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41. 发明专利

JP2005354112A Carrier component with cleaning facility, and cleaning method for substrate processing apparatus using the carrier component 有权
标题翻译：具有清洁设施的承载部件和使用载体部件的基板处理装置的清洁方法
公开(公告)号：JP2005354112A
公开(公告)日：2005-12-22
申请号：JP2005242842
申请日：2005-08-24
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , NAMIKAWA AKIRA
IPC分类号： H01L21/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a carrier component with a cleaning facility for a board processing apparatus that is apt to be damaged by foreign matters, such as manufacturing and inspection equipment for semiconductors, flat-panel display units and printed circuit boards.
SOLUTION: There is provided a carrier component with a cleaning facility to remove foreign matters, by carrying components into the substrate processing apparatus. The main feature of the carrier component with the cleaning facility is the arrangement of a cleaning layer composed of materials with a surface free energy of 30 to 60 mJ/m
2 on the carrier component and a contact angle with water of 50 to 90 degrees. In particular, the cleaning layer is arranged directly on the carrier component, with the cleaning facility structured as stated above.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供载体部件具有用于半导体制造和检查设备，平板显示单元和印刷电路板的易于被异物损坏的板加工装置的清洁设备。解决方案：提供具有清洁设备的载体部件，以通过将部件携带到基板处理装置中来除去异物。具有清洁设备的载体部件的主要特征是由载体部件上的表面自由能为30至60mJ / m 2 / SP>的材料构成的清洁层的布置，并且与水为50〜90度。特别地，清洁层直接布置在载体部件上，清洁装置如上所述构成。版权所有（C）2006，JPO＆NCIPI

42. 发明专利

JP2005329322A Method of cleaning carrying member having cleaning function 审中-公开
标题翻译：清洁带有清洁功能的构件的方法
公开(公告)号：JP2005329322A
公开(公告)日：2005-12-02
申请号：JP2004149858
申请日：2004-05-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： UENDA DAISUKE , ISHIZAKA HITOSHI , TERADA YOSHIO , FUNATSU ASAMI
IPC分类号： B08B1/02 , C09D201/00 , C09J201/00 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a carrier member having a cleaning function which permits convenient and reliable removal of foreign matter adhered to the inside of substrate-processing equipment without contamination of the equipment when the member is carried into the equipment.
SOLUTION: Forming a carrying member with a cleaning function having a cleaning layer on the member, the method comprises protecting the back surface of the member preliminarily with a protective material, forming a cleaning layer on the principal surface of the member with the back surface as protected and cleaning the back surface to reduce the level of contaminants, e.g. particles, metal impurities and silicone impurities, so as to obtain a low-contamination carrier member having a cleaning function. The cleaning of the back surface comprises a process of removing a part or the whole of the protective material or a process of cleaning with the protective material left on the member.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有清洁功能的载体构件，其允许方便可靠地去除附着到基板处理设备的内部的异物，而不会在构件被携带到设备中时污染设备。解决方案：在构件上形成具有清洁功能的清洁功能的承载构件，该方法包括用保护材料预先保护构件的后表面，在构件的主表面上形成清洁层，背面被保护并清洁后表面以降低污染物的水平，例如颗粒，金属杂质和硅氧烷杂质，以获得具有清洁功能的低污染载体构件。后表面的清洁包括去除保护材料的一部分或整体的过程或用保留在构件上的保护材料进行清洁的过程。版权所有（C）2006，JPO＆NCIPI

43. 发明专利

JP2005286261A Transfer member having cleaning function and method of cleaning substrate processing apparatus 审中-公开
标题翻译：具有清洁功能的传送构件和清洁基板处理装置的方法
公开(公告)号：JP2005286261A
公开(公告)日：2005-10-13
申请号：JP2004101760
申请日：2004-03-31
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUNATSU ASAMI , KOBAYASHI KENTARO , TERADA YOSHIO , UENDA DAISUKE
IPC分类号： H01L21/67 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a transfer member having a cleaning function which is transferred into a substrate processing apparatus to more securely remove foreign matters adhering to the inside of the apparatus. SOLUTION: The transfer member having a cleaning function possesses a cleaning layer on at least one surface of the transfer member. The foreign matters adhering to the inside of the substrate processing apparatus are adsorbed by the cleaning layer to remove the foreign matters for cleaning. The cleaning layer has a percentage of 20% or larger with respect to the area that contacts the objective parts of the substrate processing apparatus for removing foreign matters. In particular, the transfer member having a cleaning function is constituted by pasting a cleaning sheet on at least one surface of the transfer member via an adhesive layer, wherein the cleaning sheet has the cleaning layer on one-surface side of the supporting body of the sheet and the adhesive layer on the other-surface side of the same. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有清洁功能的转印部件，该转印部件被转印到基板处理装置中，以更可靠地去除附着在装置内部的异物。解决方案：具有清洁功能的转印部件在转印部件的至少一个表面上具有清洁层。附着在基板处理装置内部的异物被清洁层吸附，以去除用于清洁的异物。清洁层相对于与用于除去异物的基板处理装置的目标部件接触的区域的百分比为20％以上。特别地，具有清洁功能的转印部件通过经由粘合剂层将清洁片粘贴在转印部件的至少一个表面上而构成，其中清洁片具有在支撑体的单面侧上的清洁层片材和其另一面上的粘合剂层。版权所有（C）2006，JPO＆NCIPI

