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41. 发明公开

EP4241540A1 COMPONENT CARRIER WITH ELECTRONIC COMPONENTS AND THERMALLY CONDUCTIVE BLOCKS ON BOTH SIDES 审中-实审
公开(公告)号：EP4241540A1
公开(公告)日：2023-09-13
申请号：EP21807037.3
申请日：2021-11-05
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： MORIANZ, Mike , STAHR, Johannes , PRESSLER, Simon , PRUTTI, Maria
IPC分类号： H05K1/02 , H05K1/18 , H05K3/42 , H05K3/46

42. 发明公开

EP3251167A1 COMPONENT CARRIER WITH INTEGRATED ANTENNA STRUCTURE 有权
标题翻译：具有集成天线结构的组件载体
公开(公告)号：EP3251167A1
公开(公告)日：2017-12-06
申请号：EP16701513.0
申请日：2016-01-26
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： KRISTL, Thomas , REITER, Martin , STAHR, Johannes , LEITGEB, Markus , GROBER, Gernot , SCHLAFFER, Erich
IPC分类号： H01Q1/38 , H01Q7/00 , H01Q13/10 , H01Q13/02 , H01Q9/26
摘要： An electronic assembly and a method for fabricating the same are disclosed. The assembly includes a component carrier, a wireless communication component and an antenna structure. The component carrier has at least one dielectric layer and a metallic layer. The wireless communication component is attached to the component carrier. The antenna structure is formed from a metallic material and is electrically connected with the wireless communication component. An opening formed in the component carrier extends from an upper surface into the interior of the component carrier. The antenna structure is formed at least partially at a wall of the opening.

43. 发明公开

EP3008753A1 LEISTUNGSMODUL 有权
公开(公告)号：EP3008753A1
公开(公告)日：2016-04-20
申请号：EP14726506.0
申请日：2014-05-06
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Johannes , ZLUC, Andreas , GROBER, Gernot , SCHWARZ, Timo
IPC分类号： H01L23/36 , H01L23/373 , H01L23/538 , H01L23/498
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/36 , H01L23/367 , H01L23/3735 , H01L23/49833 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/06181 , H01L2224/18 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2924/0002 , H01L2924/00
摘要： A power module having a printed circuit board core (1) that contains at least one electronic power component (7) embedded in an insulating layer (4), the core being arranged between two heat dissipation plates (2, 3), wherein each heat dissipation plate has a metal exterior layer (2a, 3a) and a metal interior layer (2i, 3i) that is electrically isolated from the latter by a thermally conductive, electrically insulating intermediate layer (2z, 3z), and electrode connections of the at least one power component are guided out of the core via connecting lines, wherein the printed circuit board core (1) has a conductor layer (5, 6) on both sides of the insulating layer (4), at least one conductor layer (5) is structured at least in sections and each conductor layer (5, 6) is connected, at least in sections, to a metal interior layer (2i, 3i) of the heat dissipation plate (2, 3) via a conductive, metal intermediate ply (16o, 16u), contacts (11) run from the structured conductor layer to the electrode connections of the at least one power component (7), and at least one power connection (7s) of the at least one power component (7) is connected to at least one section of the metal interior layer (2i) of the heat dissipation plate, which forms part of the connecting line to the electrode connection, via a contact (11), a section of a structured conductor layer (5) and the conductive, metal intermediate ply (16o).
摘要翻译：一种功率模块，其具有包含嵌入绝缘层（4）中的至少一个电子功率部件（7）的印刷电路板芯（1），所述芯布置在两个散热板（2,3）之间，其中每个热量所述散热板具有金属外层（2a，3a）和金属内层（2i，3i），所述金属内层通过导热的电绝缘中间层（2z，3z）与金属内层（2i，3i）电绝缘，所述金属内层其中印刷电路板芯（1）在绝缘层（4）的两侧上具有导体层（5,6），至少一个导体层（5））至少部分地构造并且每个导体层（5,6）至少部分地经由导电的金属中间体（3）与散热板（2,3）的金属内层（2i，3i）连接，层（16o，16u），触点（11）从结构化的导体层延伸到层所述至少一个功率部件（7）的电极连接以及所述至少一个功率部件（7）的至少一个功率连接（7s）连接到所述热量的所述金属内层（2i）的至少一个区段其通过接触件（11），结构化导体层（5）的一部分和导电金属中间层（16o）形成到电极连接的连接线的一部分。

