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41. 发明授权

US5551626A Diffusion joining method and a paste used therefor 失效
标题翻译：扩散接合方法和用于其的糊状物
公开(公告)号：US5551626A
公开(公告)日：1996-09-03
申请号：US394482
申请日：1995-02-27
申请人： Yo Hasegawa , Masahiro Nagasawa , Masahide Tsukamoto
发明人： Yo Hasegawa , Masahiro Nagasawa , Masahide Tsukamoto
IPC分类号： B23K20/16 , B23K35/00 , B23K35/02 , H05K1/09 , H05K3/40 , H05K3/46 , H05K3/34
CPC分类号： B23K20/16 , B23K35/007 , H05K3/4069 , B23K2201/36 , B23K35/025 , H05K1/095 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623
摘要： The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170.degree. C. more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.
摘要翻译：本发明涉及Cu或Cu合金表面的扩散接合方法及其用途的导电糊，特别适用于制备多层印刷线路板的方法。本发明的特征在于，使接触表面具有选自贵金属薄层，金属氧化物去除层和主要由Cu或Cu合金颗粒和金属氧化物去除剂组成的导电浆料层的层; 并且在Cu或Cu合金表面的接合处的Cu原子变得能够扩散的情况下，或多或少地在高于170℃的温度下压接接触的金属表面，从而形成接合的金属体。

42. 发明授权

US5436503A Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US5436503A
公开(公告)日：1995-07-25
申请号：US153108
申请日：1993-11-17
申请人： Yoshinobu Kunitomo , Makoto Nozu , Yasuyuki Sakashita , Masahide Tsukamoto , Seiichi Nakatani , Keiji Saeki , Yoshifumi Kitayama
发明人： Yoshinobu Kunitomo , Makoto Nozu , Yasuyuki Sakashita , Masahide Tsukamoto , Seiichi Nakatani , Keiji Saeki , Yoshifumi Kitayama
IPC分类号： H01L21/56 , H01L21/60 , H01L23/13 , H01L23/29 , H01L23/485 , H01L23/48 , H01L29/41 , H01L29/47
CPC分类号： H01L24/83 , H01L21/563 , H01L23/13 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/29386 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2224/92125 , H01L2224/92247 , H01L24/45 , H01L24/48 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/16152 , H01L2924/351
摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
摘要翻译：绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。在绝缘基板上设置半导体芯片。半导体芯片的下表面形成有凸块电极。用于凸块连接的电极通过导电粘合剂电连接到凸块电极。半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

43. 发明授权

US5346750A Porous substrate and conductive ink filled vias for printed circuits 失效
标题翻译：用于印刷电路的多孔基材和导电油墨填充通孔
公开(公告)号：US5346750A
公开(公告)日：1994-09-13
申请号：US57972
申请日：1993-05-06
申请人： Akihito Hatakeyama , Hiroshi Sogo , Tamao Kojima , Yasuhiko Horio , Masahide Tsukamoto , Yasushi Fukumura
发明人： Akihito Hatakeyama , Hiroshi Sogo , Tamao Kojima , Yasuhiko Horio , Masahide Tsukamoto , Yasushi Fukumura
IPC分类号： H05K1/03 , H05K1/11 , H05K3/22 , H05K3/28 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H05K3/4069 , H05K2201/0116 , H05K2201/0269 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/28 , H05K3/4623 , Y10S428/901 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.
摘要翻译：一种印刷电路用有机基板的制造方法，其特征在于，包括在设置有覆盖膜（1）并具有压缩收缩率的多孔原料（2）中形成贯通孔（3）的步骤，填充导电浆料 4）插入到通孔（3）中，将覆盖膜（1）与填充有导电膏（4）的多孔原料（2）分离在通孔（3）中，施加金属箔（5））到已经分离了覆盖膜（1）的多孔原料（2）的表面上，并且通过加热和加压压缩施加有金属箔（5）的多孔原料（2）导电浆料中的导电物质被连接用于金属箔之间的电连接。