44. 发明专利

JP2005268483A Manufacturing method of conveying member with cleaning function, its manufacturing device, and the cleaning method of substrate processing device 审中-公开
标题翻译：具有清洁功能的成员输送的制造方法及其制造装置以及基板处理装置的清洁方法
公开(公告)号：JP2005268483A
公开(公告)日：2005-09-29
申请号：JP2004077856
申请日：2004-03-18
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , YAMAMOTO MASAYUKI , UENDA DAISUKE , NAKAI KOTA
IPC分类号： H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a cleaning member removing simply and certainly the foreign substance which has adhered in a processing device without contaminating the processing device at the time of conveying a conveying member in the processing device, by avoiding the contamination caused by particles, metal impurities or the like in the manufacturing of the conveying member with a cleaning function.
SOLUTION: The manufacturing method of the conveying member with a cleaning function having a cleaning layer on the conveying member uses a device which carries in the conveying member and provides a cleaning layer thereon, and performs in advance a fluorine system resin coating treatment to the part brought into contact with the conveying member of this device. Especially, the device serves as a device which carries the conveying member and adheres a cleaning sheet having the cleaning layer on the member.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种清洁部件，通过避免污染造成的污染，简单而可靠地除去粘附在处理装置中的异物，而不会在处理装置中输送输送部件时污染加工装置通过颗粒，金属杂质等制造具有清洁功能的输送部件。解决方案：具有清洁功能的输送部件在输送部件上具有清洁层的制造方法使用承载输送部件并在其上提供清洁层的装置，并预先执行氟系树脂涂布处理到与该装置的输送构件接触的部分。特别地，该装置用作承载输送构件并将具有清洁层的清洁片粘附在构件上的装置。版权所有（C）2005，JPO＆NCIPI

45. 发明专利

JP2005103347A Cleaning sheet and cleaning method of substrate treatment apparatus 有权
标题翻译：基板处理装置的清洁和清洁方法
公开(公告)号：JP2005103347A
公开(公告)日：2005-04-21
申请号：JP2003336788
申请日：2003-09-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUNATSU ASAMI , TERADA YOSHIO , UENDA DAISUKE , NAMIKAWA AKIRA
IPC分类号： A47L13/16 , B08B1/02 , C23C14/00 , C23C16/44 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a cleaning member having high practicality capable of suppressing the lowering of a degree of vacuum when fed into a substrate treatment apparatus of a vacuum system and shortening the arrival time to a prescribed degree of vacuum without causing trouble in the use of the substrate treatment apparatus.
SOLUTION: This cleaning sheet (1) has a three-layered structure of cleaning layer/support/tackifier layer and is characterized in that a rate of normal state moisture absorption is 0.7% or below and an amount of normal state moisture absorption is 100 μg/cm
2 or below at a temperature of 23°C and a relative humidity of 50%. The cleaning sheet (2) has a two-layered structure of cleaning layer/tackifier layer and is characterized in that the rate of normal state moisture absorption is 0.8% or below and the amount of normal state moisture absorption is 50 μg/cm
2 or below. The cleaning sheet (3) has a single-layered structure comprising the cleaning layer and is characterized in that the rate of normal state moisture absorption is 1.0% or below and the amount of normal state moisture absorption is 40 μg/cm
2 or below.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种清洁部件，其具有高的实用性，能够抑制真空系统的基板处理装置中的真空度的降低，并且将到达时间缩短至规定的真空度而不引起使用基板处理装置的麻烦。解决方案：该清洁片（1）具有清洁层/支撑/增粘层的三层结构，其特征在于正常状态吸湿率为0.7％以下，正常状态吸湿量在23℃的温度和50％的相对湿度下，为100μg/ cm 2 / SP以下。清洁片（2）具有清洁层/增粘层的双层结构，其特征在于正常状态吸湿率为0.8％以下，正常状态吸湿量为50μg/ cm 2 > 2 或以下。清洁片（3）具有包括清洁层的单层结构，其特征在于正常状态吸湿率为1.0％以下，正常状态吸湿量为40μg/ cm 2 或以下。版权所有（C）2005，JPO＆NCIPI

