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41. 发明授权

EP1908853B1 METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER AND METHOD OF RECOVERING TIN 有权
标题翻译：用于无铅很多关于回收锡铜的分离及其方法
公开(公告)号：EP1908853B1
公开(公告)日：2012-09-05
申请号：EP06781546.4
申请日：2006-07-25
申请人： Nihon Superior Sha Co., Ltd
发明人： NISHIMURA, Tetsuro
IPC分类号： C22B25/08 , C22B9/02 , C22B9/10 , H05K3/34
CPC分类号： C22B9/02 , C22B9/023 , C22B15/006 , C22B25/08 , H05K3/3463 , Y02P10/234

42. 发明公开

EP2377956A1 Device for copper precipitation in lead-free solder, granulation and separation of (cux) 6sn5 compounds and recovery of tin 有权
标题翻译：在无铅焊料，造粒和（的CuX）6 Sn 5类化合物的分离和锡的回收为铜沉淀的装置
公开(公告)号：EP2377956A1
公开(公告)日：2011-10-19
申请号：EP11005760.1
申请日：2006-07-25
申请人： Nihon Superior Sha Co., Ltd
发明人： Nishimura, Tetsuro
IPC分类号： C22B25/08 , C22B9/02 , C22B9/10 , H05K3/34
CPC分类号： C22B9/02 , C22B9/023 , C22B15/006 , C22B25/08 , H05K3/3463 , Y02P10/234
摘要： The purpose of the present invention is to provide equipment for separating excess copper dissolved in a lead-free solder bath and recovering purified tin with high efficiency. An element X for forming a (CuX) 6 Sn 5 compound between copper and tin in molten lead-free solders is added in an precipitation container to separate out a (CuX) 6 Sn 5 compound. Tin is recovered by binding the (CuX) 6 Sn 5 compound by passing thereof through a multi-perforated plate in a granulation container, further generating swirling currents to precipitate and separate the bound (CuX) 6 Sn 5 compounds in a separation container and removing thereof.
摘要翻译：本发明的目的是提供一种用于分离过量铜的无铅焊料浴中溶解和回收效率高纯化锡提供设备。对于在熔融无铅焊料形成铜和锡之间的（的CuX）6Sn5化合物的元素X在沉淀容器以分离出一个（的CuX）6 Sn的5化合物加入。锡是通过在成粒容器它们穿过多穿孔板，此外产生漩电流在一个分离容器以沉淀和分离结合的（的CuX）6 Sn的5种化合物和除去结合（的CuX）6 Sn的5化合物回收它们。

43. 发明公开

EP1911543A1 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH 有权
标题翻译：无铅很多关于用于控制焊浴浓度与CU-NI浓度的另外供给和方法
公开(公告)号：EP1911543A1
公开(公告)日：2008-04-16
申请号：EP06781247.9
申请日：2006-07-19
申请人： Nihon Superior Sha Co., Ltd
发明人： NISHIMURA, Tetsuro
IPC分类号： B23K35/26 , B23K1/08 , C22C13/00 , H05K3/24 , H05K3/34 , B23K101/38
CPC分类号： B23K1/08 , B23K1/0016 , B23K35/262 , B23K2201/42 , C22C13/00 , H05K3/3463 , H05K3/3468
摘要： Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.
摘要翻译：无铅焊料被补充到焊料浴中以接收一具有工作铜，工作要处理的后续使用在气刀或在焊接工艺。补充的无铅焊料的Sn包括作为主要成分和至少0时01分至0.5质量％的Ni。通过补充具有上述组成的无铅焊料时，焊料浴的密度，被急剧变化用于使用HASL装置的一个和其在适当的范围内被快速恢复到内。

44. 发明授权

EP2243590B1 METHOD OF REGULATING NICKEL CONCENTRATION IN LEAD-FREE SOLDER CONTAINING NICKEL 失效
公开(公告)号：EP2243590B1
公开(公告)日：2020-04-15
申请号：EP08711815.4
申请日：2008-02-22
申请人： Nihon Superior Sha Co., Ltd
发明人： NISHIMURA, Tetsuro
IPC分类号： B23K35/26 , B23K1/08 , B23K35/40 , C22B9/10 , C22C1/02 , C22C3/00 , H05K3/34 , C22C13/00 , B23K1/20 , B23K1/018 , C22C1/03 , C22B25/08

45. 发明授权

EP2096182B1 APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER 有权
标题翻译：设备，用于无铅很多剩余的铜沉淀/分离
公开(公告)号：EP2096182B1
公开(公告)日：2011-11-30
申请号：EP06834703.8
申请日：2006-12-14
申请人： Nihon Superior Sha Co., Ltd
发明人： NISHIMURA, Tetsuro
IPC分类号： C22B25/06 , B23K3/08 , C22B7/00 , C22B9/10
CPC分类号： C22B25/08 , C22B9/10 , C22B15/006
摘要： An apparatus for precipitating/separating excess copper which has dissolved in a lead-free solder comprising tin as the main ingredient. With the apparatus, the tin is safely and efficiently recovered. The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper. It has a constitution comprising: a precipitation tank (2) in which a lead-free solder containing copper dissolving therein is kept in a molten state and an intermetallic compound among a metal added externally, the copper contained in the molten solder, and the tin contained in the molten solder is precipitated while maintaining the molten state; a granulation tank (4) which has perforated plates (31), (32), and (33) and in which the molten lead-free solder is passed through the perforated plates to thereby bond particles of the intermetallic compound to one another and increase the particle diameter thereof; and a separation tank (5) in which the enlarged intermetallic compound particles are sedimented in the molten lead-free solder and separated.