44. 发明授权

US5312643A Method of producing a transparent conductive film provided with supplementary metal lines 失效
标题翻译：制造具有辅助金属线的透明导电膜的方法
公开(公告)号：US5312643A
公开(公告)日：1994-05-17
申请号：US795022
申请日：1991-11-20
申请人： Osamu Yamamoto , Kouji Nishimura , Akira Isomi , Masahide Tsukamoto
发明人： Osamu Yamamoto , Kouji Nishimura , Akira Isomi , Masahide Tsukamoto
IPC分类号： B41M3/00 , C23C14/08 , G02F1/1343 , G09F9/30 , H05K1/09 , H05K3/12 , H05K3/24 , B05D5/12 , C23C14/00
CPC分类号： B41M3/003 , C23C14/086 , G02F1/13439 , H05K1/092 , H05K3/12 , H05K3/244
摘要： A method of producing a transparent conductive film provided with supplementary metal lines, comprises the steps of forming a transparent conductive film composed mainly of indium oxide, tin oxide, or antimony oxide on a transparent substrate and forming metal lines through printing on the transparent conductive film by an intaglio or litho offset printing procedure a line pattern of metallorganic ink composed mainly of an organic noble metal containing gold, silver, or platinum and baking it for metallization.
摘要翻译：一种制造具有辅助金属线的透明导电膜的方法，包括以下步骤：在透明基板上形成主要由氧化铟，氧化锡或氧化锑构成的透明导电膜，并通过印刷在透明导电膜上形成金属线通过凹版或光刻胶版印刷方法，主要由含有金，银或铂的有机贵金属组成的金属有机油墨的线图案，并将其烧成金属化。

45. 发明授权

US5229167A Method of forming a film pattern on a substrate 失效
标题翻译：在基板上形成薄膜图案的方法
公开(公告)号：US5229167A
公开(公告)日：1993-07-20
申请号：US500246
申请日：1990-03-27
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H05K3/02 , G02F1/1343 , G03F7/004 , H05K1/09 , H05K3/04
CPC分类号： H05K3/048 , G02F1/13439 , G03F7/0047
摘要： A film pattern of a desired material is formed on a substrate by forming a pattern of powder of inorganic material on the substrate, forming at least a single layer of film of desired material on the substrate on which the pattern of the powder of inorganic material is formed so that a part of the film of the desired material is formed on at least a part of the pattern of the powder of inorganic material, and mechanically removing the pattern film of the powder of inorganic material together with a part of the film of the desired material formed thereon.

46. 发明授权

US4016094A Electro-optical device 失效
标题翻译：电光装置
公开(公告)号：US4016094A
公开(公告)日：1977-04-05
申请号：US559394
申请日：1975-03-17
申请人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
发明人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
IPC分类号： C09K19/26 , C09K19/42 , G02F1/16 , C09K3/34 , G02F1/13
CPC分类号： C09K19/26 , C09K19/42
摘要： An electro-optical device using a liquid crystal consisting of 99.9 to 30 wt.% of at least one nematic liquid crystal and 0.1 to 70 wt. % of at least one optically active liquid crystal compound, (+)-p-alkoxy-p'-(2-methylbutyl)azoxybenzene. Such a device has a better display performance than similar devices because the mixture has a threshold voltage and a rapid response to an electric signal applied to the device, and so it is very practical for a matrix display device.
摘要翻译：使用由99.9〜30重量％的至少一种向列型液晶组成的液晶和0.1〜70重量％％的至少一种光学活性液晶化合物，（+） - 对 - 烷氧基-P' - （2-甲基丁基）氧化苯。这种装置具有比类似装置更好的显示性能，因为混合物具有阈值电压和对施加到装置的电信号的快速响应，因此对于矩阵显示装置是非常实用的。

47. 发明授权

US3973830A Electro-optic device 失效
标题翻译：电光装置
公开(公告)号：US3973830A
公开(公告)日：1976-08-10
申请号：US570961
申请日：1975-04-23
申请人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
发明人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
IPC分类号： C09K19/58 , G02F1/13 , C09K3/34
CPC分类号： C09K19/58 , C09K19/586
摘要： The present invention provides an improved electrooptical device having a cell for containing a liquid crystal and consisting of two light-transparent plates opposed to each other and having electrically conductive electrodes on the inner surfaces thereof, the electrodes on at least one inner surface being transparent, and spacer means between said opposed electrodes; and a power supply coupled to said electrodes for applying an electric voltage to said electrodes, whereas the improvement comprises a liquid crystal in said cell between said electrodes consisting of 99.95 to 65 wt.% of at least one nematic liquid crystal and 0.05 to 35 wt.% of at least one optically active compound of the formula; ##SPC1##Wherein X is CH=N, --N=N--or ##EQU1##
摘要翻译：本发明提供了一种改进的电光装置，其具有用于容纳液晶的单元，并且由彼此相对的两个透光板组成，并且在其内表面上具有导电电极，至少一个内表面上的电极是透明的，和在所述相对电极之间的隔离装置; 以及耦合到所述电极的电源，用于向所述电极施加电压，而改进包括在所述电极之间的所述电极中的液晶由99.95至65重量％的至少一个向列型液晶和0.05至35重量％％的至少一种下式的光学活性化合物; 其中X是CH = N，-N = N - 或-N = N-＆Darr＆O。

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