46. 发明专利

JP2005032971A Cleaning method of substrate processing apparatus 审中-公开
标题翻译：基板加工设备清洗方法
公开(公告)号：JP2005032971A
公开(公告)日：2005-02-03
申请号：JP2003196176
申请日：2003-07-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MARUOKA NOBUAKI , TERADA YOSHIO , KAMIBAYASHI MASAHIRO
IPC分类号： B08B1/02 , H01L21/02 , H01L21/304 , H01L21/677 , H01L21/68
CPC分类号： B08B7/0028
摘要： PROBLEM TO BE SOLVED: To provide a cleaning method to easily and surely remove foreign matters having the particle size of about 0.2 to 3 μm adhered within a substrate processing apparatus.
SOLUTION: In the cleaning method for cleaning the substrate processing apparatus using a cleaning sheet having a cleaning layer, at least two kinds of cleaning sheets are used, in which arithmetic average roughness Ra and the maximum surface roughness Rmax of the cleaning layer are different. Particularly, the cleaning sheet having the arithmetic average roughness Ra under 0.01 μm and the maximum surface roughness Rmax under 0.1 μm and the cleaning sheet having the arithmetic average roughness of 0.01 to 0.05 μm and the maximum surface roughness Rmax of 0.1 to 2 μm are used.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种清洁方法，以容易且可靠地除去附着在基板处理装置内的粒径约为0.2〜3μm的异物。解决方案：在使用具有清洁层的清洁片清洁基板处理设备的清洁方法中，使用至少两种清洁片，其中清洁层的算术平均粗糙度Ra和最大表面粗糙度Rmax 是不同的。特别地，使用具有0.01μm以下的算术平均粗糙度Ra和0.1μm以下的最大表面粗糙度Rmax以及算术平均粗糙度为0.01〜0.05μm，最大表面粗糙度Rmax为0.1〜2μm的清洁片。版权所有（C）2005，JPO＆NCIPI

47. 发明专利

JP2005019841A Method and device for adhering ultraviolet curing type self-adhesive tape and article formed by using the same 审中-公开
标题翻译：用于加入超紫外线固化型自粘胶带的方法和装置以及使用其形成的制品
公开(公告)号：JP2005019841A
公开(公告)日：2005-01-20
申请号：JP2003185006
申请日：2003-06-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YAMAMOTO MASAYUKI , TERADA YOSHIO
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and device for adhering ultraviolet curing type self-adhesive tape to adhere a self-adhesive tape preliminarily irradiated with an ultraviolet ray so that the self-adhesive materials of the almost outline section of a work can be hardened to the work, and to cut the cured section.
SOLUTION: An ultraviolet curing type self-adhesive tape T a predetermined portion of which an adhesive material curing pattern P is formed by preliminarily irradiating it with an ultraviolet ray so that adhesive materials has been hardened, is supplied to a wafer W. In this case, a mark M positioned at the center of the pattern P is detected by an optical sensor in the width direction of the self-adhesive tape T, and the feeding of the self-adhesive tape T is controlled based on the detection result so that its positioning can be carried out. When the positioning is decided, the self-adhesive tape T is attached to the surface of the wafer W with an adhering unit. The adhered self-adhesive tape T is cut along the section of the pattern P, that is, the outline of the wafer W.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于粘附紫外线固化型自粘带的方法和装置，以将预先照射紫外线的自粘带粘附在一起，使得自工作可以硬化工作，并切割固化部分。
解决方案：通过用紫外线预先形成粘合剂固化图案P的预定部分以使粘合剂材料已经硬化的紫外线固化型自粘合带T被供给到晶片W. 在这种情况下，位于图案P的中心的标记M通过光学传感器在自粘带T的宽度方向上检测，并且基于检测结果来控制自粘带T的供给从而可以进行定位。当确定定位时，用粘合单元将自粘带T附接到晶片W的表面。附着的自粘带T沿着图案P的截面，即晶片W的轮廓被切割。版权所有（C）2005，JPO＆NCIPI

