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41. 发明申请

US20090119917A1 IMAGE DRUM AND MANUFACTURING METHOD THEREOF 失效
标题翻译：图像鼓及其制造方法
公开(公告)号：US20090119917A1
公开(公告)日：2009-05-14
申请号：US12133414
申请日：2008-06-05
申请人： Eung-yeoul YOON , Kae-dong BACK , Kyu-ho SHIN , Jin-seung CHOI
发明人： Eung-yeoul YOON , Kae-dong BACK , Kyu-ho SHIN , Jin-seung CHOI
IPC分类号： H01B19/00
CPC分类号： G03G15/32 , G03G15/751 , Y10T29/49002 , Y10T29/49139 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , Y10T29/49174 , Y10T29/49227
摘要： A method of manufacturing an image drum includes fixing a control circuit board inside the drum body using a fixing member so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer by applying a sensitizer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed using photolithography processing, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts by applying a fluent conductive substance to the external surface of the drum body comprising the electrode forming grooves thereon, and by filling the electrode forming grooves with the fluent conductive substance by capillary force.
摘要翻译：一种制造图像鼓的方法包括：使用固定构件将控制电路板固定在鼓本体内部，使得控制电路板的多个端子位于纵向形成在鼓体上的槽中，通过施加形成绝缘层对鼓体的整个外表面进行敏化剂，通过使用光刻处理去除形成控制电路板的端子的绝缘层的部分，形成连接部分，在外部形成包括绝缘层作为基底的电极形成槽鼓体的表面包括其上的连接部分，并且通过将流体导电物质施加到滚筒的外表面上，分别通过连接部分形成多个环形电极以分别连接到多个端子中的相应端子其上包括电极形成槽，并且通过填充电极形式通过毛细管力与流动的导电物质的沟槽。

42. 发明申请

US20070137776A1 Image drum and method for manufacturing the image drum 有权
标题翻译：图像鼓和制造图像鼓的方法
公开(公告)号：US20070137776A1
公开(公告)日：2007-06-21
申请号：US11447256
申请日：2006-06-06
申请人： Kae Dong Back , Ki Deok Bae , Chang Youl Moon , Kyu Ho Shin , Soon Cheol Kweon , Won Kyoung Choi , Chang Seung Lee
发明人： Kae Dong Back , Ki Deok Bae , Chang Youl Moon , Kyu Ho Shin , Soon Cheol Kweon , Won Kyoung Choi , Chang Seung Lee
IPC分类号： B29C47/00 , B32B37/15
CPC分类号： G03G15/348 , G03G2217/0075 , Y10T29/49117 , Y10T29/49155
摘要： An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.
摘要翻译：一种图像鼓制造方法，包括：提供一种中空圆柱形模具，其具有在其内周面中周向切割的多个模具槽和具有比所述模具的中空部小的直径的芯部，并且具有狭缝状的组合槽; 将导电材料填充到模具的模具槽中; 插入用于单独向芯部的组合槽中的每个端子施加电压的控制单元，使得与导电材料相对应的导电图案部分地露出; 将芯部插入模具中，使得导电图案对应于填充到每个模具槽中的导电材料; 以及通过将熔融塑料填充到模具和芯部之间的空间中，形成与控制单元和导电材料一体形成的鼓体。

43. 发明申请

US20070029570A1 LED package and method for fabricating the same 审中-公开
标题翻译： LED封装及其制造方法
公开(公告)号：US20070029570A1
公开(公告)日：2007-02-08
申请号：US11407276
申请日：2006-04-20
申请人： Su-ho Shin , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Jin-seung Choi
发明人： Su-ho Shin , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Jin-seung Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An LED package comprises: a package body having therein a LED receiving part including a reflecting surface; an LED mounted within the LED receiving part; a lead mounted within the package body such that first and second ends of the lead are exposed to the outside of the package body. The lead includes first and second conductive parts which are electrically connected to the LED and a non-conductive part which insulates the first and second conductive parts from each other.
摘要翻译：一种LED封装，包括：封装体，其中具有包括反射表面的LED接收部分; 安装在LED接收部件内的LED; 引线，其安装在封装主体内，使得引线的第一和第二端暴露于封装主体的外部。引线包括电连接到LED的第一和第二导电部分和使第一和第二导电部彼此绝缘的非导电部分。

