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41. 发明授权

US06642627B2 Semiconductor chip having bond pads and multi-chip package 有权
公开(公告)号：US06642627B2
公开(公告)日：2003-11-04
申请号：US10192800
申请日：2002-07-09
申请人： Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
发明人： Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
IPC分类号： H01L2348
CPC分类号： H01L24/05 , H01L23/3128 , H01L23/4951 , H01L23/49575 , H01L23/525 , H01L23/5389 , H01L24/03 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/0231 , H01L2224/0401 , H01L2224/04042 , H01L2224/05082 , H01L2224/05116 , H01L2224/05118 , H01L2224/05155 , H01L2224/0516 , H01L2224/05554 , H01L2224/05556 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05669 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/4826 , H01L2224/48463 , H01L2224/48471 , H01L2224/49113 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06555 , H01L2225/06558 , H01L2225/06575 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/10161 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

42. 发明授权

US06445077B1 Semiconductor chip package 失效
标题翻译：半导体芯片封装
公开(公告)号：US06445077B1
公开(公告)日：2002-09-03
申请号：US09886524
申请日：2001-06-20
申请人： Ill Heung Choi , Young Hee Song
发明人： Ill Heung Choi , Young Hee Song
IPC分类号： H01L2940
CPC分类号： H01L23/4951 , H01L23/3107 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49171 , H01L2224/49175 , H01L2224/73215 , H01L2224/92147 , H01L2924/00014 , H01L2924/01005 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor chip package includes a semiconductor chip and a substrate on which the semiconductor chip attaches. The semiconductor chip includes center and edge bonding pads. The substrate includes a first window that exposes the center bonding pads, a second window that exposes the edge bonding pads, connection pads around the first and second windows, external terminal pads, and a wiring pattern. The semiconductor chip package further includes bonding wires, an encapsulation body, and external terminals. The bonding wires connect the center and edge bonding pads of the semiconductor chip to the connection pads of the substrate. A method for manufacturing a semiconductor chip package includes: preparing a semiconductor chip having center and edge bonding pads and a substrate, which includes a first window, a second window, connection pads, external terminal pads, and a wiring pattern; attaching the semiconductor chip on the substrate such that the first window exposes the center bonding pads and the second window exposes the edge bonding pads; connecting the first and second bonding pads to corresponding connection pads; encapsulating side surfaces of the semiconductor chip, a portion of the bottom surface of the substrate, the bonding wires, and the connection pads; and forming external terminals on the external terminal pads of the substrate. The encapsulating includes a first encapsulation of the side surfaces of the semiconductor chip and a portion of the bottom surface of the substrate and a second encapsulation of the bonding wires and the connection pads.
摘要翻译：半导体芯片封装包括半导体芯片和半导体芯片所附接的基板。半导体芯片包括中心和边缘焊盘。衬底包括暴露中心接合焊盘的第一窗口，暴露边缘接合焊盘的第二窗口，围绕第一和第二窗口的连接焊盘，外部端子焊盘和布线图案。半导体芯片封装还包括接合线，封装体和外部端子。接合线将半导体芯片的中心和边缘焊盘连接到基板的连接焊盘。一种制造半导体芯片封装的方法，包括：制备具有中心和边缘焊盘的衬底和包括第一窗口，第二窗口，连接焊盘，外部端子焊盘和布线图案的衬底的半导体芯片; 将所述半导体芯片附接在所述基板上，使得所述第一窗口暴露所述中心接合焊盘，并且所述第二窗口暴露所述边缘焊盘; 将第一和第二接合焊盘连接到相应的连接焊盘; 封装半导体芯片的侧表面，衬底的底表面的一部分，接合线和连接焊盘; 以及在所述基板的外部端子焊盘上形成外部端子。封装包括半导体芯片的侧表面和衬底的底表面的一部分的第一封装以及接合线和连接焊盘的第二封装。

43. 发明授权

US06230080B1 Monitoring system and monitoring method for a clean room regulating system 失效
标题翻译：洁净室调节系统的监控系统和监控方法
公开(公告)号：US06230080B1
公开(公告)日：2001-05-08
申请号：US09066107
申请日：1998-04-24
申请人： Jung-sun Lee , Ki-hwan Lim , Yo-han An , Jae-heung Choi
发明人： Jung-sun Lee , Ki-hwan Lim , Yo-han An , Jae-heung Choi
IPC分类号： G06F1300
CPC分类号： G01N1/24 , G01N1/26 , G01N2015/1486
摘要： A monitoring system and method for monitoring a clean room regulating system. The monitoring system includes a particle counter with a pump having a pumping state for pumping a fluid containing particles. The particle counter produces an analog particle signal indicative of an amount of particles detected. The particle counter also produces a pump-state signal corresponding to the pumping state. A signal processor is included for converting the analog particle signal into a first digital signal, for converting the pump-state signal into an analog pumping signal, and for converting the analog pumping signal into a second digital signal. A host computer is included for receiving the first digital signal and deriving the amount of particles detected, for receiving the second digital signal and deriving the pumping state, and for monitoring the pumping state and the amount of particles counted. The system includes a communication channel for transferring the first digital signal and the second digital signal from the signal processor to the host computer.
摘要翻译：一种用于监控洁净室调节系统的监测系统和方法。监测系统包括具有泵的颗粒计数器，泵具有用于泵送含有颗粒的流体的泵送状态。颗粒计数器产生指示检测到的颗粒量的模拟颗粒信号。颗粒计数器还产生对应于泵送状态的泵状态信号。包括信号处理器，用于将模拟粒子信号转换为第一数字信号，用于将泵状态信号转换为模拟泵浦信号，并将模拟泵浦信号转换为第二数字信号。包括主计算机用于接收第一数字信号并导出检测到的粒子量，用于接收第二数字信号并导出泵送状态，并用于监视泵送状态和计数的粒子量。该系统包括用于将第一数字信号和第二数字信号从信号处理器传送到主计算机的通信信道。

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