48. 发明专利

JP2005000832A Cleaning member and cleaning method for use in substrate treating apparatus 审中-公开
标题翻译：清洁会员和清洁方法用于基板处理设备
公开(公告)号：JP2005000832A
公开(公告)日：2005-01-06
申请号：JP2003168010
申请日：2003-06-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAMIKAWA AKIRA , TERADA YOSHIO
IPC分类号： B08B7/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a cleaning member and a cleaning method which ensure both removibility and conveyability of foreign matters, and can easily and exactly remove foreign matters clinging to either a treating-table or a substrate-conveyance system of a substrate treating apparatus.
SOLUTION: The cleaning-member is characterized by disposing a foreign matter removing layer upon a conveyance member. The elastic modulus of the foreign matter removing layer changes within 50% at a temperature range of 20°C-400°C, and specifically becomes 1,000 MPa or less at 20°C. The cleaning method is characterized by carrying the cleaning-member into the substrate treating apparatus and removing the foreign matters clinging therein.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种确保异物的可移除性和可输送性的清洁构件和清洁方法，并且可以容易且精确地除去附着在处理台或基板输送系统中的异物基板处理装置。解决方案：清洁部件的特征在于将异物去除层设置在传送部件上。异味除去层的弹性模量在20℃-400℃的温度范围内变化50％以下，在20℃下具体为1000MPa以下。清洁方法的特征在于将清洁构件携带到基材处理装置中并除去粘附在其中的异物。版权所有（C）2005，JPO＆NCIPI

49. 发明专利

JP2004235172A Cleaning sheet and method for cleaning substrate treatment equipment 有权
标题翻译：清洁片和清洗基板处理设备的方法
公开(公告)号：JP2004235172A
公开(公告)日：2004-08-19
申请号：JP2003018151
申请日：2003-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , NAMIKAWA AKIRA , TOYODA HIDESHI
IPC分类号： B08B1/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a cleaning member which does not generate contamination equipment by metallic impurities when a cleaning sheet is carried into the substrate treatment equipment and foreign substances in the equipment are cleaned and removed.
SOLUTION: The cleaning sheet having a cleaning layer in which the contents of each metallic element of Na, K, Mg, A1, Ca, Ti, Cr, Mn, Fe, Co, Ni, Cu and Zn or their compounds are 5 ppm (μg/g) or less respectively in terms of the metallic elements, on one surface of a supporter for the substrate treatment equipment and having a pressure-sensitive adhesive layer on the other surface and a carrying member having a cleaning function, in which the cleaning sheet is laminated on the carrying member through the pressure-sensitive adhesive layer, are carried into the equipment. Accordingly, the cleaning member is obtained which does not generate the contamination of the equipment by the metallic impurities and has a high practicality.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种清洁部件，当将清洁片材运送到基板处理设备中并且清洁和去除设备中的异物时，不会由金属杂质产生污染设备。解决方案：具有清洗层的清洁片，其中Na，K，Mg，Al，Ca，Ti，Cr，Mn，Fe，Co，Ni，Cu和Zn或其化合物的各金属元素的含量为在金属元素方面分别为5ppm（μg/ g）或更低，在用于基底处理设备的支撑体的一个表面上并且在另一个表面上具有压敏粘合剂层和具有清洁功能的承载构件清洁片通过压敏粘合剂层层压在承载构件上，被输送到设备中。因此，获得了不会由金属杂质产生设备污染并且具有高实用性的清洁部件。版权所有（C）2004，JPO＆NCIPI

50. 发明专利

JP2014167094A Thermally conductive adhesive sheet 有权
标题翻译：导热粘合片
公开(公告)号：JP2014167094A
公开(公告)日：2014-09-11
申请号：JP2013261727
申请日：2013-12-18
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TERADA YOSHIO , FURUTA KENJI , TOJO MIDORI
IPC分类号： C09J7/00 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet excellent in thermal conductivity and electric insulation.SOLUTION: A thermally conductive adhesive sheet has an adhesive layer, has a thermal conductivity of 0.5 W/mK or more, and has a relative permittivity of 30 or less measured at a frequency of 120 Hz after being left for one day in the atmosphere of 40°C and 92% RH. Preferably, the thermally conductive adhesive sheet has a relative permittivity of 30 or less measured at a frequency of 1 kHz after being left for one day in the atmosphere of 40°C and 92% RH.
摘要翻译：要解决的问题：提供导热性和电绝缘性优异的导热性粘合片。解决方案：导热性粘合片具有粘合剂层，导热率为0.5W / m·K以上，并且具有相对介电常数在40℃和92％RH的气氛中放置1天后以120Hz的频率测量30或更小。优选地，导热粘合片在40℃和92％RH的气氛中放置1天后，其频率为1kHz时的相对介电常数为30以下。

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