44. 发明授权

US06729150B2 Method of controlling multi-compartment type kimchi refrigerator 失效
标题翻译：多室型泡菜冰箱控制方法
公开(公告)号：US06729150B2
公开(公告)日：2004-05-04
申请号：US10317070
申请日：2002-12-12
申请人： Kyu-Ho Shin , Sung-Ho Cho , Woo-Yeol Yoo
发明人： Kyu-Ho Shin , Sung-Ho Cho , Woo-Yeol Yoo
IPC分类号： F25B500
CPC分类号： F25D11/022 , F25B5/02 , F25B41/04 , F25B2600/2511 , F25B2600/2519 , F25D29/00 , F25D2400/04 , F25D2700/12
摘要： A method of controlling a multi-compartment type kimchi refrigerator having a plurality of evaporators which are mounted in respective storage compartments to refrigerate the storage compartments, a compressor which supplies the evaporators with refrigerant, and valves which are mounted in inlet sides of the evaporators, respectively, to be selectively opened and closed on the basis of temperatures of the storage compartments. The method includes selectively opening or closing the valves in priority order of operations of the valves in response to a signal to supply the refrigerant to two or more of the evaporators.
摘要翻译：一种控制多室型泡菜冰箱的方法，所述多室型泡菜冰箱具有多个蒸发器，所述多个蒸发器安装在各自的储藏室中以冷藏所述储藏室，将所述蒸发器供应制冷剂的压缩机以及安装在所述蒸发器的入口侧的阀，分别基于存储隔间的温度选择性地打开和关闭。该方法包括响应于将制冷剂供应到两个或更多个蒸发器的信号，以阀的操作的优先顺序选择性地打开或关闭阀。

45. 发明授权

US08893531B2 Washing machine 有权
标题翻译：洗衣机
公开(公告)号：US08893531B2
公开(公告)日：2014-11-25
申请号：US13337739
申请日：2011-12-27
申请人： Il Jun Mun , Eung Yeoul Yoon , Kyu Ho Shin , Kwang Hyok Park
发明人： Il Jun Mun , Eung Yeoul Yoon , Kyu Ho Shin , Kwang Hyok Park
IPC分类号： D06F39/02 , D06F39/08
CPC分类号： D06F39/02
摘要： A washing machine including a detergent feeding device to feed detergent. The detergent feeding device includes a detergent housing having an open front side, a detergent receiving case installed to the detergent housing to move through the open front side of the detergent housing, and a water supply guide unit placed on the detergent housing to guide water into the detergent receiving case inserted into the detergent housing. The detergent receiving case includes at least one support roller supported in a rolling manner on a lower surface of the water supply guide unit, and an auxiliary support member located forward of the support roller to be supported in contact with a bottom surface of the detergent housing as the detergent receiving case is withdrawn. The support roller and the auxiliary support member may prevent vertical movement of the detergent receiving case during withdrawal or insertion of the detergent receiving case.
摘要翻译：一种洗衣机，包括用于进料洗涤剂的洗涤剂供给装置。洗涤剂供给装置包括具有开放前侧的洗涤剂壳体，安装在洗涤剂壳体上以移动通过洗涤剂壳体的敞开前侧的洗涤剂容纳壳体，以及放置在洗涤剂壳体上以将水引导到洗涤剂容纳盒插入洗涤剂壳体中。洗涤剂容纳壳体包括至少一个以滚动方式支撑在支撑辊的下表面上的支撑辊，以及辅助支撑构件，其位于支撑辊的前方，以支撑与洗涤剂壳体的底面接触因为洗涤剂接收盒被取出。支撑辊和辅助支撑构件可以在洗涤剂接收壳体的抽出或插入期间防止洗涤剂接收壳体的垂直移动。

46. 发明授权

US08366944B2 Image drum and fabricating method thereof 有权
标题翻译：图像鼓及其制造方法
公开(公告)号：US08366944B2
公开(公告)日：2013-02-05
申请号：US12143926
申请日：2008-06-23
申请人： Jin-seung Choi , Eung-yeoul Yoon , Kyu-ho Shin
发明人： Jin-seung Choi , Eung-yeoul Yoon , Kyu-ho Shin
IPC分类号： H01B13/00 , B44C1/22
CPC分类号： C23F1/02 , G03G15/342 , G03G15/751 , Y10T29/49169 , Y10T29/49227
摘要： A method of fabricating an image drum includes preparing a hollow drum body having a slot extending in a longitudinal direction, preparing a printed circuit board (PCB) having a plurality of board terminals, mounting the PCB inside the hollow drum body with a fixing member such that the board terminals of the PCB are placed in the slot of the hollow drum body, coating a first insulating layer on an outer circumference of the hollow drum body, forming a plurality of ring electrodes on the first insulating layer corresponding to the board terminals of the PCB, in which a portion of ring electrodes which corresponds to the board terminals of the PCB is non-continuous, exposing the board terminals below non-continuous area of the ring electrodes by etching the first insulating layer with the ring electrodes as an etching mask, and forming a connecting electrode to electrically connect the board terminals to the ring electrodes.
摘要翻译：一种制造图象鼓的方法包括制备具有沿纵向方向延伸的狭缝的中空鼓体，制备具有多个基板端子的印刷电路板（PCB），将印刷电路板安装在中空鼓主体内，固定部件如 PCB的基板端子被放置在中空鼓体的槽中，在中空鼓体的外周上涂覆第一绝缘层，在与第一绝缘层相对应的第一绝缘层上形成多个环形电极其中对应于PCB的板端子的一部分环形电极不连续的PCB通过用环形电极蚀刻第一绝缘层作为蚀刻而将电路板端子暴露在环形电极的非连续区域下方掩模，并形成连接电极以将电路板端子电连接到环形电极。

