices include tissue anchoring projections, improved blade configurations, and/or shields or shrouds around the cutting blades to inhibit outflow of tissue that has been brought into the device.
摘要翻译：本发明一般涉及微尺度或毫米级装置的领域，以及使用多层多材料电化学制造方法来制造这种装置，具体实施方案涉及粉碎装置，更具体地说涉及用于医疗应用。在一些实施例中，组织去除装置包括围绕切割刀片的组织锚定突起，改进的刀片构造和/或屏蔽件或护罩，以抑制已经进入装置的组织的流出。

43. 发明授权

US08262916B1 Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures 有权
标题翻译：用于在多层微米级或毫米级复杂三维结构的制造期间至少部分原位释放来自空腔或通道的牺牲材料和/或蚀刻孔的密封的方法
公开(公告)号：US08262916B1
公开(公告)日：2012-09-11
申请号：US12828274
申请日：2010-06-30
申请人： Dennis R. Smalley , Michael S. Lockard , Adam L. Cohen
发明人： Dennis R. Smalley , Michael S. Lockard , Adam L. Cohen
IPC分类号： C23F1/22
CPC分类号： B81C1/00071 , C25D1/003
摘要： Embodiments of the invention are directed to multi-layer, multi-material fabrication methods (e.g. electrochemical fabrication methods) which provide improved versatility in producing complex microdevices and in particular in removing sacrificial material from passages, channels, or cavities that are complex or that include etching access ports in their final configurations that are small relative to passage, channel, or cavity lengths. Embodiments of the present invention provide for removal of sacrificial material from these passages, channels or cavities using one or more initial or preliminary removal steps that occur prior to completion of the such passages that results from the completion of the layer forming steps. In some embodiments, first sacrificial material is replaced after a secondary solid sacrificial material after the initial removal step or steps. In other embodiments, the first sacrificial material is replaced after a liquid material after the initial removal step or steps. In some embodiments, desired structure formation may occur along or separately from one or more etchant directing manifolds that can force etchant into the passages, channels, and cavities.
摘要翻译：本发明的实施例涉及多层，多材料制造方法（例如电化学制造方法），其提供了在复杂微器件生产中提供改进的多功能性，特别是从复杂的通道，通道或腔中去除牺牲材料，蚀刻其相对于通道，通道或腔长度较小的最终构造的进入端口。本发明的实施例提供了从这些通道，通道或空腔中去除牺牲材料，使用在完成层形成步骤后产生的这种通道完成之前发生的一个或多个初始或初步去除步骤。在一些实施例中，在初始移除步骤或步骤之后，在第二固体牺牲材料之后，替换第一牺牲材料。在其它实施例中，在初始移除步骤或步骤之后，在液体材料之后替换第一牺牲材料。在一些实施方案中，期望的结构形成可以沿着或分开地与一个或多个蚀刻剂导向歧管发生，其可以迫使蚀刻剂进入通道，通道和空腔。

44. 发明申请

US20110132767A1 Multi-Layer, Multi-Material Fabrication Methods for Producing Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties 有权
标题翻译：用于生产具有增强的电气和/或机械性能的微尺度和毫米级装置的多层，多材料制造方法
公开(公告)号：US20110132767A1
公开(公告)日：2011-06-09
申请号：US12906970
申请日：2010-10-18
申请人： Ming Ting Wu , Rulon Joseph Larsen, III , Young Kim , Kieun Kim , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
发明人： Ming Ting Wu , Rulon Joseph Larsen, III , Young Kim , Kieun Kim , Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/48
CPC分类号： G01R1/06716 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06744 , G01R1/06755 , G01R3/00 , H01L21/4853
摘要： Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions. Each of these groups of embodiments incorporate both the core material and the coating material during the formation of each layer and each layer is also formed with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a genuine structural material while in others it may be only a functional structural material (i.e. a material that would be removed with sacrificial material if it were accessible by an etchant during removal of sacrificial material.
摘要翻译：本发明的一些实施方案涉及用于从芯材料和部分涂覆结构表面的壳或涂层材料形成结构或器件（例如用于半导体器件的晶片级测试的微探针）的电化学制造方法。其它实施方案涉及用于从芯材和壳或涂层材料制造结构或器件（例如微探针）的电化学制造方法，其完全涂覆形成探针的每个层的表面，包括中间层区域。本发明的另外的实施方案涉及用于从核心材料和壳或涂层材料形成结构或器件（例如微针）的电化学制造方法，其中涂层材料围绕结构的每一层定位，而不将涂层材料定位在相互之间，层区域。这些实施例组中的每一个在形成每个层期间都包括芯材料和涂层材料，并且每个层还形成有牺牲材料，该牺牲材料在形成所述结构的所有层之后被去除。在一些实施例中，芯材料可以是真正的结构材料，而在其它实施例中，其可以仅是功能性结构材料（即，如果在去除牺牲材料期间可通过蚀刻剂获得牺牲材料，则该材料将被除去。

45. 发明授权

US07830228B2 Miniature RF and microwave components and methods for fabricating such components 有权
标题翻译：微型射频和微波组件以及用于制造这些组件的方法
公开(公告)号：US07830228B2
公开(公告)日：2010-11-09
申请号：US11842947
申请日：2007-08-21
申请人： Elliot R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
发明人： Elliot R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
IPC分类号： H01P3/06 , H01P3/00
CPC分类号： H01P1/202 , B33Y10/00 , B33Y70/00 , B81B2201/042 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018
摘要： RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
摘要翻译：提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器，和/或其他主动或被动部件。部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。