44. 发明公开

EP2559327A1 VERFAHREN ZUR INTEGRATION EINES ELEKTRONISCHEN BAUTEILS IN EINE LEITERPLATTE SOWIE LEITERPLATTE MIT EINEM DARIN INTEGRIERTEN ELEKTRONISCHEN BAUTEIL 有权
标题翻译：法求解电子部件，电路板和电路板的带有内置集成IT电子元件
公开(公告)号：EP2559327A1
公开(公告)日：2013-02-20
申请号：EP11730863.5
申请日：2011-04-11
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Johannes , LEITGEB, Markus
IPC分类号： H05K1/18 , H05K3/46
CPC分类号： H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
摘要： In a method for integrating a component (3) into a printed circuit board, the following steps are provided: - providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), - arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and - connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.
摘要翻译：一种用于INTEGRA廷方法的部件到印刷电路板，包括以下步骤：提供两个完成印刷电路板元件，其更特别地由相互连接的板层或层中的多个，worin至少一个印刷电路板元件具有切口或凹陷，安排部件到印刷电路板元件中的一个或在所述至少一个印刷电路板元件的切口被集成，以及连接与所述部件的印刷电路板元件被容纳在该切口中，作为结果有可能在一个印刷电路板，以获得组件或传感器的安全和可靠的住宿。进一步，提供了一种这种类型的，其包括集成在其中的电子元件的的印刷电路板。

45. 发明公开

EP2452546A1 VERFAHREN ZUM HERSTELLEN EINER AUS WENIGSTENS ZWEI LEITERPLATTENBREICHEN BESTEHENDEN LEITERPLATTE SOWIE LEITERPLATTE 审中-公开
标题翻译：方法用于生产OUT至少两个LEITERPLATTENBREICHEN现有的电路板和电路板的
公开(公告)号：EP2452546A1
公开(公告)日：2012-05-16
申请号：EP10743002.7
申请日：2010-07-09
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： PLUDRA, Rainer , DROFENIK, Dietmar , STAHR, Johannes , GÖTZINGER, Siegfried , MARELJIC, Ljubomir
IPC分类号： H05K1/14 , H05K1/18 , H05K3/36 , H05K5/00 , H05K3/00
CPC分类号： H05K1/142 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/225 , H05K3/368 , H05K3/4691 , H05K3/4694 , H05K2201/0187 , H05K2201/09163 , H05K2201/09845 , H05K2203/1461 , Y10T29/49155
摘要： In a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions (20, 21, 22) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions (20, 21, 22) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions (20, 21, 22) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer (26), which is contact-connected via plated-through holes (23) to conductive layers or devices or components integrated in the printed circuit board regions (20, 21, 22) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions (20, 21, 22) to be connected to one another can be made available. Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions (20, 21, 22) is made available.
摘要翻译：在用于制造印刷电路板的至少两个印刷电路区域由......组成，worin印刷电路板区域，每个区域折衷至少一个导电层和/或至少一个设备或一次导电组分，worin印制电路板区域是一个方法连接到另外一个，在每种情况下的至少一个侧表面直接彼此邻接的区域中，被连接到彼此的耦合或连接，并且worin，耦合或印刷电路板的区域的连接之后，至少一个在印刷电路板的附加层或帘布层施加在所述印刷电路板的区域，所述另外的层被构造为导电层，所有这些是接触连接通过镀通孔到集成在印刷电路的导电层或器件或组件基板区域。

46. 发明授权

EP2027600B1 Verfahren zum Einbetten zumindest eines Bauelements in einem Leiterplattenelement 有权转让
标题翻译：一种用于在印刷电路板元件嵌入至少一个部件的方法
公开(公告)号：EP2027600B1
公开(公告)日：2012-01-11
申请号：EP07701291.2
申请日：2007-02-01
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： KRIECHBAUM, Arno , BAUER, Wolfgang , STAHR, Johannes , LIEBFAHRT, Sabine
IPC分类号： H01L23/538
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/82 , H01L24/83 , H01L2224/2402 , H01L2224/24051 , H01L2224/24226 , H01L2224/274 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01061 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0665 , H01L2924/12033 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/185 , H05K3/305 , H05K3/4652 , H05K2203/0191 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： The invention relates to a printed circuit board element (1) which comprises at least one component (2), embedded between a base (4) and a cover (6), and glued to the base (4) by means of an adhesive film section (3).