47. 发明授权

US08334585B2 LED package and fabrication method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08334585B2
公开(公告)日：2012-12-18
申请号：US13077186
申请日：2011-03-31
申请人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
发明人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
IPC分类号： H01L23/495
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译：提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。保护盖包围并保护上下金属板的暴露表面。

48. 发明授权

US08162471B2 Image forming element and manufacturing method thereof 有权
标题翻译：图像形成元件及其制造方法
公开(公告)号：US08162471B2
公开(公告)日：2012-04-24
申请号：US11783973
申请日：2007-04-13
申请人： Su Ho Shin , Kyu Ho Shin , Chang Youl Moon , Eung Yeoul Yoon , Jin Seung Choi , Ki Hwan Kwon
发明人： Su Ho Shin , Kyu Ho Shin , Chang Youl Moon , Eung Yeoul Yoon , Jin Seung Choi , Ki Hwan Kwon
IPC分类号： B41J2/01
CPC分类号： G03G15/348 , G03G2217/0075
摘要： An image forming element includes an image drum including a plurality of ring electrodes and a slot. The plurality of ring electrodes are formed to be spaced apart from one another on a circumference of the image drum. The slot is formed in a longitudinal direction on the image drum. A connecting member includes a plurality of connecting electrodes and is disposed inside the image drum so that an end of the connecting member is received in the slot. The connecting electrodes are electrically connected with the ring electrodes one to one on the same line.
摘要翻译：图像形成元件包括包括多个环形电极和狭槽的图像鼓。多个环形电极形成为在图像鼓的圆周上彼此间隔开。狭槽在图像鼓上沿纵向方向形成。连接构件包括多个连接电极，并且设置在图像鼓内部，使得连接构件的端部容纳在狭槽中。连接电极在同一条线上一对一地与环形电极电连接。

49. 发明申请

US20110175132A1 LED PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US20110175132A1
公开(公告)日：2011-07-21
申请号：US13077186
申请日：2011-03-31
申请人： Ki-hwan KWON , Kyu-ho SHIN , Soon-cheol KWEON , Chang-youl MOON , Arthur DARBINIAN , Seung-tae CHOI , Su-ho SHIN
发明人： Ki-hwan KWON , Kyu-ho SHIN , Soon-cheol KWEON , Chang-youl MOON , Arthur DARBINIAN , Seung-tae CHOI , Su-ho SHIN
IPC分类号： H01L33/58 , H01L33/62
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译：提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。保护盖包围并保护上下金属板的暴露表面。

50. 发明授权

US07910389B2 Vertical semiconductor light-emitting device and method of manufacturing the same 失效
标题翻译：垂直半导体发光器件及其制造方法
公开(公告)号：US07910389B2
公开(公告)日：2011-03-22
申请号：US12216015
申请日：2008-06-27
申请人： Hyun-Soo Kim , Kyu-Ho Shin , Jae-Hee Cho
发明人： Hyun-Soo Kim , Kyu-Ho Shin , Jae-Hee Cho
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , B82Y20/00 , H01S5/0217 , H01S5/183 , H01S5/34333
摘要： Provided is a vertical semiconductor light-emitting device and a method of manufacturing the same. The method may include sequentially forming a lower clad layer, an active layer, and an upper clad layer on a substrate to form a semiconductor layer and forming first electrode layers on the upper clad layer. A metal support layer may be formed on each of the first electrode layers and a trench may be formed between the first electrode layers. The substrate may be removed and a second electrode layer may be formed on the lower clad layer.
摘要翻译：提供了一种垂直半导体发光器件及其制造方法。该方法可以包括在衬底上顺序地形成下覆盖层，有源层和上覆盖层，以形成半导体层，并在上覆盖层上形成第一电极层。可以在每个第一电极层上形成金属支撑层，并且可以在第一电极层之间形成沟槽。可以去除衬底，并且可以在下包层上形成第二电极层。

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