46. 发明申请

US20100276077A1 Mesoscale and Microscale Device Fabrication Methods Using Split Structures and Alignment Elements 失效
标题翻译：中尺度和微尺度装置使用分割结构和对准元件的制造方法
公开(公告)号：US20100276077A1
公开(公告)日：2010-11-04
申请号：US12611795
申请日：2009-11-03
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
IPC分类号： B32B38/10 , B32B37/02
CPC分类号： C25D1/003 , B33Y10/00 , B81B2201/042 , B81C1/00293 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/10 , C25D5/022 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647 , Y10T156/10
摘要： Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
摘要翻译：本发明的各种实施例涉及使用电化学制造技术形成中尺度或微尺寸器件，其中结构由多个层形成为打开的结构，其可折叠或以其他方式组合以形成所需构造的结构。每个层由至少一种结构材料和至少一种牺牲材料形成。开放结构的初始形成可以促进牺牲材料的释放，形成较少层以完成结构的能力，将附加材料定位到结构中的能力，对结构打开时暴露的区域执行附加处理操作的能力和/ 或形成完全封装和可能中空结构的能力。

47. 发明申请

US20100136851A1 Fabrication Process for Co-Fabricating a Multilayer Probe Array and a Space Transformer 审中-公开
标题翻译：用于共同制造多层探针阵列和空间变压器的制造工艺
公开(公告)号：US20100136851A1
公开(公告)日：2010-06-03
申请号：US12639929
申请日：2009-12-16
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Christopher A. Bang , Pavel B. Lembrikov
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Christopher A. Bang , Pavel B. Lembrikov
IPC分类号： H01R13/40 , H01R43/16 , H01R43/00 , C25D5/00
CPC分类号： G01R3/00 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06716 , G01R1/07378 , Y10T29/49002 , Y10T29/4902 , Y10T29/49078 , Y10T29/49204 , Y10T29/49222
摘要： Embodiments of the invention provide electrochemical fabrication processes that may be used for the fabrication of space transformers or the co-fabrication of microprobe arrays along with one or more space transformers.
摘要翻译：本发明的实施例提供了可用于制造空间变压器或与一个或多个空间变压器一起共同制造微探针阵列的电化学制造工艺。

48. 发明申请

US20100065432A1 Electrochemical Fabrication Process Including Process Monitoring, Making Corrective Action Decisions, and Taking Appropriate Actions 审中-公开
公开(公告)号：US20100065432A1
公开(公告)日：2010-03-18
申请号：US12624257
申请日：2009-11-23
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Marvin M. Kilgo, III
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Marvin M. Kilgo, III
IPC分类号： C25D5/02
CPC分类号： C25D1/003 , B81B2201/042 , B81C99/004 , G01P15/0802 , G01P15/125 , H01L21/2885 , H01L21/4857 , H01L21/76879 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/241 , H05K3/243 , H05K3/4647
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.

49. 发明授权

US07640651B2 Fabrication process for co-fabricating multilayer probe array and a space transformer 失效
标题翻译：共同制造多层探针阵列和空间变压器的制造工艺
公开(公告)号：US07640651B2
公开(公告)日：2010-01-05
申请号：US11028945
申请日：2005-01-03
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Christopher A. Bang , Pavel B. Lembrikov
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Christopher A. Bang , Pavel B. Lembrikov
IPC分类号： H01F3/04 , H01F7/06
CPC分类号： G01R3/00 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06716 , G01R1/07378 , Y10T29/49002 , Y10T29/4902 , Y10T29/49078 , Y10T29/49204 , Y10T29/49222
摘要： Embodiments of the invention provide fabrication processes for the co-fabrication of microprobe arrays along with one or more space transformers wherein the fabrication processes include the forming and adhering of a plurality of layers to previously formed layers and wherein at least a portion of the plurality of layers are formed from at least one structural material and at least one sacrificial material that is at least in part released from the plurality of layers after formation and wherein the space transformer includes a plurality of interconnect elements that connect one side to the array of probes that has a first spacing to another side that has a second spacing where the second spacing is greater than the first spacing. In some embodiments, the fabrication process includes a plurality of electrodeposition operations.
摘要翻译：本发明的实施例提供了用于与一个或多个空间变压器共同制造微探针阵列的制造工艺，其中制造工艺包括将多个层形成和粘附到先前形成的层，并且其中多个层由至少一种结构材料和至少一种牺牲材料形成，所述至少一种牺牲材料在形成之后至少部分地从所述多个层释放，并且其中所述空间变换器包括将一侧连接到所述探针阵列的多个互连元件，具有第二间隔，第二间隔具有第二间隔，其中第二间隔大于第一间隔。在一些实施例中，制造工艺包括多个电沉积操作。

50. 发明申请

US20090197371A1 Integrated Circuit Packaging Using Electrochemically Fabricated Structures 审中-公开
标题翻译：使用电化学结构的集成电路封装
公开(公告)号：US20090197371A1
公开(公告)日：2009-08-06
申请号：US12349768
申请日：2009-01-07
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Christopher R. Folk , Marvin M. Kilgo, III
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Christopher R. Folk , Marvin M. Kilgo, III
IPC分类号： H01L21/50
CPC分类号： H01L21/4857 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/07378 , G01R3/00 , H01L23/13 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/1461 , H01L2924/15174 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.
摘要翻译：本发明的实施例提供了用于封装集成电路和/或具有包括导电互连元件的电化学制造的结构的其它电子部件的方法。在一些实施例中，电化学产生的结构被制造在包括导电通孔的衬底上，而在其他实施例中，衬底是导电材料的固体块，或者包含允许流体流动保持封装的电子部件的期望热性能的导电材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式