46. 发明公开

EP2218540A1 SOLDER JOINT 有权
标题翻译： LÖTVERBINDUNG
公开(公告)号：EP2218540A1
公开(公告)日：2010-08-18
申请号：EP08840759.8
申请日：2008-10-20
申请人： Nihon Superior Sha Co., Ltd
发明人： NISHIMURA, Tetsuro
IPC分类号： B23K35/26 , C22C13/00
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , H05K3/3457 , Y10T428/12708
摘要： A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt% Cu, 0.001-6 wt% Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt% and preferably 0.03 wt%. The upper limit of the range of Ni is 0.3 wt% and preferably 0.1 wt%. The lower limit of the range of Cu is 0.1 wt% and preferably 0.2 wt%. The upper limit of the range of Cu is 7 wt% and preferably 0.92 wt%. The invention includes the solder joint essentially having these compositions.
摘要翻译：一种由基本上由0.01-7.6重量％Cu，0.001-6重量％Ni和其余Sn组成的合金制成的焊点。 Cu和Ni中的每一个都具有最大浓度范围。 Ni的范围的下限为0.01重量％，优选为0.03重量％。 Ni的范围的上限为0.3重量％，优选为0.1重量％。 Cu的范围的下限为0.1重量％，优选为0.2重量％。 Cu的范围的上限为7重量％，优选为0.92重量％。本发明包括基本上具有这些组合物的焊接接头。

47. 发明公开

EP2096182A4 APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER 有权
标题翻译：设备，用于无铅很多剩余的铜沉淀/分离
公开(公告)号：EP2096182A4
公开(公告)日：2010-03-31
申请号：EP06834703
申请日：2006-12-14
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： C22B25/06 , B23K3/08 , C22B7/00 , C22B9/10
CPC分类号： C22B25/08 , C22B9/10 , C22B15/006

48. 发明公开

EP1908853A4 METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN 有权
标题翻译：用于无铅很多，法求解制粒（CUX）6 Sn 5类连接和方法为它进行恢复锡的分离及其方法分离铜
公开(公告)号：EP1908853A4
公开(公告)日：2010-03-17
申请号：EP06781546
申请日：2006-07-25
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： C22B25/08 , C22B9/02 , C22B9/10 , H05K3/34
CPC分类号： C22B9/02 , C22B9/023 , C22B15/006 , C22B25/08 , H05K3/3463 , Y02P10/234
摘要： The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) 6 Sn 5 compound between copper and tin in molten lead-free solders is added to separate out a (CuX) 6 Sn 5 compound. Tin is recovered by binding the (CuX) 6 Sn 5 compound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX) 6 Sn 5 compounds and removing thereof.

49. 发明公开

EP2096182A1 APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER 有权
标题翻译： VORRICHTUNG ZUR AUSFLLUNG / ABTRENNUNG VONÜBERSCHÜSSIGEMKUPFER在BLEIFREIEM LOT
公开(公告)号：EP2096182A1
公开(公告)日：2009-09-02
申请号：EP06834703.8
申请日：2006-12-14
申请人： Nihon Superior Sha Co., Ltd
发明人： NISHIMURA, Tetsuro
IPC分类号： C22B25/06 , B23K3/08 , C22B7/00 , C22B9/10
CPC分类号： C22B25/08 , C22B9/10 , C22B15/006
摘要： An apparatus for depositing and separating excess copper dissolved in molten lead-free solder containing tin as the main element is provided. An apparatus 1 deposits excess copper in the molten lead-free solder as an intermetallic compound and separates it from the molten solder. The apparatus includes a deposition bath 2 for causing an intermetallic compound in the molten solder, a metal added from the outside and copper in the molten solder to be deposited, a granulation bath 4 including plates 31 32 and 33 for allowing the molten solder to pass through the plates to merge the intermetallic compounds into particles having a larger diameter, and a separation bath 5 for causing the enlarged intermetallic compounds to precipitate and separate in the molten solder.
摘要翻译：提供一种用于沉积和分离溶解在含有锡的熔融无铅焊料中的多余铜作为主要元件的装置。装置1将作为金属间化合物的熔融无铅焊料中的多余的铜沉积在熔融的无铅焊料中，并将其与熔融的焊料分离。该装置包括用于在熔融焊料中引起金属间化合物的沉积槽2，从外部添加的金属和待沉积的熔融焊料中的铜，包括用于允许熔融焊料通过的板31,32和33的造粒槽4 通过板将金属间化合物合并成具有较大直径的颗粒;以及分离槽5，用于使扩大的金属间化合物沉淀并在熔融焊料中分离。

50. 发明公开

EP1911543A4 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH 有权
标题翻译：无铅很多关于用于控制焊浴浓度与CU-NI浓度的另外供给和方法
公开(公告)号：EP1911543A4
公开(公告)日：2009-06-17
申请号：EP06781247
申请日：2006-07-19
申请人： NIHON SUPERIOR SHA CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , B23K1/08 , B23K101/38 , C22C13/00 , H05K3/24 , H05K3/34
CPC分类号： B23K1/08 , B23K1/0016 , B23K35/262 , B23K2201/42 , C22C13/00 , H05K3/3463 , H05K3/3468
摘要： Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.

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