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    • 43. 发明公开
    • 화학 증폭 레지스트 수지
    • 树脂为化学稳定剂
    • KR1020000056326A
    • 2000-09-15
    • KR1019990005542
    • 1999-02-19
    • 주식회사 동진쎄미켐
    • 정윤식현승일최용준김양숙김현진김덕배최세진
    • C08F12/32
    • C08F212/08G03F7/004G03F7/0392H01L21/027
    • PURPOSE: Resins for use in chemically amplified resists and a resist composition using the same are provided which can form a fine pattern of excellent resolution on a wafer in a photolithography process. CONSTITUTION: A polymer resins represented by the formula 1 and a chemically amplified resist composition having photosensitivity on short wavelength (deep UV) and containing the polymer resins are described. In formula, R1,R2 are each independently H or methyl, R3 is methyl, ethyl, n-butyl, 4-hydroxybutyl or cyclohexyl, R4 is Cl, Br, hydroxy, cyano, t-butoxy, CH2NH2, CONH2, CH=NH, CH(OH)NH2 or C(OH)=NH, R5 is H or methyl, x is a polymerization degree of 0.1 to 08, y is a polymerization degree of 0.1 to 0.8, The polymer resins have a molecular weight of 3,000 to 30,000 and a degree of dispersion of 1.01 to 3.00
    • 目的:提供用于化学放大抗蚀剂的树脂和使用其的抗蚀剂组合物,其可以在光刻工艺中在晶片上形成优异分辨率的精细图案。 构成:描述由式1表示的聚合物树脂和在短波长(深UV)上具有光敏性并含有聚合物树脂的化学放大抗蚀剂组合物)。 在式中,R 1,R 2各自独立地为H或甲基,R 3为甲基,乙基,正丁基,4-羟基丁基或环己基,R 4为Cl,Br,羟基,氰基,叔丁氧基,CH 2 NH 2,CONH 2,CH = NH ,CH(OH)NH 2或C(OH)= NH,R 5为H或甲基,x为聚合度为0.1〜08,y为聚合度为0.1〜0.8。聚合物树脂的分子量为3000〜 30,000,分散度为1.01〜3.00
    • 45. 发明授权
    • 포토레지스트 패턴 코팅용 고분자 및 이를 이용한 반도체 소자의 패턴 형성 방법
    • 用于光刻胶图案涂布的聚合物和使用其的半导体器件的图案形成方法
    • KR101618316B1
    • 2016-05-09
    • KR1020090016965
    • 2009-02-27
    • 주식회사 동진쎄미켐
    • 이정열이재우김덕배김재현
    • G03F7/004
    • G03F7/40
    • 리쏘그래피공정의해상도를증가시킬수 있는포토레지스트패턴코팅용고분자및 이를이용한반도체소자의패턴형성방법이개시된다. 상기포토레지스트패턴코팅고분자는하기화학식으로표시된다. 상기화학식에서, R은각각독립적으로수소원자또는메틸기(-CH)이고, R은탄소수 1 내지 18의선형또는환형탄화수소기이고, R는히드록시기(-OH), 카르복실기(-COOH), 또는탄소수 3 내지 10, 질소수 1 내지 3 및산소수 1 내지 3의선형또는환형탄화수소기이며, x 및 y는상기화학식의고분자를구성하는전체반복단위에대한각각의반복단위의몰%로서, x는 5 내지 100몰%이고, y는 0 내지 95 몰%이다.
    • 公开了一种能够提高光刻工艺的分辨率的用于光致抗蚀剂图案涂覆的聚合物以及一种用于形成使用该聚合物的半导体器件的图案的方法。 光致抗蚀剂图案涂层聚合物由下式表示。 R是具有1至18个碳原子的直链或环状烃基,R是羟基(-OH),羧基(-COOH)或具有3至3个碳原子的基团 对于10,氮数为1至3,氧数为1至3,x和y是相对于构成上式的聚合物的所有重复单元的每个重复单元的摩尔%,x是5 至100摩尔%,y为0至95摩尔%。
    • 50. 发明公开
    • 감광성 고분자 및 이를 포함하는 포토레지스트 조성물
    • 光敏聚合物和光催化剂组合物,包括它们
    • KR1020110027377A
    • 2011-03-16
    • KR1020090085445
    • 2009-09-10
    • 주식회사 동진쎄미켐
    • 제갈진김정우김덕배김재현
    • G03F7/004
    • G03F7/0045G03F7/004G03F7/0047G03F7/20
    • PURPOSE: Photo-sensitive polymer and a photo-resist composition including the same are provided to reduce the non-uniformity of the photo-sensitive polymer by easily controlling the molecular weight of the photo-sensitive polymer. CONSTITUTION: Photo-sensitive polymer is represented by chemical formula 1. In the chemical formula 1, R1, R2, and R3 are hydrogen or a methyl group. A is C2 to C120 linear or branched alkyl group, in which a part or whole hydrogen atoms are substituted fluorine, with or without an ester group. X is C1 to C40 linear, branched, monocyclic, or polycyclic alkyl group. Y is C1 to C40 linear, branched, monocyclic, or polycyclic alkyl group with a lactone group. Z isC1 to C40 linear, branched, monocyclic, or polycyclic alkyl group, capable of being substituted with a hydroxyl group, or a hydroxyl group and a halogen group, with an ether group or an ester group. n is 1 to 15 of integer.
    • 目的:提供光敏聚合物和包含它们的光致抗蚀剂组合物,以通过容易地控制光敏聚合物的分子量来降低光敏聚合物的不均匀性。 构成:光敏聚合物由化学式1表示。在化学式1中,R 1,R 2和R 3为氢或甲基。 A是C2〜C120直链或支链烷基,其中部分或全部氢原子是取代的氟,具有或不具有酯基。 X是C1至C40直链,支链,单环或多环烷基。 Y是具有内酯基团的C1至C40直链,支链,单环或多环烷基。 Z为具有醚基或酯基的能够被羟基或羟基和卤素取代的C 1〜C 40直链,支链,单环或多环烷基。 n为1〜15的整数。