47. 发明授权

EP2119327B1 VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINER FLÄCHIGEN MATERIALSCHICHT 有权
标题翻译： VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINERFLÄCHIGENMATERIALSCHICHT
公开(公告)号：EP2119327B1
公开(公告)日：2011-10-26
申请号：EP08700293.7
申请日：2008-01-30
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEIDINGER, Gerald , LEITGEB, Markus , STAHR, Johannes , WEICHSLBERGER, Günther , ZLUC, Andreas
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/00 , H05K1/183 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , Y10T29/49155
摘要： The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.
摘要翻译：本发明涉及一种用于去除在连接步骤中连接到至少一个其它基本平坦的材料层（9）的基本平坦的材料层（2）的一部分的方法。根据本发明，其中材料层（2,9）不直接互连的区域设置在部件（11）稍后被移除的区域中，所述第一区域通过施加材料（8）来提供，所述材料防止待彼此相互连接的材料层。本发明还涉及一种多层结构以及该方法和多层结构的使用，特别是用于制造多层印刷电路板。

48. 发明公开

EP2286644A1 VERFAHREN ZUR INTEGRATION WENIGSTENS EINES ELEKTRONISCHEN BAUTEILS IN EINE LEITERPLATTE SOWIE LEITERPLATTE 有权
标题翻译：方法对于至少一个电子部件的电路板和电路板集成
公开(公告)号：EP2286644A1
公开(公告)日：2011-02-23
申请号：EP09753314.5
申请日：2009-05-29
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEICHSLBERGER, Günther , KRIECHBAUM, Arno , MORIANZ, Mike , HASLEBNER, Nikolai , STAHR, Johannes , HARING, Fritz , FREYDL, Gerhard , KOERTVELYESSY, Andrea , BEESLEY, Mark , ZLUC, Andreas , SCHRITTWIESER, Wolfgang
IPC分类号： H05K1/18
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24137 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15174 , H01L2924/351 , H05K1/0206 , H05K1/185 , H05K3/305 , H05K3/4652 , H05K2201/0355 , H05K2201/09845 , H05K2201/10507 , H05K2201/10674 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要： In a method for integrating at least one electronic component into a printed circuit board, the following steps are provided: providing a layer (4) of a printed circuit board for supporting the electronic component (1, 2, 3), applying an adhesive (5) to a surface of the layer (4), fixing the electronic component (1, 2, 3) on the layer (4) by means of the adhesive (5), applying or arranging at least one electrically conductive layer (8) on or at the component (1, 2, 3) at the side or surface remote from the adhesive (5), and patterning the electrically conductive layer (8) in accordance with the contacts (7) of the electronic component (1, 2, 3) and/or in accordance with conductor tracts to be formed on the printed circuit board. A printed circuit board produced in accordance with this method is furthermore provided.

49. 发明公开

EP2283714A2 VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE SOWIE VERWENDUNG UND LEITERPLATTE 审中-公开
标题翻译：一种用于生产电路板和使用，电路板
公开(公告)号：EP2283714A2
公开(公告)日：2011-02-16
申请号：EP09749320.9
申请日：2009-05-20
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEICHSLBERGER, Günther , STAHR, Johannes
IPC分类号： H05K1/02
CPC分类号： H05K3/328 , A47F3/001 , A47F11/10 , B23K35/0238 , B23K35/262 , B23K35/264 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K2201/36 , H05K3/244 , H05K3/3463 , H05K3/363 , H05K2203/0278 , Y10T29/4913
摘要： The invention relates to a method for fixing a component (6) to or in a printed circuit board (1) and/or for connecting individual elements of a printed circuit board, wherein regions of a component (6) and/or of a printed circuit board (1) to be interconnected or to be fixed to one another are provided with at least one respective solder layer (4, 5, 9, 10), the solder layers (4, 5, 9, 10) are contacted with each other and are interconnected at a pressure and a temperature that is elevated above ambient conditions, an intermetallic diffusion layer (12) being formed, thereby achieving a high-strength connection. The invention further relates to the use of said method and to a printed circuit board (1).

50. 发明授权

EP2195693B1 STARR-FLEXIBLES LEITERPLATTENELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
标题翻译： STARR柔性电路板元件与方法研究
公开(公告)号：EP2195693B1
公开(公告)日：2017-02-15
申请号：EP08782849.7
申请日：2008-09-11
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LANGER, Gregor , STAHR, Johannes
IPC分类号： H05K1/02 , G02B6/43 , G02B6/138 , H05K3/46
CPC分类号： G02B6/43 , G02B6/138 , G02B6/4214 , H05K1/0274 , H05K3/4691 , H05K2201/09127

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